A thermosetting sheet according to the present invention includes: a thermosetting resin; a thermoplastic resin; and conductive particles. The conductive particles includes silver particles having an average particle size D.sub.50 of 0.01 μm or more and 10 μm or less, and having a circularity in cross section of 0.7 or more. The thermosetting sheet has a viscosity at 100° C. of 20 kPa.Math.s or more and 3000 kPa.Math.s or less.

The present invention is a laminate including a base sheet and a metal particle-containing layer laminated on the base sheet, and including metal particles. The base sheet has a contact surface in contact with the metal particle-containing layer, and a Young's modulus of the base sheet at 23° C., which is obtained by measuring the contact surface using a nano-indentation method, is 0.01 to 10 GPa.

A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on the first electrode and a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member, and curing the first composite and the second composite.

A first anisotropic conductive film 1A or a second anisotropic conductive film 1B has a first insulating resin layer 2 and a second insulating resin layer 3. The first insulating resin layer 2 is formed of a photopolymerized resin, and the second insulating resin layer 3 is formed of a polymerizable resin. Conductive particles 10 are disposed in a single layer on a surface of the first insulating resin layer 2 on a side of the second insulating resin layer 3. The first anisotropic conductive film further has a third insulating resin layer 4 formed of a polymerizable resin, and the second anisotropic conductive film 1B has an intermediate insulating resin layer 6. The intermediate insulating resin layer 6 is formed of a resin containing no polymerization initiator, and is in contact with the conductive particles 10. These anisotropic conductive films have favorable connection reliability.

A method of producing an anisotropic conductive film having a three-layer structure including a first connection layer, a second connection layer, and a third connection layer. The connection layers are each formed mainly of an insulating resin. The first connection layer is held between the second connection layer and the third connection layer.

A method for fabricating semiconductor die with die-attach preforms is disclosed. In embodiments, the method includes: applying an uncured die-attach paste material to a surface of a forming substrate to form one or more die-attach preforms, the surface of the forming substrate formed from a hydrophobic material; curing the one or more die-attach preforms; performing one or more planarization processes on the one or more die-attach preforms; coupling a first surface of a semiconductor die to a handling tool; and bonding a second surface of the semiconductor die to at least one die-attach preform of the one or more die-attach preforms.

The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 μm or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).

A method of connecting a plurality of electronic components to a flexible circuit board comprises: providing a carrier substrate carrying the electronic components, each of the electronic components having at least one electrical contact coated with electrically conductive adhesive; and applying the carrier substrate to the flexible circuit board such that the electronic components are adhered to the flexible circuit board in electrical contact therewith via the conductive adhesive. The electronic components may comprise LEDs and there may be provided one or more optical layers over the flexible circuit board.

This member connection method includes: a cutting step of forming cutting lines C in an adhesive layer at predetermined intervals at least in a width direction of an adhesive tape and making segments of the adhesive layer divided by the cutting lines C continuous at least in a lengthwise direction of the adhesive tape; a transfer step of disposing the segments to face a connection surface of one member to be connected, pressing a heating and pressing tool having an arbitrary pattern shape against the adhesive tape from a separator side and selectively transferring the segments to the one member to be connected; and a connection step for connecting another member to be connected to the one member to be connected via the segments transferred to the one member to be connected.

A dicing die bonding film according to the present invention includes: a dicing tape including a base layer and an adhesive layer laminated on the base layer; and a die bonding layer laminated on the adhesive layer of the deicing tape; the die bonding layer including a matrix resin, a thiol-group-containing compound, and conductive particles.