A semiconductor die is provided. The semiconductor die includes a plurality of transistors arranged at a front side of a semiconductor substrate and an electrically conductive structure and a trench extending from a backside of the semiconductor substrate into the semiconductor substrate. A length of the trench is equal or larger than a lateral dimension of the semiconductor substrate.

An exemplary base includes a heat absorber and clips attached to the heat absorber. The heat absorber includes a top surface and a bottom surface. A pair of receiving grooves is defined in opposite lateral sides of the heat absorber, respectively. Each receiving groove is located above a level of the bottom surface and below a level of the top surface. Each clip includes a positioning beam. The positioning beam is received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed in the positioning beam thereby fixing the positioning beam in the receiving groove. A heat dissipating module having the base is also provided.

A semiconductor module includes a conductor layer, an insulating plate, a circuit pattern layer, and semiconductor chips disposed in this order. The conductor layer has a first through hole. The insulating plate has a second through hole having an opening size larger than the first through hole at a location facing the first through hole. The circuit pattern layer has an opening having an opening size larger than the second through hole at a location facing the second through hole. When the semiconductor module is connected to a cooling member, heat transfer medium is disposed between the conductor layer and the cooling member. A screw member is inserted into the opening and second and first through holes and screwed into a screw attachment hole. The screw member presses an area around the first through hole inside the second through hole toward the cooling member.

A package structure includes a bottom plate, a semiconductor package, a top plate, a screw and an anti-loosening coating. The semiconductor package is disposed over the bottom plate. The top plate is disposed over the semiconductor package, and includes an internal thread in a screw hole of the top plate. The screw penetrates through the bottom plate, the semiconductor package and the top plate, and includes an external thread. The external thread of the screw is engaged to the internal thread of the top plate, and the anti-loosening coating is adhered between the external thread and the internal thread.

A semiconductor device according to the present disclosure includes an electrically conductive first electrode block, an electrically conductive submount, an insulating layer, a semiconductor element, an electrically conductive bump, and an electrically conductive second electrode block. The submount is provided in a first region of the upper surface of the first electrode block, and electrically connected to the first electrode block. The semiconductor element is provided on the submount, and has a first electrode electrically connected to the submount. The bump is provided on the upper surface of a second electrode, opposite the first electrode, of the semiconductor element, and electrically connected to the second electrode. A third region of the lower surface of the second electrode block is electrically connected to the bump via an electrically conductive metal layer. An electrically conductive metal sheet is provided between the metal layer and the bump.

A heat dissipation structure of a semiconductor device with excellent heat dissipation applicable to surface-mount thin semiconductor devices is provided, and preferably a heat dissipation structure of a semiconductor device also with excellent insulating reliability is provided. In a heat dissipation structure 101 of a semiconductor device 10, the semiconductor device 10 has an electric bonding surface 11a electrically connected with a substrate 20 and a heat dissipation surface 11b on an opposite side thereof, wherein the heat dissipation surface 11b is bonded or contacted to a heat spreader 31 via a non-insulated member 32, and the heat spreader 31 is bonded or contacted to a heat sink 30 via an insulated member 41.

Devices, systems, and methods for dissipating heat generated from an electrical current carrying device are provided herein. The disclosed concept provides a dielectric heat path device that assists in heat dissipation of an electrical current carrying device by transferring heat from one end of the device to another. The disclosed concept also provides systems that communicate heat generated by an electrical device to a thermally grounded secondary device through a dielectric heat path device to dissipate heat.

A heat dissipation device includes a base, a fin assembly mounted on a top surface of the base, and a heat absorber arranged at a bottom surface of the base. The bottom surface of the base defines a recess corresponding to the heat absorber. The heat absorber is embedded in the recess. A fixing plate is positioned at the bottom surface of the base to cover the recess and define a sealed/airtight cavity between the fixing plate and the base. A top end of the heat absorber is received in the sealed/airtight cavity. A top end of the heat absorber extends through the fixing plate to expose out of the sealed/airtight cavity. A flexible sheet is totally received in the sealed/airtight cavity to buffer a stress generated by assembling the heat dissipation device with external elements.

Micro devices having enhanced through printed circuit board (PCB) heat transfer are provided. In one example, a micro device is provided that includes a PCB, a thermal management device, a chip package, a bracket, and a plurality of extra-package heat conductors. The chip package has a first side facing the thermal management device and a second side mounted to a first side of the PCB. The bracket is disposed on a second side of the PCB that faces away from the chip package. The plurality of extra-package heat conductors are disposed laterally outward of the chip package and provide at least a portion of a thermally conductive heat transfer path between the bracket and the thermal management device through the PCB.

A heat sink structure includes a heat sink; a threaded heat sink base pocket within the heat sink; a module lid, where the module lid thermally interfaces with a die; a threaded exterior portion of the module lid; and a thread engagement between the threaded heat sink base pocket and the threaded exterior portion of the module lid, where the thread engagement mechanically couples the heat sink to the module lid.