A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.

A method for manufacturing a flexible transparent electrode includes: preparing a substrate made of a flexible and transparent material, a metal nanocolloidal solution and an electrohydrodynamic jet printing device; fixing the substrate at a position spaced apart from an injection nozzle of the electrohydrodynamic jet printing device at a predetermined interval in order to print a metal pattern on the substrate using the electrohydrodynamic jet printing device; applying AC voltage of a predetermined power to the substrate and the injection nozzle of the electrohydrodynamic jet printing device; printing the metal pattern on an upper side of the substrate by the metal nanocolloidal solution using the electrohydrodynamic jet printing device in a state where the AC voltage of the predetermined power is applied to the substrate and the injection nozzle; and sintering the metal pattern formed on the substrate.

[Object] Provided are a laminate film and an electrode substrate film with excellent etching quality, in which a circuit pattern formed by etching processing is less visible under highly bright illumination, and a method of manufacturing the same.

[Solving Means] A laminate film includes a transparent substrate 60 formed of a resin film and a layered film provided on at least one surface of the transparent substrate. The layered film includes metal absorption layers 61 and 63 as a first layer and metal layers (62, 65), (64, 66) as a second layer, counted from the transparent substrate side. The metal absorption layers are formed by a reactive sputtering method which uses a metal target made of Ni alone or an alloy containing two or more elements selected from Ni, Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, and Cu, and a reactive gas containing oxygen. The reactive gas contains hydrogen.

[Object] Provided are an electrode substrate film in which a circuit pattern formed of a metal thin line is less visible even under highly bright illumination, and a laminate film applied to the same.

[Solving Means] An electrode substrate film with a transparent substrate 52 and a metal laminate thin line includes a metal absorption layer 51 with a film thickness of 20 nm to 30 nm inclusive as a first layer, and a metal layer 50 as a second layer, counted from the transparent substrate side, the laminate thin line having a line width of 20 μm or less. Optical constants of the metal absorption layer in a visible wavelength range (400 to 780 nm) satisfy conditions that a refractive index is 2.0 to 2.2 and an extinction coefficient is 1.8 to 2.1 at a wavelength of 400 nm, the refractive index is 2.4 to 2.7 and the extinction coefficient is 1.9 to 2.3 at a wavelength of 500 nm, the refractive index is 2.8 to 3.2 and the extinction coefficient is 1.9 to 2.5 at a wavelength of 600 nm, the refractive index is 3.2 to 3.6 and the extinction coefficient is 1.7 to 2.5 at a wavelength of 700 nm, and the refractive index is 3.5 to 3.8 and the extinction coefficient is 1.5 to 2.4 at a wavelength of 780 nm. An average reflectance in the visible wavelength range attributed to reflection at an interface between the transparent substrate and the metal absorption layer is 20% or less, and a difference between a highest reflectance and a lowest reflectance in the visible wavelength range is 10% or less.

A conductor includes a substrate, a first conductive layer disposed on the substrate and including two or more islands including graphene, and a second conductive layer disposed on the first conductive layer and including a conductive metal nanowire, wherein at least one of an upper surface and a lower surface of the islands including graphene includes a P-type dopant.

The present invention provides a printed circuit board fabricated by a Non-Plating Process that includes at least one plating bar disposed around at least one package unit of the printed circuit board. The package unit includes at least one ground line, at least one power line and a plurality of signal lines. The ground line has a first contact pad exposed on a surface of the printed circuit board, and at least one of the ground lines is connected to the plating bar. The power line has a second contact pad exposed on the surface, and at least one of the power lines is connected to the neighboring plating bar. The signal line has a third contact pad exposed on the surface.

A first ground elimination portion 3a formed in a ground layer is formed in a size such that a characteristic impedance determined by the first ground elimination portion 3a and component pads 1a is higher than a characteristic impedance determined by a ground conductor 2a and a transmission line 1b. When an outer shapes of the component pads 1a are projected on the ground layer, the center of a region interposed between the conductor pads 1a is positioned at the center of the first ground elimination portion 3a.

Disclosed are a display panel and a display device. The display panel includes a display area, a wiring area, and a bending area connecting the display area and the wiring area; the bending area includes a first boundary on a side closer to the display area; in the first direction, an extension length of the first boundary is less than an extension length of the wiring area; in the second direction, a vertical projection of the first boundary in the wiring area is located within the coverage of the wiring area; in the second direction, the display area includes sub-pixel rows, and the last sub-pixel row is located on a side of the display area closer to the wiring area; in the first direction, a first sub-pixel in the last sub-pixel row is located on a side of the wiring area boundary closer to the center of the display panel.

Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.

A mask including a substrate and a mesh pattern are disclosed along with an electronic device. The mesh pattern, being disposed on the substrate, includes a first striped pattern and a second striped pattern; the first striped pattern includes a first, second, and third section, and the second section is disposed between the first and the third sections; the second striped pattern includes a fourth, fifth, and sixth section, and the fifth section is disposed between the fourth and the sixth sections; the first section has a first extension direction, the fourth section has a second extension direction, and a first included angle is between the first extension direction and the second extension direction; the fifth section and the second section intersect each other while having a second included angle between the two sections, and the second included angle is greater than the first included angle.