A PCB having a first surface and a second surface includes a trench extending through the PCB, a plurality of conductive traces on one or more sidewalls of the trench. The plurality of conductive traces extends through the PCB and may be arranged in pairs across from one another along at least a portion of the length of the trench. A first set of conductive contacts are arranged in a first zig-zag pattern around a perimeter of the trench. A second set of conductive contacts are arranged in a second zig-zag pattern around the perimeter of the trench. In some cases, the first and second zig-zag patterns are arranged with respect to one another around the perimeter of the trench in an alternating fashion. A chip package is also disclosed having a pin arrangement that couples to the corresponding arrangement of conductive contacts on the PCB.

A printed wiring board includes a main substrate and a rising substrate. A support portion of the rising substrate is inserted into a slit in the main substrate. In a direction in which a plurality of first electrodes are aligned, a width of each of the plurality of first electrodes is larger than a width of each of a plurality of second electrodes, and the width of each of the plurality of second electrodes is arranged to fit within the width of each of the plurality of first electrodes.

A printed circuit board assembly includes a first printed circuit board having a first surface and a second surface that is opposite the first surface and including a slit portion and a second printed circuit board having a third surface and a fourth surface that is opposite the third surface and including a first end portion and a second end portion that is opposite the first end portion. The first end portion is fitted in the slit portion in such a manner that a tip of the first end portion protrudes from the second surface. The first printed circuit board includes a plurality of first electrodes arranged along the slit portion in a longitudinal direction of the slit portion on the second surface. The second printed circuit board includes a plurality of second electrodes arranged in the first end portion on the third surface and the fourth surface, and the plurality of second electrodes are joined to the plurality of first electrodes with solder. The first printed circuit board further includes a support fixed to the first surface. The second printed circuit board is attached to the support by an adhesive substance.

Creating in-via routing with a light pipe is disclosed. A resist layer is applied over a layer of conductive material provided in a via. A light pipe is inserted into the via. The surface of the light pipe includes at least one masked portion and at least one unmasked portion. A portion of the resist layer is exposed with light emitted from the unmasked portions of the light pipe. Portions of the conductive layer corresponding to the exposed portion of the resist layer are then removed to create the in-via routing.

A printed wiring board of the present invention includes an insulating substrate layer; a first conductive layer laminated to one surface of the substrate layer; a second conductive layer laminated to another surface of the substrate layer; and a via hole formed along an inner surface of a connection hole that is provided, in a thickness direction, through the substrate layer and the first conductive layer, the via hole electrically coupling the first conductive layer and the second conductive layer. A cross-sectional shape of the connection hole along at least one surface of the substrate layer is an irregular shape.

The present invention provides a process and a structure of forming conductive vias using a light guide. In an exemplary embodiment, the process includes providing a via in a base material in a direction perpendicular to a plane of the base material, applying a photoresist layer to an interior surface of the via, inserting a light guide into the via, exposing, by the light guide, a portion of the photoresist layer to light, thereby resulting in an exposed portion of the photoresist layer and an unexposed portion of the photoresist layer, removing a portion of the photoresist layer, and plating an area of the via, where the photoresist has been removed, with a metal, thereby resulting in a portion of the via plated with metal and a portion of the via not plated with metal.

A coupled via structure includes a plate via penetrating through an board body and having first and second plates spaced apart from each other by a first gap distance, a contact pad connected to the plate via on a surface of the board body and having first and second contacts connected to the first and second plates, respectively, and a connection line connected to the contact pad on the surface of the board body and having first and second lines connected to the first and second contacts, respectively, and spaced apart from the first line by a second gap distance. Accordingly, the deviation of the characteristic impedance is reduced (or, alternatively, minimized) between the coupled via structure and the coupled signal line.

A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

The printed wiring board of the present disclosure includes: a plurality of insulating layers laminated in a thickness direction; a plurality of wiring conductors respectively correspondingly positioned between the plurality of insulating layers; a through hole penetrating the plurality of insulating layers and the plurality of wiring conductors in the thickness direction; and a through-hole conductor positioned on a wall surface of the through hole; each of the plurality of wiring conductors has a first surface facing the through hole, each of the plurality of insulating layers has a second surface facing the through hole, and the first surface is farther away from a central axis penetrating the through hole in the thickness direction than the second surface.

The present invention provides a method of fabricating an embedded circuit board, including: providing an inner laminated structure (10) which is a double-sided circuit board; providing a third circuit board (103) and a fourth circuit board (104), and respectively laminating them on two sides of the inner laminated structure (10); two spaced through holes (30) are formed in the structure obtained in the previous step; electroplating an outer surface of the third circuit board (103) and the fourth circuit board (104) and an inner surface of the through holes (30) to form a first plating layer (50); removing a structure between the two through holes (30) to form a slot (40) having the two through holes (30) at two ends; the electronic component (200) is received and fixed in a middle portion of the slot (40) such that electrodes (201) of the electronic component (200) are directed to the two ends of the slot (40) and electrically connect to the first plating layer (50); providing a first circuit board (101) and a second circuit board (102), respectively laminating them on two sides of the structure obtained in the previous step to embed the electronic component (200); performing surface treatment on the structure obtained in the previous step to obtain an embedded circuit board (100). The present invention also provides an embedded circuit board (100) fabricated by the above manufacturing method.