An integrated circuit (IC) chip includes a copper structure with an intermetallic coating on the surface. The IC chip includes a substrate with an integrated circuit. A metal pad electrically connects to the integrated circuit. The copper structure electrically connects to the metal pad. A solder bump is disposed on the copper structure. The surface of the copper structure has a coating of intermetallic. The copper structure can be a redistribution layer and a copper pillar that is disposed on the redistribution layer.

A power MOSFET includes a substrate, a dielectric layer, solder balls, first and second patterned-metal layers. The substrate includes an active surface, a back surface, a source region and a gate region on the active surface, and a drain region on the back surface. The first patterned-metal layer disposed on the active surface includes a source electrode, a gate electrode, a drain electrode and a connecting trace. The source and gate electrodes electrically connect the source and gate regions. The connecting trace located at an edge of the substrate electrically connects the drain electrode. The dielectric layer disposed on the active surface exposes the first patterned-metal layer. The second patterned-metal layer includes UBM layers covering the source, gate and drain electrodes and a connecting metal layer covering the connecting trace and extending to the edge to electrically connect the drain region. The solder balls are disposed on the UBM layers.

An integrated circuit includes a bottom substrate, a metal layer disposed over the bottom substrate and a hollow metal pillar disposed on the metal layer. The metal layer and the hollow metal pillar are electrically connected.

In the semiconductor device, a bump electrode which connects a semiconductor chip and a wiring board is made up of a first part surrounded by an insulating film and a second part exposed from the insulating film. Since it is possible to reduce a width of the bump electrode while increasing a height of the bump electrode, a distance between the neighboring bump electrodes can be increased, and a filling property of a sealing material can be improved.

A semiconductor device manufacturing method improves the yield of manufacturing semiconductor devices. There are provided an insulating film for covering multiple bonding pads, a first protective film over the insulating film, and a second protective film over the first protective film. In semiconductor chips, multiple electrode layers are coupled electrically to each of the bonding pads via first openings formed in the insulating film and second openings formed in the first protective film. Multiple bump electrodes are coupled electrically to each of the electrode layers via third openings formed in the second protective film. In pseudo chips, the second openings are formed in the first protective film and the third openings are formed in the second protective film. The insulating film is exposed at the bottom of the second openings coinciding with the third openings. A protective tape is applied to a principal plane to cover the bump electrodes.

The present technology is directed to manufacturing semiconductor dies with under-bump metal (UBM) structures for die-to-die and/or package-to-package interconnects or other types of interconnects. In one embodiment, a method for forming under-bump metal (UBM) structures on a semiconductor die comprises constructing a UBM pillar by plating a first material onto first areas of a seed structure and depositing a second material over the first material. The first material has first electrical potential and the second material has a second electrical potential greater than the first electrical potential. The method further comprises reducing the difference in the electrical potential between the first material and the second material, and then removing second areas of the seed structure between the UBM pillars thereby forming UBM structures on the semiconductor die.

An integrated circuit includes a bottom substrate, a metal layer disposed over the bottom substrate and a hollow metal pillar disposed on the metal layer. The metal layer and the hollow metal pillar are electrically connected.

A method of manufacturing a semiconductor device forming a pad on the semiconductor substrate. A rewiring is formed that is electrically connected to the pad and led to a region outside the pad. A resin layer is formed on the rewiring. An external terminal is electrically connected to the rewiring via the resin layer. The resin layer is formed so as to enter the inside of a slit formed in a region along the periphery of the external terminal in the rewiring.

Disclosed is a semiconductor device suppressed in decrease of reliability. The semiconductor device comprises an electrode pad portion (2) formed on the upper surface of a semiconductor substrate (1), a passivation layer (3) so formed on the upper surface of the semiconductor substrate (1) as to overlap a part of the electrode pad portion (2) and having a first opening portion (3a) where the upper surface of the electrode pad portion (2) is exposed, a barrier metal layer (5) formed on the electrode pad portion (2), and a solder bump (6) formed on the barrier metal layer (5). The barrier metal layer (5) is formed such that an outer peripheral end (5b) lies within the first opening portion (3a) of the passivation layer (3) when viewed in plan.

A semiconductor device includes a semiconductor body with a front face and a back face, having an active zone located at the front face, a front surface metallization layer having a front face and a back face directed towards the active zone, the front surface metallization layer being provided on the front face of the semiconductor body and being electrically connected to the active zone, and a first barrier layer, including amorphous molybdenum nitride, located between the active zone and the metallization layer. Further, a method for producing such a device is provided.