H05K2201/09681

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

Cut processing of layered composites by water vapor annealing

In a method for making a flexible material, a sheet of graphene oxide-composite paper is subjected to an environment having a relative humidity above a predetermined threshold for a predetermined amount of time. At least one expansion cut is cut in the sheet of graphene oxide-composite paper. A flexible conductive material includes a sheet of graphene oxide-composite paper defining at least one cut passing therethrough and formed it a kirigami structure. A region of the sheet of graphene oxide-composite paper includes reduced graphene oxide.

APPARATUS AND METHOD OF PRODUCING A SENSING SUBSTRATE
20230358570 · 2023-11-09 ·

An occupant or object sensing system in a vehicle includes electrical circuits for resistive and/or capacitive sensing and corresponding circuits shielding the sensing system from interference. A sensing circuit and a shielding circuit may be printed by screen printing with conductive ink on opposite sides of a non-conductive substrate. The substrate is a plastic film or other fabric that has an elastic memory structure that is resilient to stretching. The conductive inks used to print circuits onto the substrate have a similar resilience to stretching such that the substrate and the circuits thereon can be subject to deforming forces without breaking the printed circuits. The substrate may be covered with a carbon polymer layer to provide alternative conductive paths that enable fast recovery for conduction in the presence of any break in the printed conductive traces on the substrate.

Display device
11714466 · 2023-08-01 · ·

A display device includes a display panel, a data driver which transmits a data voltage to the display panel, a first flexible printed circuit board attached to the display panel and including an input side wiring electrically connected to the data driver, a first printed circuit board (PCB) electrically connected to the input side wiring to transmit a high-speed driving signal to the data driver, and a metal tape overlapping the input side wiring in a plan view and attached on the first flexible printed circuit board, where a part of the metal tape overlapping the input side wiring in the plan view defines an opening.

Conductive transfer

A conductive transfer for application to an article comprises first and second non-conductive layers and a conductive layer positioned between the two non-conductive layers. The conductive transfer further comprises an adhesive layer for adhering the conductive transfer to an article, such as a wearable item. The conductive layer comprises a plurality of tessellated cells defined by a printed conductive ink. The conductive layer comprises a main element and an input track with the plurality of tessellated cells being comprised over the input track of said conductive layer.

Implementing embedded wire repair for PCB constructs

Methods and structures are provided for implementing embedded wire repair for printed circuit board (PCB) constructs. A repair wire layer is provided within the PCB stack with reference planes on opposite sides of the repair wire layer. When a repair connection is required, an appropriate plated through hole (PTH) is drilled to form the repair connection using the repair wire layer.

Flexible circuit design for monitoring physical bodies

A flexible circuit may be provided that allows for the monitoring of a physical object. The flexible circuit includes a plurality of flexible conductive segments that are disposed in a geometric pattern. The flexible conductive segments include nodes, and the physical object is monitored by analyzing changes in electrical resistance in the conductive segments between the nodes. The flexible circuit may also include sensors disposed on the nodes for monitoring additional conditions. A processor monitors the flexible conductive segments and sensors, and may provide an output regarding the status of the physical object.

Method of manufacturing a touch sensor with a low visibility conductive micro-mesh

Light reflection from a metal mesh touch sensor is reduced or prevented by encasing the metal lines with a passivation coating and including non-reflective nanoparticles in the patterning photoresist. The photoresist is mixed with catalytic nanoparticles wherein the nanoparticles are formed to minimize light reflection. The nanoparticles may be carbon coated metallic particles, or uncoated palladium nanoparticles. Also, a standoff photoresist layer may be included between the substrate and the photoresist composition to prevent reflection from the edges of the metallic lines.

Printed circuit board and electronic device including the same
11439009 · 2022-09-06 · ·

Various embodiments relate to an apparatus. The apparatus may include: a first printed circuit board including a first ground layer having one or more openings formed therein and a wiring layer on which a signal wire is disposed; a second printed circuit board including a second ground layer having one or more openings formed therein; a first area and a third area in which the first printed circuit board and the second printed circuit board are connected to each other via an insulating layer; and a second area, which extends from the first area to the third area, and in which the first printed circuit board and the second printed circuit board are spaced apart from each other, with an air layer interposed therebetween. Various other embodiments may be possible.

Current redistribution in a printed circuit board

In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern, a grid pattern, a directional pattern, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area.