A method of and system for adhesive bonding by a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly; b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one selected from x-ray, e-beam, visible, or infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition; and c) adhesively joining two or more components together by way of the polymerizable adhesive composition, and a curable polymer for use therein.

A method of and system for adhesive bonding by a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly; b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one selected from x-ray, e-beam, visible, or infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition; and c) adhesively joining two or more components together by way of the polymerizable adhesive composition, and a curable polymer for use therein.

A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on the first electrode and a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member, and curing the first composite and the second composite.

An embedded-bridge substrate connector apparatus includes a patterned reference layer to which a first module and a subsequent module are aligned and the two modules are mated at the patterned reference layer. At least one module includes a silicon bridge connector that bridges to two devices, through the patterned reference layer, to the mated module.

A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on the first electrode and a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member, and curing the first composite and the second composite.

The present disclosure relates to an anisotropic conductive film (ACF) with controllable distribution state of conductive substance and a manufacturing method thereof. The ACF includes: a porous template, a plurality of conductive tubes, and an insulation glue layer. A plurality of through holes are configured on the porous template and to penetrate the porous template along a thickness direction of the porous template. Each of the conductive tubes is respectively inserted into one through hole and protrudes from the through hole at both ends, and the insulation glue layer is configured to wrap at least one protruding portion of the conductive tube protruding from the porous template. As such, the distribution state of the conductive tube may be controlled by controlling the density of the through holes within the porous template during the preparation process, and the distribution state of the conductive substances in the ACF may be precisely controlled.

A method for manufacturing a die attach film includes forming a plurality of posts on a support sheet. The method includes forming an adhesive layer between the posts. A thermal conductivity of the adhesive layer is lower than a thermal conductivity of the posts. The method includes removing the support sheet.

An embedded-bridge substrate connector apparatus includes a patterned reference layer to which a first module and a subsequent module are aligned and the two modules are mated at the patterned reference layer. At least one module includes a silicon bridge connector that bridges to two devices, through the patterned reference layer, to the mated module.

An anisotropic conductive film which can be used as a standard product as long as no problems arise in anisotropic conductive connections, even in a case where omissions are present in a prescribed disposition of conductive particles, includes a regular disposition region in which conductive particles are disposed regularly in an insulating resin binder, and has a length of 5 m or greater. A standard region including no sections with more than a prescribed number of consecutive omissions in conductive particles is present in the regular disposition region over a prescribed width in a short-side direction of the anisotropic conductive film and at least a prescribed length in a long-side direction of the anisotropic conductive film.

An anisotropic conductive film (ACF) is formed with an ordered array of discrete regions that include a conductive carbon-based material. The discrete regions, which may be formed at small pitch, are embedded in at least one adhesive dielectric material. The ACF may be used to mechanically and electrically interconnect conductive elements of initially-separate semiconductor dice in semiconductor device assemblies. Methods of forming the ACF include forming a precursor structure with the conductive carbon-based material and then joining the precursor structure to a separately-formed structure that includes adhesive dielectric material to be included in the ACF. Sacrificial materials of the precursor structure may be removed and additional adhesive dielectric material formed to embed the discrete regions with the conductive carbon-based material in the adhesive dielectric material of the ACF.