A wiring body assembly includes: a first wiring body including a first insulating portion, a first lead wiring and a first terminal portion, the first lead wiring and the first terminal portion are disposed on a surface of the first insulating portion; a second wiring body including a second insulating portion, a second lead wiring and a second terminal portion, the second lead wiring and the second terminal portion are disposed on a surface of the second insulating portion that is oriented opposite to the surface of the first insulating portion; and a conductive adhering portion connecting the first terminal portion and the second terminal portion. The first wiring body and the second wiring body overlap each other so that the first terminal portion and the second terminal portion face each other through the conductive adhering portion.

A light-emitting module according to an embodiment includes a first insulating film with light transmissive property, a plurality of mesh patterns including a plurality of first line patterns and a plurality of second line patterns, a light-emitting element, and a resin layer. The first line patterns are formed on the first insulating film and are parallel to one another. The second line patterns intersect with the first line patterns and are parallel to one another. The light-emitting element is connected to any two of a plurality of the mesh patterns. The resin layer holds the light-emitting element to the first insulating film. A first mesh pattern and a second mesh pattern adjacent to one another among the plurality of mesh patterns have a boundary. Line patterns projecting from the first mesh pattern to the boundary and line patterns projecting from the second mesh pattern to the boundary are collocated along the boundary in a state of being adjacent to one another.

A flexible printed circuit board (PCB) includes a flexible first layer proximate to a flexible second layer. Conductive traces are arranged in the flexible first layer and coupled to a first circuit block at a first end of the flexible PCB and coupled to a second circuit block at a second end of the flexible PCB such that the first circuit block is coupled to the second circuit block through the conductive traces. Companion traces re arranged in the flexible second layer to provide a reference plane coupled to the first and second circuit blocks. The companion traces are arranged in the flexible second layer to be replicas of the conductive traces such that each one of the conductive traces is proximate to and aligned with a corresponding one of the companion traces along an entire length between the first and second circuit blocks.

According to one embodiment, a detection device includes a substrate, detection electrode, terminal formed of a metal material, lead, coating layer, conductive adhesion layer, and circuit board. The lead connects the electrode and the terminal. The coating layer covers the electrode and the lead, and partly covers the terminal. The adhesion layer covers a part of the terminal exposed from the coating layer and covers a part of the coating layer. The circuit board is connected to the terminal with the adhesion layer interposed therebetween. At least in an overlapping area where the adhesion layer covers the coating layer, an area of the metal material per unit area is smaller than that of the other area of the terminal.

The present disclosure provides a touch screen and a manufacturing method thereof, a display substrate, and a touch display device. The touch screen includes: at least one metal mesh layer and electrostatic leading lines, wherein each metal mesh layer includes a plurality of electrodes insulated from each other, and the electrostatic leading lines extend among the plurality of electrodes of the at least one metal mesh layer and are connected to grounding wires, wherein the electrostatic leading lines are arranged to be insulated from the plurality of electrodes.

Methods and structures are provided for implementing embedded wire repair for printed circuit board (PCB) constructs. A repair wire layer is provided within the PCB stack with reference planes on opposite sides of the repair wire layer. When a repair connection is required, an appropriate plated through hole (PTH) is drilled to form the repair connection using the repair wire layer.

In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern, a grid pattern, a directional pattern, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area.

Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.

In a method for making a flexible material, a sheet of graphene oxide-composite paper is subjected to an environment having a relative humidity above a predetermined threshold for a predetermined amount of time. At least one expansion cut is cut in the sheet of graphene oxide-composite paper. A flexible conductive material includes a sheet of graphene oxide-composite paper defining at least one cut passing therethrough and formed it a kirigami structure. A region of the sheet of graphene oxide-composite paper includes reduced graphene oxide.

Electrically conductive patterns formed on a substrate are provided with a reduced visibility. A region of a major surface of the substrate is selectively roughened to form a roughened pattern on the major surface of the substrate. Electrically conductive traces are directly formed on the roughened region and are conformal with the roughened pattern on the major surface of the substrate.