H01L27/14641

Selective nitrided gate-oxide for RTS noise and white-pixel reduction
11700464 · 2023-07-11 · ·

A pixel cell includes a nitrogen-implanted region at a semiconductor material-gate oxide proximate interface located in a region above a photodiode. The pixel cell is further devoid of implanted nitrogen in channel regions of a plurality of pixel transistors. Thus, Si—N bonds are formed at the semiconductor material-gate oxide interface in the region above the photodiode, while the channel regions are protected from nitrogen implantation at the semiconductor material-gate oxide interface. Methods of forming the pixel cell are also described.

SOLID-STATE IMAGING ELEMENT

A solid-state imaging element that includes a semiconductor layer, a floating diffusion region (FD), a penetrating pixel separation region, and a non-penetrating pixel separation region. In the semiconductor layer, a visible-light pixel (PDc) that receives visible light and an infrared-light pixel (PDw) that receives infrared light are two-dimensionally arranged. The floating diffusion region is provided in the semiconductor layer and is shared by adjacent visible-light and infrared-light pixels. The penetrating pixel separation region is provided in a region excluding a region corresponding to the floating diffusion region in an inter-pixel region of the visible-light pixel and the infrared-light pixel, and penetrates the semiconductor layer in a depth direction. The non-penetrating pixel separation region is provided in the region corresponding to the floating diffusion region in the inter-pixel region, and reaches a midway part in the depth direction from the light receiving surface of the semiconductor layer.

IMAGING ELEMENT AND IMAGING DEVICE

An imaging element is disclosed that includes: a semiconductor substrate; a multilayer wiring layer; a plurality of structures; and a light reflecting layer. The semiconductor substrate has a first surface as a light incidence surface and a second surface opposite to the first surface. A light receiving section of the semiconductor substrate generates electric charge through photoelectric conversion. The multilayer wiring layer has a plurality of wiring layers and is on the second surface side of the semiconductor substrate. The plurality of structures is in the multilayer wiring layer. The light reflecting layer is in the multilayer wiring layer, and forms a reflective region or a non-reflective region in a region with the interlayer insulating layer interposed in between. The region has none of the structures formed therein. The reflective region and the non-reflective region are substantially symmetrical with respect to the optical center of the pixel.

Solid-state imaging element and imaging apparatus

A solid-state imaging element of a pixel sharing type with improved driving of transistors is disclosed. A first electric charge accumulating section and a second electric charge accumulating section are arranged in a predetermined direction. A first transfer section transfers electric charge from first photoelectric conversion elements to the first electric charge accumulating section, causing it to accumulate the electric charge. A second transfer section transfers electric charge from second photoelectric conversion elements to the second electric charge accumulating section, causing it to accumulate the electric charge. A first transistor is configured to output a signal corresponding to an amount of the electric charge accumulated in each of the first electric charge accumulating section and the second electric charge accumulating section. A second transistor is arranged with the first transistor in the predetermined direction and connected in parallel to the first transistor.

IMAGING DEVICE

An imaging device includes a counter electrode, a photoelectric conversion layer that converts light into a signal charge, a plurality of sets of electrodes each of which collects the signal charge, each of the plurality of sets including a first electrode included in a high-sensitivity pixel and a second electrode included in a low-sensitivity pixel, and an auxiliary electrode which is located, as seen in plan view, between the first electrode and the second electrode in each of the plurality of sets and which is commonly included in the high-sensitivity pixel and the low-sensitivity pixel. The distance between the first electrode and the auxiliary electrode is different from the distance between the second electrode and the auxiliary electrode.

VERTICAL TRANSFER STRUCTURES
20230215900 · 2023-07-06 · ·

Pixels, such as for image sensors and electronic devices, include a photodiode formed in a semiconductor substrate, a floating diffusion, and a transfer structure selectively coupling the photodiode to the floating diffusion. The transfer structure includes a transfer gate formed on the semiconductor substrate, and a vertical channel structure including spaced apart first doped regions formed in the semiconductor substrate between the transfer gate and the photodiode. Each spaced apart first doped region is doped at a first dopant concentration with a first-type dopant. The spaced apart first doped regions are formed in a second doped region doped at a second dopant concentration with a second-type dopant of a different conductive type.

IMAGE PROCESSING DEVICE FOR CONTROLLING PIXEL OUTPUT LEVEL AND OPERATING METHOD THEREOF
20230217129 · 2023-07-06 ·

An image sensor includes a pixel array that includes a first pixel group located in a first row and including a first select transistor and a first floating diffusion region, a second pixel group located in a second row and including a second select transistor and a second floating diffusion region, and a column line connected to both the first pixel group and the second pixel group. While charges generated by a photoelectric conversion element of the first pixel group are transferred to the first floating diffusion region, the first select transistor is turned off, the second select transistor is turned on, and a first voltage is applied to the column line through the second select transistor. A photoelectric conversion element of the second pixel group generates charges prior to the photoelectric conversion element of the first pixel group, so as to be transferred to the second floating diffusion region.

Image sensor and operating method
11552122 · 2023-01-10 · ·

An image sensor includes unit pixels of a first pixel group sharing a first floating diffusion region and associated with a single color filter, and unit pixels of a second pixel group sharing a second floating diffusion region and associated with the single color filter. Control logic may generate an image by obtaining capacitance having a first value from the first floating diffusion region at a first time, and obtaining capacitance having a second value different from the first value from the second floating diffusion region at a second time following the first time. The first pixel group and the second pixel s group have different sensitivity levels.

Photoelectric conversion apparatus and imaging system
11695023 · 2023-07-04 · ·

An apparatus includes a plurality of pixels and a plurality of microlenses. Each of the pixels has a first conversion unit and a second conversion unit surrounding the first conversion unit. The first conversion unit and the second conversion unit each have a light portion to receive light from a corresponding microlens. The first conversion unit and the second conversion unit are under the corresponding microlens. The pixels includes two or more pixels varying in an area ratio between an area of the light *portion of the first conversion unit and an area of the light portion of the second conversion unit.

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

A solid-state imaging device includes a light-receiving surface, a plurality of pixels each including a photoelectric conversion section that photoelectrically converts light incident through the light-receiving surface, and a separation section that electrically and optically separates each photoelectric conversion section. Each of the pixels includes a charge-holding section that holds charges transferred from the photoelectric conversion section, a transfer transistor that includes a vertical gate electrode reaching the photoelectric conversion section, and transfers charges from the photoelectric conversion section to the charge-holding section, and a light-blocking section disposed in a layer between the photoelectric conversion section and the charge-holding section. A plurality of the vertical gate electrodes are electrically coupled together in a plurality of first pixels adjacent to each other among the plurality of pixels.