A component carrier includes a first level stack of first plural of electrically conductive layer structures and/or first electrically insulating layer structures; a first component aligned within a first through hole cut out in the first level stack such that one of an upper or a lower surface of the first component is substantially flush with an respective upper or a lower surface of the first level stack second electrically conductive layer structures and/or second electrically insulating layer structures attached onto the upper and the lower surface of the first level stack thereby covering the first component at the upper and the lower surface of the first component and pressed to form a second level stack. A second component is aligned within a second through hole cut out in the second level stack such that one of upper or a lower surface of the second component is substantially flush with an upper or a lower surface of the second level stack.

A printed circuit board includes additional stitching vias placed at strategic location within a connection matrix, which provides additional isolation and further accommodates high-speed communication capabilities. The stitching vias have a variable length or depth, depending on related structures within the circuit board, so as to avoid any interference with underlining escape routing, or alternative signal transmission structures. More specifically, these stitching vias help to eliminate cross-talk in the via field caused by the close proximity of signal carrying structures. Further, differential signal communication is better accommodated based upon this reduction in cross-talk.

A connector with contact tails configured to provide a connector footprint enabling a low cost printed circuit board. The contact tails are positioned to leave routing channels, parallel to an edge of a printed circuit board, within the connector footprint. The routing channels may enable routing of high speed signal traces out of the connector footprint on a small number of routing layers. In a connector with 16 columns, each with 8 pairs of signal traces, two routing layers may be adequate to route traces connecting all of the signal vias in the connector footprint to components at the interior of the printed circuit board.

Space transformation technology for probe cards at sort is disclosed. In one example, a space transformer transforms a pitch of electrical contacts from a first distribution to a second distribution. The space transformer comprises a substrate with opposite first and second sides; and vias extending through the substrate between the first and second sides and oriented at different angles with respect to one another. In one example, a tester system or probe card for a die comprises a printed circuit board (PCB) with pads having a pad pitch; and a space transformer operatively coupled to the PCB, and having vias extending from the pads of the PCB through the space transformer at different angles with respect to one another and configured to electrically connect to contacts on the die having a contact pitch different than the pad pitch.

The present disclosure provides a printed circuit board including a plurality of conductive layers separated by insulating medium and a plurality of connection structures. Each connection structure penetrates each of the conductive layers. The plurality of conductive layers comprises a first conductive layer in which first signal lines are located and a second conductive layer in which second signal lines are located, and the first and second signal lines are connected via the connection structures. Anti-pads surrounding the connection structures are provided on others of the plurality of conductive layers except the first and the second conductive layers. For a same connection structure, the anti-pads surrounding the connection structure include adjacent anti-pads and nonadjacent anti-pads. Size of the adjacent anti-pads in any direction parallel to the conductive layers is smaller than that of the nonadjacent anti-pads. The present disclosure also provides a display apparatus.

The present invention provides a printed circuit board comprising: a dielectric layer (130) ; N pairs of differential signal vias (2) which penetrate through the dielectric layer wherein N is an integer more than one; N pairs of first strip conductors (101,102) disposed on a first surface of the dielectric layer; a first ground conductor layer (103) disposed in the dielectric layer forming N first differential transmission lines (100) with the N pairs of first strip conductors and the dielectric layer; N pairs of second strip conductors (111,112) disposed on a second surface of the dielectric layer; a second ground conductor layer (113) disposed in the dielectric layer forming N of second differential transmission lines (110) with the N pairs of second strip conductors and the dielectric layer.

An assembly of a printed circuit board and a card edge connector for interconnecting a memory module card is provided. The assembly includes a card edge connector and a printed circuit board for receiving the card edge connector. The card edge connector has an insulated housing and a plurality of terminals that are divided into an upper-row terminal group and a lower-row terminal group. The insulated housing has an elongated slot formed along a longitudinal direction. Each terminal group includes a first terminal, a second terminal and a third terminal. The printed circuit board has grounding via holes and plated through holes which are formed at two sides of the orthographic projection of the elongated slot. The high-frequency signal holes are separated by grounding traces or the grounding via holes, so as to provide good shielding effect for avoiding cross-talk interference.

A signal processing board includes a six-layer substrate. A plurality of signal transmission planes are formed in a first layer, a third layer, a fourth layer, and a sixth layer. A first ground plane is formed in a second layer. A first power supply plane is formed in a fifth layer and electrically connected to the first semiconductor element. A second power supply plane is formed in the fifth layer and electrically connected to the second semiconductor element. A second ground plane is formed in the fifth layer. A first bypass capacitor is electrically connected to the first power supply plane and the second ground plane. A second bypass capacitor is electrically connected to the second power supply plane and the second ground plane.

There is provided a printed wiring board including an outermost conductive layer that includes a plurality of conductive pads, a first conductive layer that includes a first inner-layer wiring and is stacked on the conductive layer, a second conductive layer that includes a second inner-layer wiring and is stacked on the conductive layer and the first conductive layer, a first signal via that connects one of the conductive pads and the first inner-layer wiring with each other, a second signal via connecting another one of the conductive pads and the second inner-layer wiring with each other, and a stitching via that is connected to a ground. The first inner-layer wiring and the second inner-layer wiring form a common wiring route in which the first inner-layer wiring and the second inner-layer wiring are stacked and disposed in a connection area in which the conductive pads are arranged.

Substrates with continuous slot vias are disclosed herein. In one embodiment, a substrate comprises a first design layer, a second design layer, and an intermediary layer between the first and second design layers. The substrate further includes first and second signaling vias extending vertically through the intermediary layer between the first and second design layers. The first and second signaling vias route first and second data signals, respectively, between the first and second design layers. The substrate further includes a slot via that is positioned between the first and second signaling vias within the intermediary layer and extends laterally within the intermediary layer along a path that passes between the first signaling via and the second signaling via. The slot via can have a continuous shape such that the slot via shields the first and second data signals on the first and second signaling vias from crosstalk with one another.