Patent classifications
H01L21/67023
BACKSIDE GAS LEAKBY FOR BEVEL DEPOSITION REDUCTION
Exemplary substrate support assemblies include an electrostatic chuck body defining a substrate platform. The substrate platform may be characterized by an upper surface. The platform may define a purge aperture. The platform may include a plurality of mesas that are disposed in an inner region of the upper surface. Each of the mesas may protrude upward from the upper surface. The platform may include a sealing band that extends upward from the upper surface in a circumferential pattern and partially encircles the inner region of the upper surface. Top surfaces of the mesas and sealing band may form a support surface for a substrate. The sealing band may define a number of gaps. The assemblies may include a support stem coupled with the electrostatic chuck body, a heater embedded within the electrostatic chuck body, and a backside gas source that is coupled with the purge aperture of the support surface.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus includes a first tank, a path including a first path, a first heater, a hydrogen peroxide supply path, and a controller. The first path allows sulfuric acid to be supplied therethrough from the first tank to a nozzle. The first heater heats a heating region of the first path. The controller controls ejecting sulfuric acid heated by the first heater and a hydrogen peroxide solution from the nozzle onto a substrate, the sulfuric acid and the hydrogen peroxide solution on the substrate having been mixed, and then ejecting sulfuric acid having a temperature lower than a temperature of the sulfuric acid heated by the first heater and the hydrogen peroxide solution from the nozzle onto the substrate, the sulfuric acid and the hydrogen peroxide solution on the substrate having been mixed.
POINT OF USE OR POINT OF DISPENSE FILTER WITH MULTIPLE PLEAT PACKS
Embodiments provide a filter with a generally rectangular, non-cylindrical profile. The filter may have multiple pleat packs positioned between pleat covers that define regions and flow channels in a cavity of the filter body. The pleat covers have openings that allow a fluid to flow through the multiple pleat packs via parallel flows or series flows. End caps bonded to the body define flow passages for directing the fluid from an inlet to an outlet via the pleat packs for series or parallel filtration. The pleat packs may be made of the same or different materials and may be configured with the same or different heights based on flow requirements. A cage or a separator may be positioned between the pleat packs. The pleat packs may be made of a continuous pleated membrane with bridges defining a space between the pleat packs to accommodate the cage or separator.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus includes an inspection substrate including a base and an imaging unit disposed at the base; a holder configured to hold a substrate or the inspection substrate; a driving unit configured to rotate the holder; a processing liquid supply having a nozzle configured to discharge a processing liquid to the substrate held by the holder; and a controller. The controller is configured to perform: adjusting a position of the imaging unit with respect to the nozzle to a predetermined first imaging position by controlling the driving unit to rotate the holder in a state that the inspection substrate is held by the holder; and imaging, after the adjusting of the position of the imaging unit to the first imaging position, the nozzle at the first imaging position by controlling the imaging unit.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus includes an inspection substrate including a base and an imaging unit disposed at the base; a holder configured to hold a substrate or the inspection substrate; a driving unit configured to rotate the holder; a processing liquid supply configured to supply a processing liquid to the substrate held by the holder; a cup member configured to surround the holder; and a controller. The controller is configured to perform: adjusting a position of the imaging unit with respect to the cup member to a predetermined first imaging position in a state that the inspection substrate is held by the holder; and imaging, after the adjusting of the position of the imaging unit to the first imaging position, an imaging target that is located in a space closer to the cup member than to an outer periphery of the base at the first imaging position.
SUBSTRATE PROCESSING APPARATUS
This invention includes a substrate holder provided rotatably about an axis of rotation extending in a vertical direction while sucking and holding a central part of a lower surface of a substrate, a rotating mechanism for outputting a rotational driving force for rotating the substrate holder, a processing mechanism for processing the substrate by supplying a processing liquid to the substrate held by the substrate holder, and a rotating cup provided rotatably about the axis of rotation while surrounding an outer periphery of the rotating substrate and configured to collect liquid droplets of the processing liquid scattered from the substrate. The rotating mechanism includes a power transmitter for transmitting a part of the rotational driving force as a cup driving force to the rotating cup, and simultaneously rotates the substrate holder and the rotating cup by the rotational driving force.
SUBSTRATE PROCESSING APPARATUS
In the invention, a rotating cup includes a lower cup to be rotated about the axis of rotation by receiving a cup driving force applied from a rotating mechanism and an upper cup for collecting the liquid droplets scattered through the collection space while rotating about the axis of rotation integrally with the lower cup by being coupled to the lower cup. The upper cup includes a first coupling part allowing communication between the collection space and a discharge space by being located above the lower cup and forming a gap between the lower cup and the first coupling part, and an inclined part provided obliquely upward of a peripheral edge part of the substrate from the first coupling part and configured to collect the liquid droplets by an inclined surface facing the collection space.
Substrate support apparatus and substrate cleaning apparatus
A substrate support apparatus 100 has a support part 10 for supporting a substrate W; a moving part 50 which is adapted to abut on the support part 10 and to move the support part 10 along an axis direction; a fluid pipe 60 at least a part of which is provided in the moving part 50, through which fluid flows and an outlet port 61 of which is covered by the support part 10 when the moving part 50 abuts on the support part 10; and a detection part 90 which detects a state of the fluid.
Liquid storage for facility chemical supply system
A lithography includes a storage tank that stores process chemical fluid, an anti-collision frame, and an integrated sensor assembly. The storage tank includes a dispensing port positioned at a lowest part of the storage tank in a gravity direction. The anti-collision frame is coupled to the storage tank. An integrated sensor assembly is disposed on at least one of the anti-collision frame and the storage tank to measure a variation in fluid quality in response to fluid quality measurement of fluid.
Method for processing a workpiece using a multi-cycle thermal treatment process
A method for processing a workpiece is provided. The method can include placing a workpiece on a susceptor disposed within a processing chamber. The method can include performing a multi-cycle thermal treatment process on the workpiece in the processing chamber. The multi-cycle thermal treatment process can include at least two thermal cycles. Each thermal cycle of the at least two thermal cycles can include performing a first treatment on the workpiece at a first temperature; heating a device side surface of the workpiece to a second temperature in less than one second; performing a second treatment on the workpiece at approximately the second temperature; and cooling the workpiece subsequent to performing the second treatment.