A solar cell is discussed. The solar cell according to an embodiment includes a photoelectric conversion unit including a first conductive type region and a second conductive type region formed on the same side of the photoelectric conversion unit; and an electrode formed on the photoelectric conversion unit and including an adhesive layer formed on the photoelectric conversion unit and an electrode layer formed on the adhesive layer, wherein the adhesive layer has a coefficient of thermal expansion that is greater than a coefficient of thermal expansion of the photoelectric conversion unit and is less than a coefficient of thermal expansion of the electrode layer.

A photovoltaic cell module includes a photovoltaic cell layer, conductive or non-conductive connection points between photovoltaic cells and interconnected busbars, a grid line bonding layer and a grid line supporting layer provided on surfaces of the photovoltaic cells. The grid line supporting layer adheres to the surfaces of the photovoltaic cells by a bonding effect of the grid line bonding layer. The grid line supporting layer is laminated on the interconnected busbars. A method of manufacturing the module includes: firstly, preliminarily fixing interconnected busbars on the surfaces of photovoltaic cells via conductive or non-conductive connection points; then covering the surfaces of the photovoltaic cells with a grid line supporting layer and a grid line bonding layer, applying pressure on the grid line supporting layer and the grid line bonding layer, and completely fixing the interconnected busbars to the surfaces of the photovoltaic cells by the grid line supporting layer.

System and method of providing a photovoltaic (PV) cell having a cushion layer to alleviate stress impact between a front metal contact and a thin film PV layer. A cushion layer is disposed between an extraction electrode and a photovoltaic (PV) surface. The cushion layer is made of a nonconductive material and has a plurality of vias filled with a conductive material to provide electrical continuity between the bus bar and the PV layer. The cushion layer may be made of a flexible material preferably with rigidity that matches the substrate. Thus, the cushion layer can effectively protect the PV layer from physical damage due to tactile contact with the front metal contact.

Systems and methods for manufacturing solar panels are disclosed. Solar cells are placed on a conveyor that transports the cells from a start point to an end point. A laser scribing module scribes the cells at a predetermined depth. A paste dispensing module deposits a predetermined amount of conductive paste on the surface of the solar cells. A cleaving apparatus divides the cells into smaller strips. A shingling module creates a string of cells by overlapping the strips. A targeted annealing module cures the paste, and a layup module places the strings on a backsheet. A glass cover is then added to one side of the strings.

Tri-layer semiconductor stacks for patterning features on solar cells, and the resulting solar cells, are described herein. In an example, a solar cell includes a substrate. A semiconductor structure is disposed above the substrate. The semiconductor structure includes a P-type semiconductor layer disposed directly on a first semiconductor layer. A third semiconductor layer is disposed directly on the P-type semiconductor layer. An outermost edge of the third semiconductor layer is laterally recessed from an outermost edge of the first semiconductor layer by a width. An outermost edge of the P-type semiconductor layer is sloped from the outermost edge of the third semiconductor layer to the outermost edge of the third semiconductor layer. A conductive contact structure is electrically connected to the semiconductor structure.

A high efficiency configuration for a solar cell module comprises solar cells arranged in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency. The solar cell module may comprise for example a series connected string of N greater than or equal to 25 rectangular or substantially rectangular solar cells having on average a breakdown voltage greater than about 10 volts, with the solar cells grouped into one or more super cells each of which comprises two or more of the solar cells arranged in line with long sides of adjacent solar cells overlapping and conductively bonded to each other, and with no single solar cell or group of <N solar cells in the string of solar cells individually electrically connected in parallel with a bypass diode.

Fabrication methods and structures relating to multi-level metallization for solar cells as well as fabrication methods and structures for forming thin film back contact solar cells are provided.

Die-cutting approaches for foil-based metallization of solar cells, and the resulting solar cells are disclosed herein. Die-cutting approaches for foil-based metallization of solar cells include forming a plurality of semiconductor regions in or above a substrate and forming a patterned damage buffer in alignment with locations between the plurality of semiconductor regions. Additionally, a metal layer comprising a metal seed layer and/or metal foil is formed over the patterned damage buffer. The metal layer is cut by a cutting die at locations between the plurality of semiconductor regions by applying a mechanical force to the cutting die.

The present disclosure provides methods of fabricating a multijunction solar cell panel in which one or more of the steps are performed using an automated process. In some embodiments, the automated process uses machine vision.

A photovoltaic device and method include a substrate coupled to an emitter side structure on a first side of the substrate and a back side structure on a side opposite the first side of the substrate. The emitter side structure or the back side structure include layers alternating between wide band gap layers and narrow band gap layers to provide a multilayer contact with an effectively increased band offset with the substrate and/or an effectively higher doping level over a single material contact. An emitter contact is coupled to the emitter side structure on a light collecting end portion of the device. A back contact is coupled to the back side structure opposite the light collecting end portion.