A battery disconnect unit including a housing, an electronic relay module installed on a charge/discharge line of a battery within the housing and including electronic switch devices capable of a switching operation of selectively blocking the flow of a current in the charge/discharge line, a heat dissipation cover provided with a structure surrounding at least a portion of the electronic relay module and formed of a material capable of heat exchange with the electronic relay module, and a cooling plate disposed in contact with the heat dissipation cover and provided to allow a refrigerant to flow in the cooling plate.

An object of the present invention is to provide a semiconductor device whose surfaces on both sides can be cooled and which has a function of insulating, on both the surfaces, the internal structure of a semiconductor package from the outside. The semiconductor device includes a first semiconductor package and a second semiconductor package. The second semiconductor package is joined on the first semiconductor package in such a manner that a first exposed surface of the first semiconductor package and a fourth exposed surface of the second semiconductor package are connected so as to face each other, and a second exposed surface of the first semiconductor package and a third exposed surface of the second semiconductor package are connected so as to face each other.

Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier. The fixing device comprises: a first holder including a first cylindrically-shaped rod, wherein the first cylindrically-shaped rod can pass through a first cooling portion of the double-sided heat sink and a mounting hole of the carrier to fix the first cooling portion to a first side of the carrier, and the first cylindrically-shaped rod comprises a through-hole extending along a longitudinal direction; and a second holder including a second cylindrically-shaped rod, wherein the second cylindrically-shaped rod can pass through a mounting hole of a second cooling portion of the double-sided heat sink and the through-hole of the first holder, such that the second holder is coupled with the first holder to fix the second cooling portion to a second side of the carrier opposite to the first side.

One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.

Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

An object of the present invention is to provide a semiconductor device whose surfaces on both sides can be cooled and which has a function of insulating, on both the surfaces, the internal structure of a semiconductor package from the outside. The semiconductor device includes a first semiconductor package and a second semiconductor package. The second semiconductor package is joined on the first semiconductor package in such a manner that a first exposed surface of the first semiconductor package and a fourth exposed surface of the second semiconductor package are connected so as to face each other, and a second exposed surface of the first semiconductor package and a third exposed surface of the second semiconductor package are connected so as to face each other.

An electric working machine includes: a motor; a semiconductor element that is provided in a current path to the motor and completes or interrupts the current path; a circuit board on which the semiconductor element is mounted, a control circuit that turns on and off the semiconductor element to control energization to the motor being assembled to the circuit board; and a heat sink for dissipating heat from the semiconductor element. The semiconductor element is attached to the heat sink via a metal-based board.

A semiconductor package has central region and peripheral region surrounding central region. The semiconductor package includes dies, encapsulant, and redistribution structure. The dies include functional die and first dummy dies. Functional die is disposed in central region. First dummy dies are disposed in peripheral region. Redistribution structure is disposed on encapsulant over the dies, and is electrically connected to functional die. Vacancy ratio of central region is in the range from 1.01 to 3.00. Vacancy ratio of the peripheral region is in the range from 1.01 to 3.00. Vacancy ratio of central region is a ratio of total area of central region to total area occupied by dies disposed in central region. Vacancy ratio of peripheral region is a ratio of total area of peripheral region to total area occupied by first dummy dies disposed in peripheral region.

A semiconductor package has central region and peripheral region surrounding central region. The semiconductor package includes dies, encapsulant, and redistribution structure. The dies include functional die and first dummy dies. Functional die is disposed in central region. First dummy dies are disposed in peripheral region. Redistribution structure is disposed on encapsulant over the dies, and is electrically connected to functional die. Vacancy ratio of central region is in the range from 1.01 to 3.00. Vacancy ratio of the peripheral region is in the range from 1.01 to 3.00. Vacancy ratio of central region is a ratio of total area of central region to total area occupied by dies disposed in central region. Vacancy ratio of peripheral region is a ratio of total area of peripheral region to total area occupied by first dummy dies disposed in peripheral region.

Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.