H05K2201/09681

SILVER-BASED TRANSPARENT CONDUCTIVE LAYERS INTERFACED WITH COPPER TRACES AND METHODS FOR FORMING THE STRUCTURES
20220132672 · 2022-04-28 ·

A method is described for method for patterning a metal layer interfaced with a transparent conductive film, in which the method comprises contacting a structure through a patterned mask with an etching solution comprising Fe.sup.+3 ions, wherein the structure comprises the metal layer comprising copper, nickel, aluminum or alloys thereof covering at least partially a transparent conductive film with conductive elements comprising silver, to expose a portion of the transparent conductive film. Etching solutions and the etched structures are also described.

Apparatus and method of producing a sensing substrate

An occupant or object sensing system in a vehicle includes electrical circuits for resistive and/or capacitive sensing and corresponding circuits shielding the sensing system from interference. A sensing circuit and a shielding circuit may be printed by screen printing with conductive ink on opposite sides of a non-conductive substrate. The substrate is a plastic film or other fabric that has an elastic memory structure that is resilient to stretching. The conductive inks used to print circuits onto the substrate have a similar resilience to stretching such that the substrate and the circuits thereon can be subject to deforming forces without breaking the printed circuits. The substrate may be covered with a carbon polymer layer to provide alternative conductive paths that enable fast recovery for conduction in the presence of any break in the printed conductive traces on the substrate.

Printed wiring line, electronic device, touch panel, gravure plate, printed wiring line formation method, touch panel production method, and electronic device production method

A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.

SEMICONDUCTOR MEMORY SYSTEM

According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
20210352801 · 2021-11-11 ·

The present technology relates to a circuit board, a semiconductor device, and an electronic device for enabling effective suppression of generation of noise in a signal. The circuit board includes a reticulated conductor including a first conductor group configured by two or more conductors having a first conductor width and arranged with a first periodic width in a first direction, a second conductor group configured by two or more conductors having a second conductor width and arranged with a second periodic width in a second direction orthogonal to the first direction, and a first moving conductor group arranged at a position to which at least a part of the second conductor group is moved by a factor of 1 of the first periodic width in the first direction and is moved by a factor of 1 of a third periodic width in the second direction, the third periodic width and the second periodic width being different. The present technology can be applied to, for example, a circuit board of a semiconductor device.

ELECTRIC HEATER DEVICE SEMI-FINISHED PRODUCT, ELECTRIC HEATER DEVICE AND MANUFACTURING PROCESSES

A semi-finished product of an electric heater device has a casing body (2) defining a housing for at least one electric heater. The casing body (2) has a first or predefined configuration, in particular a substantially planar, or plate-like, or two-dimensional configuration, and is prearranged for being folded in substantially predetermined areas (1a), which define in the casing body (2) a plurality of regions (4, 5, 6) that are at least in part relatively stiff and are suitable to be folded with respect to one another in one said folding area (1a). In this way, a second or different configuration, in particular a substantially three-dimensional configuration, can be bestowed upon the casing body (2).

Touch screen and manufacturing method thereof, display substrate, and touch display device

The present disclosure provides a touch screen and a manufacturing method thereof, a display substrate, and a touch display device. The touch screen includes: at least one metal mesh layer and electrostatic leading lines, wherein each metal mesh layer includes a plurality of electrodes insulated from each other, and the electrostatic leading lines extend among the plurality of electrodes of the at least one metal mesh layer and are connected to grounding wires, wherein the electrostatic leading lines are arranged to be insulated from the plurality of electrodes.

Conductive sheet and touch panel

A conductive component includes a first electrode pattern made of metal thin wires, and includes a plurality of first conductive patterns that extend in a first direction alternating with first non-conductive patterns. Each first conductive pattern includes break parts in portions other than intersection parts of the thin metal wires. The conductive component further includes a second electrode pattern made of thin metal wires, and includes a plurality of second conductive patterns that extend in a second direction orthogonal to the first direction and alternating with second non-conductive patterns. Each second conductive pattern includes break parts in portions other than intersection parts of thin metal wires.

Printed circuit boards with meshed conductive structures
11765822 · 2023-09-19 · ·

Electronic apparatus includes a dielectric substrate and alternating layers of conducting and dielectric materials disposed over the dielectric substrate, including at least first and second patterned layers of the conducting material separated by an intervening layer of the dielectric material. A conductive trace is disposed within the first patterned layer of the conducting material. A conductive mesh extends within the second patterned layer of the conducting material over a region that overlaps transversely with at least a part of the conductive trace in the first patterned layer.

Conductive member for touch panel and touch panel

A conductive member for a touch panel includes a transparent insulating member; and a plurality of first electrodes extending in a first direction and arranged in parallel in a second direction intersecting the first direction, in which the plurality of first electrodes are constituted by a first mesh conductive film a plurality of fine metal wires are electrically connected, the plurality of first electrodes include a plurality of first main electrodes each having an electrode width Wa defined in the second direction and at least one first sub-electrode having an electrode width Wb smaller than Wa of the first main electrode in the second direction, the first sub-electrode is the first electrode arranged on an outermost side among the plurality of first electrodes, an opening ratio of the first sub-electrode is smaller than that of the first main electrode, and the first main electrode has a first dummy pattern.