A device comprises an integrated circuit (IC) die, a substrate, a printed circuit board (PCB), an antenna, and a waveguide stub. The IC die is affixed to the substrate, which comprises a signal launch on a surface of the substrate that is configured to emit or receive a signal. The substrate and the antenna are affixed to the PCB, such that the signal launch and a waveguide opening of the antenna are aligned and comprise a signal channel. The waveguide stub is arranged as a boundary around the signal channel. In some implementations, the waveguide stub has a height of λ/4, where λ represents a wavelength of the signal. In some implementations, the antenna includes the waveguide stub; in others, the substrate includes the waveguide stub.

An amplifier includes a package that includes a carrier amplifier having a carrier amplifier input and output, a peaking amplifier having a peaking amplifier input and output, and corresponding input and output leads. The package includes a first integrated passive device including a first capacitor structure. The first integrated passive device includes a first contact pad coupled to the peaking amplifier output and a second contact pad coupled to the peaking output lead. The package includes a second integrated passive device including a second capacitor structure. The second integrated passive device includes a third contact pad coupled to the carrier amplifier output and a fourth contact pad coupled to the carrier output lead. The amplifier includes input circuitry a combining node configured to combine a carrier output signal and a peaking output signal.

A coplanar waveguide structure includes a dielectric layer disposed over at least a portion of a substrate and a planar transmission line disposed within the dielectric layer. In some instances, the planar transmission line can include a conductive signal line and one or more ground lines. In other instances, the planar transmission line may include a conductive stacked signal line and one or more stacked ground lines.

The present disclosure facilitates impedance matching between a power amplifier and filters. A radio-frequency circuit includes a power amplifier, a plurality of transmit filters, a switch, a plurality of first matching networks, and a second matching network. The switch switches the plurality of transmit filters to be coupled to the power amplifier. The plurality of first matching networks are coupled between the plurality of transmit filters and the switch. The second matching network is coupled between the power amplifier and the switch. The second matching network includes a transmission line transformer.

Embodiments of the invention include autonomous vehicles and mm-wave systems for communication between components. In an embodiment the vehicle includes an electronic control unit (ECU). The ECU may include a printed circuit board (PCB) and a CPU die packaged on a CPU packaging substrate. In an embodiment, the CPU packaging substrate is electrically coupled to the PCB. The ECU may also include an external predefined interface electrically coupled to the CPU die. In an embodiment, an active mm-wave interconnect may include a dielectric waveguide, and a first connector coupled to a first end of the dielectric waveguide. In an embodiment, the first connector comprises a first mm-wave engine, and the first connector is electrically coupled to the external predefined interface. Embodiments may also include a second connector coupled to a second end of the dielectric waveguide, wherein the second connector comprises a second mm-wave engine.

A method for transmitting signals using a high frequency based integrated circuit beamforming antenna is disclosed. The method may comprise transferring an output signal of a radio frequency (RF) module to an RF transceiving unit; transferring an output signal of the RF transceiving unit to a signal converting unit including a feeding pillar; and transferring a wave signal from the signal converting unit to a traveling wave antenna unit, and the feeding pillar may convert the output signal of the RF transceiving unit to the wave signal.

A semiconductor structure and a method of forming the same are provided. A method of manufacturing the semiconductor structure includes: providing a substrate; depositing a first dielectric layer over the substrate; attaching a waveguide to the first dielectric layer; depositing a second dielectric layer to laterally surround the waveguide; and forming a first conductive member and a second conductive member over the second dielectric layer and the waveguide, wherein the first conductive member and the second conductive member are in contact with the waveguide. The waveguide is configured to transmit an electromagnetic signal between the first conductive member and the second conductive member.

A structure is provided that reduces the stress generated in a semiconductor device package during cooling subsequent to solder reflow operations for coupling semiconductor devices to a printed circuit board (PCB). Stress reduction is provided by coupling solder lands to metal-layer structures using traces on the PCB that are oriented approximately perpendicular to lines from an expansion neutral point associated with the package. In many cases, especially where the distribution of solder lands of the semiconductor device package are uniform, the expansion neutral point is in the center of the semiconductor device package. PCB traces having such an orientation experience reduced stress due to thermal-induced expansion and contraction as compared to traces having an orientation along a line to the expansion neutral point.

A semiconductor package is provided. The semiconductor package includes a semiconductor die, a stack of polymer layers, redistribution elements and a passive filter. The polymer layers cover a front surface of the semiconductor die. The redistribution elements and the passive filter are disposed in the stack of polymer layers. The passive filter includes a ground plane and conductive patches. The ground plane is overlapped with the conductive patches, and the conductive patches are laterally separated from one another. The ground plane is electrically coupled to a reference voltage. The conductive patches are electrically connected to the ground plane, electrically floated, or electrically coupled to a direct current (DC) voltage.

Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.