An electronic device includes a package structure and a conductive lead with a first surface and a second surface. The first surface has a first plated layer exposed outside the package structure along a first side of the package structure, and the second surface has a second plated layer exposed along the bottom side of the package structure. A method includes forming a first plated layer on a first surface of a conductive lead exposed along a bottom side of a molded structure in a panel array, performing a package separation process that separates an electronic device from the panel array, placing the bottom side of the package structure and the first plated layer on a tape layer above a conductive plate, and forming a second plated layer on the exposed second surface of the conductive lead.

A packaged electronic device includes a multilayer lead frame having first and second trace levels, a via level therebetween, a conductive feed structure, and a conductive reflector wall. The first trace level includes a conductive coupler antenna and a conductive ground structure that extends in a plane of orthogonal first and second directions, and a portion of the conductive coupler antenna faces outward along a third direction orthogonal to the first and second directions. The conductive reflector wall has an opening and extends along the third direction between the first and second trace levels around a portion of the conductive coupler antenna. The conductive feed structure is coupled to the conductive coupler antenna and extends along the first direction through the opening of the conductive reflector wall.

A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

In a described example, an apparatus includes: a package substrate having a die pad configured for mounting a semiconductor die, a first lead connected to the die pad, and a second lead spaced from and electrically isolated from the die pad; a spacer dielectric mounted on the die pad; a semiconductor die including a temperature sensor mounted on the spacer dielectric; electrical connections coupling the semiconductor die to the second lead; and mold compound covering the semiconductor die, the die pad, the electrical connections, and a portion of the package substrate, with portions of the first lead and portions of the second lead exposed from the mold compound to form terminals for a packaged temperature sensor device.

Manufacturing a semiconductor device, such as an integrated circuit, comprises: providing a leadframe having a die pad area, attaching onto the die pad area of the leadframe one or more semiconductor die or dice via soft-solder die attach material, and forming a device package by molding package material onto the semiconductor die or dice attached onto the die pad area of the leadframe. An enhancing layer, provided onto the leadframe to counter device package delamination, is selectively removed via laser beam ablation from the die pad area, and the semiconductor die or dice are attached onto the die pad area via soft-solder die attach material provided where the enhancing layer has been removed to promote wettability by the soft-solder material.

A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

A semiconductor package includes a multilayer package substrate with a top layer including top filled vias through a top dielectric layer and top metal layer providing a top surface for leads and traces connected to the leads, and a bottom layer including bottom filled vias including contact pads through a bottom dielectric and metal layer. The top filled vias are for connecting the bottom and top metal layer. The bottom metal filled vias are for connecting the bottom metal layer to the contact pads. An integrated circuit (IC) die has nodes in its circuitry connected to the bond pads. The IC die is flipchip mounted onto the leads. A passive device(s) is surface mounted by an electrically conductive material on the top metal layer electrically connected between at least one adjacent pair of the leads. A mold compound is for encapsulating at least the IC die and passive device.

A lead frame comprises a substrate comprising copper and includes a layer of bright silver is plated onto the substrate. A layer of doped bright silver is thereafter plated over a top surface of the layer of bright silver for enhancing the performance of LED devices utilizing the lead frame.

A molded interconnect device adapted to form a three-dimensional circuit by using laser beams includes: a main body on which the three-dimensional circuit is formed; and a lead portion connected to an external electrode of an external substrate by solder and extending from the main body. The lead portion includes: a lead main body molded from a material same as a material of the main body; and a metal film formed on at least a part of an outer periphery of the lead main body.

A method for manufacturing a semiconductor device includes steps (a) to (e). In the step (a), a lead frame including a plurality of lead portions, tie bars, a frame body, and ring portions is prepared. In the step (b), an assembled body is formed. In the step (c), the assembled body is placed in a cavity. In the step (d), a molding resin in a liquid form is injected into the cavity and cured in a state in which a pin is inserted through a hole of the ring portion and an upper surface of the ring portion is in contact with an inner surface of the upper die, and a resin-molded body is formed. In the step (e), the frame body, the tie bars, and connecting portions are cut after the resin-molded body is taken out from the molding die.