Patent classifications
H01H85/06
Hold-down release apparatus and methods incorporating a fuse wire
A hold-down release apparatus includes a housing, a reciprocating retention member, a release member, bias member(s), and a fuse wire. The retention member moves between retention and release positions and is biased toward the release position. With the retention member in the release position, the release member can move out of the housing; with the retention member in the retention position, the retention member obstructs the release member from moving out of the housing. The fuse wire obstructs movement of the retention member to the release position and holds the retention member in the retention position against the bias force. With an actuation current flowing through the fuse wire, the bias force breaks the fuse wire, allowing the retention member to move to the release position in response to the bias force, and the release member to move out of the housing.
Hold-down release apparatus and methods incorporating a fuse wire
A hold-down release apparatus includes a housing, a reciprocating retention member, a release member, bias member(s), and a fuse wire. The retention member moves between retention and release positions and is biased toward the release position. With the retention member in the release position, the release member can move out of the housing; with the retention member in the retention position, the retention member obstructs the release member from moving out of the housing. The fuse wire obstructs movement of the retention member to the release position and holds the retention member in the retention position against the bias force. With an actuation current flowing through the fuse wire, the bias force breaks the fuse wire, allowing the retention member to move to the release position in response to the bias force, and the release member to move out of the housing.
FUSE ELEMENT, FUSE DEVICE AND PROTECTION DEVICE
A fuse element (10) includes a low-melting-point metal layer (11), a high-melting-point metal layer (12) laminated on at least one surface of the low-melting-point metal layer (11), and an intermediate layer (13) disposed between the low-melting-point metal layer (11) and the high-melting-point metal layer (12), in which the high-melting-point metal layer (12) and the intermediate layer (13) are layers formed of a metal which is melted by a molten material of the low-melting-point metal layer (11), and the intermediate layer (13) has a higher ionization tendency than an ionization tendency of the high-melting-point metal layer (12).
FUSE ELEMENT, FUSE DEVICE AND PROTECTION DEVICE
A fuse element (10) includes a low-melting-point metal layer (11), a high-melting-point metal layer (12) laminated on at least one surface of the low-melting-point metal layer (11), and an intermediate layer (13) disposed between the low-melting-point metal layer (11) and the high-melting-point metal layer (12), in which the high-melting-point metal layer (12) and the intermediate layer (13) are layers formed of a metal which is melted by a molten material of the low-melting-point metal layer (11), and the intermediate layer (13) has a higher ionization tendency than an ionization tendency of the high-melting-point metal layer (12).
Protection device and circuit protection apparatus containing the same
A protection device comprises a substrate, a fusible element and a heating element. The substrate comprises a first electrode and a second electrode on its surface. The fusible element is disposed on the substrate and connects to the first electrode and the second electrode at two ends. The fusible element comprises a first metal layer and a second metal layer disposed on the first metal layer. The second metal layer has a lower melting point than that of the first metal layer. The heating element is disposed on the substrate. In the event of over-voltage or over-temperature, the heating element heats up to melt and blow the fusible element. The second metal layer is 40-95% of the fusible element in thickness.
Protection device and circuit protection apparatus containing the same
A protection device comprises a substrate, a fusible element and a heating element. The substrate comprises a first electrode and a second electrode on its surface. The fusible element is disposed on the substrate and connects to the first electrode and the second electrode at two ends. The fusible element comprises a first metal layer and a second metal layer disposed on the first metal layer. The second metal layer has a lower melting point than that of the first metal layer. The heating element is disposed on the substrate. In the event of over-voltage or over-temperature, the heating element heats up to melt and blow the fusible element. The second metal layer is 40-95% of the fusible element in thickness.
HIGH VOLTAGE CARTRIDGE FUSE ASSEMBLY
An electrical cartridge fuse including a cylindrical housing, first and second terminals coupled to the cylindrical housing, and a fuse element inside the housing and interconnected between the first and second terminals. The fuse element has a main body having at least five openings formed therein in a single line along a longitudinal axis of the fuse element, a guide element formed on a first end of the main body, and a hanger element formed on the second end of the main body. The cartridge fuse has a package size of about 6×32 mm and a voltage rating of at least 500 VADC, a 20 kA IR Rating, a current rating of 12 A to 30 A and a defined opening time at 100% rated current.
Active/passive automotive fuse module
An exemplary embodiment of active/passive automotive fuse module in accordance with the present disclosure may include an electrically insulating base, a fuse plate including a bus bar portion disposed on a top surface of the base above a projectile cavity formed in the base, the fuse plate further including a fusible portion electrically connected to the bus bar portion and adapted to open when an amount of current flowing through the fuse plate exceeds a current rating of the active/passive automotive fuse module, the active/passive automotive fuse module further including a pyrotechnic interrupter (PI) disposed atop the base and including a projectile positioned above the bus bar portion, the PI configured to drive the projectile through the bus bar portion upon actuation of the PI.
Active/passive automotive fuse module
An exemplary embodiment of active/passive automotive fuse module in accordance with the present disclosure may include an electrically insulating base, a fuse plate including a bus bar portion disposed on a top surface of the base above a projectile cavity formed in the base, the fuse plate further including a fusible portion electrically connected to the bus bar portion and adapted to open when an amount of current flowing through the fuse plate exceeds a current rating of the active/passive automotive fuse module, the active/passive automotive fuse module further including a pyrotechnic interrupter (PI) disposed atop the base and including a projectile positioned above the bus bar portion, the PI configured to drive the projectile through the bus bar portion upon actuation of the PI.
ELECTRONIC FUSE (E-FUSE) WITH DISPLACEMENT-PLATED E-FUSE TERMINALS
An electronic fuse (e-fuse) module may be formed in copper interconnect in an integrated circuit device. A pair of e-fuse terminals may be formed by forming a pair of spaced-apart e-fuse terminal structures (e.g., copper damascene structures) and forming a conductive barrier region on each e-fuse terminal structure. The barrier regions may be formed by displacement plating a conductive barrier layer, e.g., comprising CoWP, CoWB, Pd, CoP, Ni, Co, or Ni—Co alloy, on each e-fuse terminal structure. An e-fuse element, e.g., comprising NiCr, TiW, TiWN, or Al, may be formed on the barrier regions of the pair of e-fuse terminals to define a conductive path between the pair of e-fuse terminal structures through the e-fuse element and through the barrier region on each e-fuse terminal structure. The barrier regions may protect the e-fuse terminal structures (e.g., copper structures) from corrosion and/or diffusion.