A plurality of solar cells are arranged in a first direction and each provided with first and second electrodes on a one main surface side thereof. A wiring member includes a conductive layer and a resin sheet supporting the conductive layer, the conductive layer electrically connecting the first electrode of one of the solar cells adjacent to each other in the first direction to the second electrode of another one of the solar cells. An adhesive layer bonds the wiring member to each of the solar cells. The wiring member includes a first bonded portion bonded to the one solar cell via the adhesive layer, a second bonded portion bonded to the other solar cell via the adhesive layer, and a connection portion connecting the first bonded portion and the second bonded portion together, and an opening is provided in the conductive layer in the connection portion.

A solar cell module is discussed, which includes a plurality of strings each including a plurality of solar cells, which are connected in series to one another through an interconnector, a front transparent substrate disposed on front surfaces of the plurality of strings, a first encapsulant disposed between the front transparent substrate and the front surfaces of the plurality of strings, a first reflector disposed in a first space between the plurality of solar cells included in each string, which are separated from one another in a first direction corresponding to a longitudinal direction of each string, and a second reflector disposed in a second space between the plurality of strings, which are separated from one another in a second direction crossing the first direction. The first and second reflectors reflect incident light.

A photovoltaic module and its manufacturing method. The module includes a first support wafer made of sintered silicon and a second layer of single-crystal silicon.

A solar power system may comprise a back sheet that comprises an interconnect circuit coupling a plurality of cell tiles. A tiled solar cell, comprising a solar cell and encapsulating and glass layers, is inserted into the cell tiles of the hack sheet. Each solar cell is individually addressable through the use of the interconnect circuit. Moreover, the interconnect circuit of the back sheet is programmable and allows for dynamic interconnect routing between solar cells.

Fabrication methods and structures relating to multi-level metallization for solar cells as well as fabrication methods and structures for forming back contact solar cells are provided.

The invention, which discloses a back contact type solar cell module and a preparation method, relates to the technical field of solar cells. The back contact type solar cell module may comprise: N small cell pieces, p+ doped regions and n+ doped regions arranged in a staggered manner being provided on the back surface of the small cell piece, the p+ doped regions of the small cell piece being provided with positive electrode fine grid lines, the n+ doped regions of the small cell piece being provided with negative electrode fine grid lines, and each of the small cell pieces being not provided with a main grid line for collecting currents of the n+ doped regions and the p+ doped regions; (N−1) conductive strips, each of which includes a substrate and conductive patterns provided on the substrate, each of the substrates being provided between two adjacent small cell pieces, and the conductive patterns being used for electrically connecting fine grid lines with opposite polarities on two adjacent small cell pieces at intervals in sequence so as to connect the respective small cell pieces in series. The back contact type solar cell module provided in the implementation mode has a comparatively high efficiency stability, and a low resistance loss on silver grid lines, and the fill factor of the module is high.

Approaches for foil-based metallization of solar cells are described. For example, a method of fabricating a solar cell involves placing a metal foil over a metalized surface of a wafer of the solar cell. The method further involves placing a protection layer over the metal foil. The method further involves locating the metal foil with the metalized surface of the wafer. The protection layer preserves an optically consistent surface of the metal foil during the locating. The method also involves, subsequent to the locating, electrically contacting the metal foil to the metalized surface of the wafer.

According to one aspect of the disclosed subject matter, a monolithically isled solar cell is provided. The solar cell comprises a semiconductor layer having a light receiving frontside and a backside opposite the frontside and attached to an electrically insulating backplane. A trench isolation pattern partitions the semiconductor layer into electrically isolated isles on the electrically insulating backplane. A first metal layer having base and emitter electrodes is positioned on the semiconductor layer backside. A patterned second metal layer providing cell interconnection and connected to the first metal layer by via plugs is positioned on the backplane.

A first solar cell is electrically connected to a second solar cell electrically and arranged in an array direction. Each of the first and second solar cell comprises: a light-receiving surface; a rear surface; a plurality of n-type side electrodes and p-type side electrodes both formed in the array direction on the rear surface; a wiring member electrically connecting the first solar cell and the second solar cell and arranged over the plurality of n-type side electrodes and the plurality of p-type side electrodes; an n-type side electrode insulating member that is arranged over the wiring member and covers a part of the plurality of n-type side electrodes, the part facing the wiring member; and a p-type side electrode insulating member that is arranged over the wiring member and covers a part of the plurality of p-type side electrodes, the part facing the wiring member.

Local metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. For example, a solar cell includes a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding a semiconductor region.