Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/10
Bump connectors; Manufacturing methods related thereto
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H01L2224/119
Methods of manufacturing bump connectors involving a specific sequence of method steps
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H01L2224/11914
the under bump metallisation [UBM] being used as a mask for patterning other parts
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H01L2224/11914

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
20180315722 · 2018-11-01 ·

A barrier layer BAL is formed so as to be in contact with an aluminum pad ALP. A titanium alloy layer including a titanium film and a titanium nitride film is formed as barrier layer BAL. A seed layer SED is formed so as to be in contact with barrier layer BAL. A copper film is formed as seed layer SED. A silver bump AGBP is formed so as to be in contact with seed layer SED. Silver bump AGBP is constructed with a silver film AGPL formed by an electrolytic plating method. A tin alloy ball SNB is bonded to silver bump AGBP.