A semiconductor device and a method for manufacturing the semiconductor device. The semiconductor device includes an insulating substrate, a semiconductor chip, a plate member, and a cooler. The insulating substrate includes insulating ceramics serving as an insulating plate, and conductive plates provided on opposite surfaces of the insulating ceramics. The semiconductor chip is provided on an upper surface of the insulating substrate. The plate member is bonded to a lower surface of the insulating substrate. The cooler is bonded to a lower surface of the plate member. At least one of bonding between a lower surface of the insulating substrate and the plate member and bonding between a lower surface of the plate member and the cooler is performed via a bonding member composed mainly of tin. Also, a cyclic stress of the plate member is smaller than a tensile strength of the bonding member.

A transparent conductive film (TCF) and methods for creating the TCF. The TCF includes a substrate having a surface, a metal mesh layer over at least a portion of the surface of the substrate, and a conductive layer over the metal mesh layer. The conductive layer includes carbon nanotubes and a binder.

Structures are described having thin flexible polymer substrates with electrically conductive films on each opposing surface while having high optical transmittance and good optical properties. The structures can have total thicknesses of no more than about 30 microns and good flexibility. Processing approaches are described that allow for the coating of the very thin structures by providing support through the coating process. The structures are demonstrated to have good durability under conditions designed to test accelerated wear for touch sensor use.

An adhesion between a sealing resin layer and a shield film is improved by a mesh sheet disposed on an opposite surface of the sealing resin layer. A radio frequency module includes a wiring board, a component mounted on an upper surface of the wiring board, a sealing resin layer that covers the component, a mesh sheet disposed on an upper surface of the sealing resin layer, and a shield film provided to cover the upper surface and side surfaces of the sealing resin layer, and the mesh sheet. The mesh sheet and the sealing resin layer, as well as the mesh sheet and the shield film are firmly in adhesion with one another. Thus, the adhesion between the sealing resin layer and the shield film can be improved.

An occupant or object sensing system in a vehicle includes electrical circuits for capacitive sensing and corresponding circuits shielding the sensing system from interference. A sensing circuit and a shielding circuit may be printed by screen printing with conductive ink on opposite sides of a non-conductive substrate. The substrate is a plastic film or other fabric that has an elastic memory structure that is resilient to stretching. The conductive inks used to print circuits onto the substrate have a similar resilience to stretching such that the substrate and the circuits thereon can be subject to deforming forces without breaking the printed circuits. The substrate may be covered with a carbon polymer layer to provide alternative conductive paths that enable fast recovery for conduction in the presence of any break in the printed conductive traces on the substrate.

The invention relates to a connection carrier having at least one contact track which is connected in an electrically conductive manner to a contact surface for electrically contacting a semiconductor component, the contact track having a network structure in at least some locations. The invention further relates to a method for producing a connection carrier having contact tracks.

A conductive sheet according to an aspect of the present invention includes a first nanostructure and a second nanostructure disposed to intersect each other. A thickness of an intersect region of the first nanostructure and the second nanostructure is 0.6 to 0.9 times the sum of thicknesses of non-intersection regions of the first nanostructure and the second nanostructure.

A backlight bar includes a flexible circuit board and backlight lamp, the flexible circuit board includes a circuit board base and an electrostatic shielding structure, the electrostatic shielding structure is disposed on a first surface of the circuit board base and located in a non-marginal region, and the backlight lamp disposed on a second surface of the circuit board base, the first surface disposed opposite to the second surface. A backlight module and a display device are also provided.

A wiring board includes: a support body including at least one woven fabric woven from weaving yarns that are each formed by bundling insulating fibers; and a conductive body supported by the support body. The conductive body includes a first conductive path disposed on a first main face of the support body and that extends in a planar direction of the first main face. The first conductive path includes at least one of a first conductor portion disposed in a basket hole of the woven fabric and a first intervening portion disposed in a gap between the insulating fibers.

A conductive component includes a first electrode pattern made of metal thin wires, and includes a plurality of first conductive patterns that extend in a first direction alternating with first non-conductive patterns. Each first conductive pattern includes break parts in portions other than intersection parts of the thin metal wires. The conductive component further includes a second electrode pattern made of thin metal wires, and includes a plurality of second conductive patterns that extend in a second direction orthogonal to the first direction and alternating with second non-conductive patterns. Each second conductive pattern includes break parts in portions other than intersection parts of thin metal wires.