Apparatus for communicating across an isolation barrier. In one embodiment, the apparatus comprises a transformer having a first winding disposed on a first side of a printed circuit board (PCB) and coupled to a first local ground, and a second winding disposed on a second side of the PCB, the second side opposite to the first side, and coupled to a second local ground; a transmitter coupled to the first winding; and a receiver, coupled the second winding, that generates an output signal based on a signal received from the transmitter.

An object has a first conductor structure, an electronic unit, a second conductor structure galvanically isolated from the first conductor structure and/or from the electronic unit but coupleable electrically thereto, and a carrier structure with a first pliable carrier layer having a first carrier layer region and with a second carrier layer region. The carrier structure is a layer stack in a base surface region including at least part of the carrier structure base surface and includes at least the first and second carrier layer regions. At least part of the conductor structures is in the base surface region. The first conductor structure and/or the electronic unit is joined with the first carrier layer region. The second conductor structure is joined with the second carrier layer region and coupleable electrically to the first conductor structure and/or the electronic unit by a layer stack surface region outside the electronic unit.

A Q-enhanced radio-frequency filter featuring loss-compensating circuits with values that can be controlled to optimize loss compensation. Instabilities are avoided by temporarily introducing a reflection at a port (such as via short-circuiting the port) and testing for the beginning of oscillations. Certain embodiments provide negative-resistance circuits for loss compensation, including cross-coupled transistor pairs and adjustable capacitance. Further embodiments provide loss-compensating RF filters with planar inductors, including overlapping planar inductors.

The present disclosure provides a conductor arrangement for transmitting differential communication signals, the conductor arrangement includes a conductor carrier, a plurality of pairs of first conductors, two of the first conductors being electrically coupled together at their ends, and a plurality of pairs of second conductors, two of the second conductors being electrically coupled together at their ends, and wherein, as conductor bundles, in each case one of the first conductors of a pair and one of the second conductors of a pair are jointly arranged on a first side of the conductor carrier and the further first conductor of the respective pair and the further second conductor of the respective pair are arranged on a second side of the conductor carrier.

A substrate structure, a manufacturing method thereof, and an electronic device. The substrate structure includes a substrate, conductive wires and conductive members. Multiple through holes penetrate through the substrate body of the substrate. Multiple first conductive pads are arranged on the first surface of the substrate body. Multiple second conductive pads are arranged on the second surface of the substrate body. The conductive wires are accommodated in the through holes and each has a first end in the first opening of corresponding through hole and a second end in the second opening of corresponding through hole. The conductive members are distributed on the first and second surfaces, and both ends thereof are connected to the corresponding first and second conductive pads through the conductive members. At least part of each conductive wire does not contact the hole wall of each through hole in a direct manner.

A manufacturing method of transformer circuit board includes following steps: plate stamping, forming a plurality of metal plates with a stamping mold; primary layering, layering the metal plates that are in alignment with each other between two outer insulation layers, with an inner insulation layer disposed between the two metal plates; primary pressing, hot pressing the metal plates to fix the metal plates between the two outer insulation layers; secondary layering, layering another metal plate on the outer side of the two outer insulation layers, respectively, corresponding to the positions of the previously layered metal plates; secondary pressing, hot pressing the metal plates on the outer side of the outer insulation layers, and printing to form a solder mask layer on the outer insulation layers. Finally, cutting to form a transformer circuit board with low leakage inductance and high EMI shield.

Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.

A multilayer printed circuit board (PCB) including a plurality of substrate layers formed in stack is provided. The multilayer printed circuit board includes a first substrate layer located on an outer side of the plurality of substrate layers, and a second substrate layer located on another outer side of the plurality of substrate layers that is opposite to the first substrate layer. The multilayer printed circuit board further includes a transmission line, connecting a first point of the first substrate layer and a second point of the second substrate layer, which passes through the first and second substrate layers, and includes a sub-transmission line disposed between and extended along at least two adjacent substrate layers among the plurality of substrate layers.

According to various embodiments of the present disclosure, an electronic device may include: a housing including a first plate and a second plate; a printed circuit board having a first surface and a second surface; and a communication circuit arranged inside the housing. The printed circuit board may include: a plurality of insulating layers laminated on each other between the first surface and the second surface; an antenna element arranged in a first region above the second surface of the printed circuit board or between a first pair of insulating layers of the printed circuit board, when seen from above the second surface of the printed circuit board; and a plurality of first electroconductive patterns arranged in a second region that at least surrounds one surface of the first region. Various embodiments may be possible.

An integrated circuit package comprising an encapsulant, a semiconductor die in the encapsulant the semiconductor die comprising a plurality of die terminals, an integrated waveguide launcher, wherein the integrated waveguide launcher is connected to one of the die terminals and a land grid array provided on a bottom surface of the package. The land grid array comprises a plurality of package terminals, each package terminal configured to be soldered to a printed circuit board, and an opening, wherein the opening is aligned with the integrated waveguide launcher.