There has been a problem of generating anti-resonance between a three-terminal capacitor and a capacitor when the three-terminal capacitor and the capacitor are mounted. In order to solve the problem, this electronic circuit includes: a capacitor and a three-terminal capacitor, which are connected to a power supply terminal of a circuit component, and a power supply, and which are connected in parallel to each other between the power supply and ground; and a resistor that is connected in series between the ground and a ground terminal of the three-terminal capacitor and/or the capacitor.

Power module comprising a power semiconductor die and at least one substrate comprising an insulating layer in contact with a metallized connection surface of said die and at least one conductive path on a conductive layer on a face of the insulating layer opposite to the metallized connection surface of the die and wherein said insulating layer comprises vias filled with conductive material to provide connecting pads between said metallized connection surface of said die and said conductive path, and wherein said vias are arranged with a decreasing density from at least one hot spot position of said metallized connection surface when the die is in operation to a peripheral area of said metallized connection surface.

Devices, systems, and methods for making and using circuit assemblies having a pattern of deformable conductive material formed therein are disclosed herein. In various aspects, a circuit assembly can include a substrate layer; a first pattern of deformable conductive material formed on a surface of the substrate layer using a removable stencil; and a first stacked layer configured to cover at least a portion of the first pattern of deformable conductive material.

A printed circuit board includes a power input terminal, a positive trunk line, a negative trunk line, a first switching circuit, a second switching circuit, a first positive wire, a second positive wire, a first capacitor, a second capacitor, and a bypass circuit. The first positive wire connecting the positive trunk line with the first switching circuit without passing through the second switching circuit. The second positive wire connecting the positive trunk line with the second switching circuit without passing through the first switching circuit. The first capacitor provided between the first positive wire and the negative trunk line. The second capacitor provided between the second positive wire and the negative trunk line. The bypass circuit connecting the first positive wire with the second positive wire.

A wiring board of an electronic device includes: a board terminal connected to a semiconductor device (semiconductor component); a wire formed in a first wiring layer and electrically connected to the board terminal; a conductor pattern formed in a second wiring layer and electrically connected to the wire via a via wire; and another conductor pattern formed in a third wiring layer and supplied with a first fixed potential. The conductor pattern and the another conductor pattern face each other with an insulating layer interposed therebetween, and an area of a region where the conductor pattern and the another conductor pattern face each other is larger than an area of the wire.

The present disclosure relates to a method for the process-reliable soldering of a chip package onto a printed circuit board for the process-reliable soldering of a chip package. The printed circuit board has a metallic cooling surface, a plurality of metallic contact surfaces surrounding the cooling surface, and, on a side opposite the cooling surface, a rear metallic mating surface, the mating surface being connected to the cooling surface by open vias, and lanes of solder resist being arranged on the cooling surface, which lanes both divide the cooling surface into a plurality of partial surfaces and enclose the vias.

A printed circuit board includes a printed wiring board and a transmission circuit implemented on the printed wiring board and transmitting digital signals. The printed wiring board connected to the transmission circuit includes a main wiring pattern transmitting digital signals and a first wiring pattern having a connection end connected to the main wiring pattern and an open end. The printed wiring board further includes a second wiring pattern having a grounded end and an open end and extending in a direction in which the first wiring pattern extends. The second wiring pattern is disposed such that the grounded end of the second wiring pattern is disposed adjacent to the connection end or the open end of the first wiring pattern. By this, a printed circuit board capable of suppressing EMI is provided while increase in size of the printed wiring board is avoided.

An electronic device according to one embodiment includes a wiring substrate, the wiring substrate having a first wiring connected to a first external terminal and a second wiring connected to a second external terminal and extending along the first wiring. Additionally, the above electronic device has a semiconductor device mounted on the above wiring substrate and electrically connected to each of the first and second wirings. Further, the above electronic device has a capacitor mounted on the above wiring substrate and electrically connected to the semiconductor device via each of the above first and second wirings. Furthermore, a distance between the above semiconductor device and capacitor is shorter than a distance between each of the above first and second external terminals and the above capacitor.

An axial flow fan includes a fan frame and an impeller received in the fan frame. The fan frame includes a base shell and a flange being formed on the base shell. The base shell further includes an air inlet facing away from the flange. The flange includes a first air outlet. The flange further includes a second air outlet. Air flows through the second air outlet in a direction perpendicular to the air flowing through the first air outlet.

An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.