A light emitting device filament includes a substrate, a plurality of light emitting diodes, two electrode pads, and a plurality of connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extending in a first direction and having a width in a second direction. The plurality of light emitting diodes is disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The plurality of connection lines electrically connects the plurality of light emitting diodes and the two electrode pads. The plurality of connection lines includes a first connection line and a second connection line. The first connection line, the second connection line, or both are formed in a direction inclined or curved with respect to the first direction or the second direction.

A light emitting device filament includes a substrate, a plurality of light emitting diodes, two electrode pads, and a plurality of connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extending in a first direction and having a width in a second direction. The plurality of light emitting diodes is disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The plurality of connection lines electrically connects the plurality of light emitting diodes and the two electrode pads. The plurality of connection lines includes a first connection line and a second connection line. The first connection line, the second connection line, or both are formed in a direction inclined or curved with respect to the first direction or the second direction.

Methods and structures are provided for implementing embedded wire repair for printed circuit board (PCB) constructs. A repair wire layer is provided within the PCB stack with reference planes on opposite sides of the repair wire layer. When a repair connection is required, an appropriate plated through hole (PTH) is drilled to form the repair connection using the repair wire layer.

A differential circuit board includes a dielectric layer having a first and a second surface, a first conductor line with a first line-width, a second conductor line with a second line-width less than the first line-width, and a ground conductor. The dielectric layer has a first portion with a first thickness between the first and second surface and a second portion with a second thickness less than the first thickness between the first and second surfaces. The first conductor line is disposed on the first surface of the first portion. The second conductor line is disposed on the first surface of the second portion. The ground conductor is disposed on the second surface of the first portion and the second surface of the second portion, wherein the ground conductor overlaps with the first conductor line and the second conductor line. The first and second conductor lines are differential transmission lines.

A method may include receiving a first and a second complementary signal to provide differential signaling. The method may further include providing a first conductor trace to transport the first complementary signal; providing a second conductor trace to transport the second complementary signal, the second conductor trace immediately adjacent to the first conductor trace; providing a third conductor trace to transport the first complementary signal, the third conductor trace immediately adjacent to the second conductor trace; and providing a fourth conductor trace to transport the second complementary signal, the fourth conductor trace immediately adjacent to the third conductor trace.

A method is provided for forming a printed circuit board (PCB) assembly. The method may include drilling a first plurality of vias having a first diameter in a PCB and filling the first plurality of vias to form a first plurality of plated or filled vias. The method may also include drilling a second plurality of vias having a second diameter in the PCB, and filling the second plurality of vias to form a second plurality of plated or filled vias. The first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.

A display apparatus, includes: a flexible circuit board including a first board pad and a second board pad, which are spaced apart from each other in a first direction and extend in a second direction intersecting the first direction; a main circuit board coupled to the flexible circuit board; and a display panel coupled to the flexible circuit board, the display panel including a first display pad overlapped with the first board pad and a second display pad overlapped with the second board pad, wherein the first board pad includes a first, second, and third portions, and the second board pad includes a first, second, and third portions.

The present disclosure provides a conductor arrangement for transmitting differential communication signals, the conductor arrangement includes a conductor carrier, a plurality of pairs of first conductors, two of the first conductors being electrically coupled together at their ends, and a plurality of pairs of second conductors, two of the second conductors being electrically coupled together at their ends, and wherein, as conductor bundles, in each case one of the first conductors of a pair and one of the second conductors of a pair are jointly arranged on a first side of the conductor carrier and the further first conductor of the respective pair and the further second conductor of the respective pair are arranged on a second side of the conductor carrier.

A light emitting device filament includes a substrate, light emitting device chips, two electrode pads, and connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extends in a first direction and has a width in a second direction. The light emitting device chips are disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The connection lines electrically connect the light emitting device chips and the electrode pads. At least one of the connection lines includes a first portion extending in the first direction and a second portion extending in the second direction.

A wiring structure of a head suspension including a flexure that supports a head and is attached to a load beam applying load onto the head, includes write wiring and read wiring formed on the flexure and connected to the head, each having wires of opposite polarities and further including a stacked interleaved part which includes segments electrically connected to the respective wires of the write wiring, the segments stacked on and facing the wires through an electrical insulating layer so that the facing wire and segment have opposite polarities, is manufactured by a wiring step, an insulating layer forming step and a stacked interleaved part forming step.