A manufacturing method for an electronic component that includes a providing a base member on a first main surface of a first board, sandwiching the base member and a joining member paste between the first main surface of the first board and a transfer main surface of a transfer board, forming a joining member joined with the base member while the joining member paste is sandwiched by the first board and the transfer board, and peeling off the transfer board from the joining member joined with the base member.

A vibration detection element includes substrates, support members, and an oscillator, and may be used as a biosensor and/or for liquid inspection by analysis of oscillator resonant frequency change. The substrates have a space portion, and the support members protrude from the surfaces of the respective substrates into the space portion. The oscillator is disposed between the support members and is capable of vibrating in the space portion. The support members may each include multiple supports which prevent the oscillator from contacting the substrate surfaces. During manufacturing the oscillator may be transferred from the support member of a glass flow path substrate to a silicon flow path substrate by placement of the silicon substrate support member against the oscillator and subsequent removal of the adhesive from the glass substrate support member.

A piezoelectric element includes a plurality of vibration regions that are separated from each other by a slit, and the slit is formed to have a tapered portion that is tapered from a first surface of the vibration regions on an opposite side to a support to a second surface opposite to the first surface. An electrode film is positioned inside than the slit when being viewed from a normal direction orthogonal to the first surface, and an angle formed by a side surface of the tapered portion in the vibration region and a surface parallel to the first surface is in a range of 39 to 81 degrees.

An electronic device includes a first substrate having a terminal disposed on a first side surface, a second substrate stacked on the first substrate, a third substrate stacked on a opposite side of the second substrate from the first substrate, and a wiring substrate disposed to face the first side surface and joined to the first side surface via a first joining member, wherein a second side surface of the second substrate that faces the wiring substrate is located on an opposite side of the first side surface from the wiring substrate.

A piezoelectric element includes a substrate and a laminate which is provided on the substrate and which includes a first electrode, a seed layer, a piezoelectric layer, and a second electrode in this order, and the seed layer includes a composite oxide containing as a constituent element, lead, iron, and titanium.

A composite substrate of the present disclosure includes a piezoelectric substrate having a first surface which is an element formation surface and a second surface which is a back surface of the first surface, a sapphire substrate having a third surface which is disposed opposing a second surface and a fourth surface which is a back surface of the third surface, a fifth surface opposing the second surface, and a sixth surface opposing the third surface. It includes an alumina layer bonding the second surface and the third surface, and an arithmetic mean roughness Ra of the third surface is 0.1 μm or more and 0.5 μm or less. The arithmetic mean roughness Ra of the fifth surface is 0.1 μm or less and is smaller than the arithmetic mean roughness Ra of the third surface.

A method of manufacturing a piezoelectric microactuator having a wrap-around electrode includes forming a piezoelectric element having a large central electrode on a top face, and having a wrap-around electrode that includes the bottom face, two opposing ends of the device, and two opposing end portions of the top face. The device is then cut through the middle, separating the device into two separate piezoelectric microactuators each having a wrap-around electrode.

Bending mode transducers are provided including a substrate made of a high density material, the substrate having a first surface and a second surface, opposite the first surface. A piezoelectric layer is provided on the first surface of the substrate and at least one patterned electrode is provided on the piezoelectric layer. A mounting block is on the at least one patterned electrode at least one electrical contact point is provided on the first surface of the substrate remote from the at least one patterned electrode. Related devices and methods are also provided.

A manufacturing process for ultrasonic atomization piece relates to the atomization piece technical field and includes: S1. cutting a press-thermosetting conductive adhesive film into a shape matched with a piezoelectric ceramic sheet; S2. placing the press-thermosetting conductive adhesive film on a composite plate, wherein the composite plate includes a substrate and a conductive layer, the press-thermosetting conductive adhesive film is placed on the conductive layer, and the substrate is a polymer film; S3. placing the piezoelectric ceramic sheet on the press-thermosetting conductive adhesive film; S4. pressing the piezoelectric ceramic sheet and the composite plate in S3 together by a press machine. The press-thermosetting conductive adhesive film for connecting the piezoelectric ceramic sheet and the composite plate can be cured in a short time under high pressure and heating and has excellent adhesion, which is a thin film material with excellent plasticity and can be easily cut into various shapes.

An ultrasonic transducer that includes a delay line, an active piezoelectric element, and interposing metal conductive layer between the delay line and active piezoelectric element. The delay line and active piezoelectric element are joined so that ultrasonic waves may be coupled from the active piezoelectric element into the delay line or from the delay line into the active piezoelectric element. A via is formed, using a milling operation, in the active piezoelectric element to expose the edge of the interposing metal conductive layer between the delay line and active piezoelectric element. A conductive layer makes electrical contact between the interposing metal conductive layer and the surface of the active piezoelectric element to allow an electrical connection to be made from the surface of the active piezoelectric element to the interposing metal conductive layer.