In an IO region of a semiconductor integrated circuit device, placed is an IO cell row including a signal IO cell and a power IO cell supplying a first power supply. The power IO cell includes first and second external terminals connected to an external connection pad and an electrostatic discharge (ESD) protection device formed at least in a region between the first and second external terminals. The first external terminal is placed at a position having an overlap in the Y direction with a power supply line for a second power supply.

A semiconductor device includes a first interconnect and a second interconnect, a substrate between the first and second interconnects and one or more wells on the substrate on a first level. A second level includes a first fin and a second fin, each on the one or more wells, where the first fin and the one or more wells include dopants of a first conductivity type and the second fin includes a dopant of a second conductivity type. A third fin is over a first region between the substrate and the first interconnect, and a fourth fin is over a second region between the substrate and the second interconnect. A third interconnect is electrically coupled between the first interconnect and the first fin and a fourth interconnect is electrically coupled between the second interconnect and the second fin.

An ESD protection circuit in an interface circuit has a first diode coupled between a first power source of an integrated circuit device and an input/output pad of the integrated circuit device, a second diode coupled between a second power source of the integrated circuit device and the input/output pad, and a resistive element that couples the second diode to the first diode and to the input/output pad. The first power source supplies a driver circuit coupled to the input/output pad. The second power source supplies one or more core circuits of the integrated circuit device. The resistive element may be implemented as an interconnect configured to provide a resistance that produces a voltage differential between a terminal of the second diode and a corresponding terminal of the first diode during an electrostatic discharge event.

An integrated circuit is formed by a semiconductor part with a semiconductor substrate and an interconnection part including levels of metals. An electrostatic-discharge sensor includes a semiconductor structure in the semiconductor part and a network of metal antennas in the interconnection part. The electrostatic-discharge sensor has at least one pair of two nodes having one of a resistive link or a capacitive link or a PN-junction link in the semiconductor structure. The antennas of the network of antennas coupled to the nodes of the least one pair of two nodes exhibit an asymmetry in one or more of shape and size.

A circuit includes a switch coupled between a configuration terminal and an internal node. In a method of operation, the configuration terminal of the circuit is coupled to an internal node during a configuration phase and decoupled from the internal node during normal operation.

The present disclosure provides an electro-static discharge protection device for a semiconductor, including: a substrate of a first conductive type, a deep well region of a second conductive type being formed in the substrate of the first conductive type; first diodes, located in the deep well region of the second conductive type, anodes of the first diodes being connected to a first voltage through a plurality of first metal lines; second diodes, located in the deep well region of the second conductive type; a first pad, connected to the anodes of the first diodes through the plurality of first metal lines, and connected to the first voltage; a second pad, connected to cathodes of the second diodes through a plurality of second metal lines, and connected to a second voltage.

A device includes a diode circuit. The diode circuit is coupled between a first input/output (I/O) pin and a second I/O pin of a circuit, and is configured to be turned off. The diode circuit is configured to provide a first discharging path for the first I/O pin of the circuit and a second discharging path for the second I/O pin of the circuit. The diode circuit includes a first transistor and a second transistor. The first transistor is between a node and the first I/O pin. The second transistor is between the node and the second I/O pin. The node is configured to receive a first voltage, and control terminals of the first transistor and the second transistor are configured to receive a second voltage. A voltage difference between the first voltage and the second voltage is configured to turn off the first transistor and the second transistor.

A display device includes a substrate that includes a display area and a peripheral area outside the display area, a display element on the display area, a peripheral circuit on the peripheral area, the peripheral circuit including a thin film transistor, a first shielding layer on the peripheral circuit. and a second shielding layer on the first shielding layer. At least one of the first shielding layer and the second shielding layer includes a hole. One shielding layer of the first shielding layer and the second shielding layer includes the hole and overlaps the other one of the first shielding layer and the second shielding layer.

An electrostatic protection circuit and a manufacturing method thereof, an array substrate, and a display device are provided. The electrostatic protection circuit includes: at least one first transistor and at least one second transistor. A gate electrode and a first electrode of the first transistor are connected to a first signal line, and a second electrode of the first transistor is connected to a second signal line. A gate electrode and a first electrode of the second transistor are connected to the second signal line, and a second electrode of the second transistor is connected to the first signal line.

An integrated circuit with a fault reporting structure. The integrated circuit has at least one power MOSFET having a plurality of MOSFET cells with each MOSFET cell having a drain metal and a source metal, and the integrated circuit has a power MOSFET area for routing the drain metals and the source metals of the plurality of MOSFET cells. The fault reporting structure has a metal net routed in the power MOSFET area or in an area above or below the power MOSFET area.