An aspect relates to an apparatus including a first and second power rails; a first set of power switch cells coupled to the first and second power rails, the first set of power switch cells being cascaded from an output to an input of a control circuit; and a second set of power switch cells coupled to the first and second power rails, the second set of power switch cells being coupled to one of a pair of cells of the first set, the first output, and the first input of the control circuit. Another aspect relates to a method including propagating a control signal via a first set of cascaded power switch cells to sequentially couple a first power rail to a second power rail; and propagating the control signal via a second set of power switch cells coupled between a pair of cells of the first set.

A system and method for providing electrical circuit design using cells with metal lines are described herein. According to one embodiment, a method includes instantiating a first parameterized cell (PCELL) into a first region of a row of an electrical circuit design. The first PCELL includes field effect transistor (FET) data representing a FET structure having a horizontal dimension and first metal track data representing a first set of adjustable parallel metal line segments extending along the horizontal dimension of the FET structure. The method also includes instantiating a second PCELL into a second region of the row adjacent to the first region. The second PCELL includes second metal track data representing a second set of adjustable parallel metal line segments. The method further includes connecting the first set of adjustable parallel metal line segments to the second set of adjustable parallel metal line segments and eliminating a connectivity short.

Semiconductor devices are provided. A semiconductor device includes a semiconductor substrate, a power switch, a first power mesh and a second power mesh. The power switch is formed over the front surface of the semiconductor substrate. The first power mesh is formed over the power switch and is directly connected to the first terminal of the power switch. The second power mesh is formed over the back surface of the semiconductor substrate and is directly connected to the second terminal of the power switch.

An object is to provide a semiconductor device with a novel structure. The semiconductor device includes a first wiring; a second wiring; a third wiring; a fourth wiring; a first transistor having a first gate electrode, a first source electrode, and a first drain electrode; and a second transistor having a second gate electrode, a second source electrode, and a second drain electrode. The first transistor is provided in a substrate including a semiconductor material. The second transistor includes an oxide semiconductor layer.

An object of the present invention is to provide a semiconductor device having a novel structure in which in a data storing time, stored data can be stored even when power is not supplied, and there is no limitation on the number of writing. A semiconductor device includes a first transistor including a first source electrode and a first drain electrode; a first channel formation region for which an oxide semiconductor material is used and to which the first source electrode and the first drain electrode are electrically connected; a first gate insulating layer over the first channel formation region; and a first gate electrode over the first gate insulating layer. One of the first source electrode and the first drain electrode of the first transistor and one electrode of a capacitor are electrically connected to each other.

In one embodiment, an integrated circuit apparatus includes a plurality of metallization layers, each metallization layer comprising voltage supply lines and signal lines. The apparatus also includes logic circuits formed between respective pairs of metallization layers, with each logic circuit comprising non-CMOS logic devices to perform an operation on a respective bit of an input set of bits. The non-CMOS logic devices may include one or more of ferroelectric field-effect transistor (FeFET) devices or spintronic logic devices (e.g., magnetoelectric spin orbit (MESO) devices or ferroelectric spin orbit logic (FSOL) devices), and each logic circuit may be formed on a different vertical plane within the apparatus.

Structures for a semiconductor device including airgap isolation and methods of forming a semiconductor device structure that includes airgap isolation. The structure includes a trench isolation region, an active region of semiconductor material surrounded by the trench isolation region, and a field-effect transistor including a gate within the active region. The structure further includes a dielectric layer over the field-effect transistor, a first gate contact coupled to the gate, and a second gate contact coupled to the gate. The first and second gate contacts are positioned in the dielectric layer over the active region, and the second gate contact is spaced along a longitudinal axis of the gate from the first gate contact. The structure further includes an airgap including a portion positioned in the dielectric layer over the gate between the first and second gate contacts.

An integrated circuit includes a first-type active-region structure, a second-type active-region structure on a substrate, and a plurality of gate-conductors. The integrated circuit also includes a backside horizontal conducting line in a backside first conducting layer below the substrate, a backside vertical conducting line in a backside second conducting layer below the backside first conducting layer, and a pin-connector for a circuit cell. The pin-connector is directly connected between the backside horizontal conducting line and the backside vertical conducting line. The backside horizontal conducting line extends across a vertical boundary of the circuit cell.

An object is to provide a semiconductor device with a novel structure. The semiconductor device includes a first wiring; a second wiring; a third wiring; a fourth wiring; a first transistor having a first gate electrode, a first source electrode, and a first drain electrode; and a second transistor having a second gate electrode, a second source electrode, and a second drain electrode. The first transistor is provided in a substrate including a semiconductor material. The second transistor includes an oxide semiconductor layer.

In one embodiment, the standard cell includes first and second active regions defining an intermediate region between the first and second active regions; and first, second and third gate lines crossing the first and second active regions and crossing the intermediate region. The first gate line is divided into an upper first gate line and a lower first gate line by a first gap insulating layer in the intermediate region, the second gate line is undivided, and the third gate line is divided into an upper third gate line and a lower third gate line by a second gap insulating layer in the intermediate region.