Package structure with folded die arrangements and methods of fabrication are described. In an embodiment, a package structure includes a first die and vertical interposer side-by-side. A second die is face down on an electrically connected with the vertical interposer, and a local interposer electrically connects the first die with the vertical interposer.

Embodiments of the disclosure relate to flexible electronic substrates for placement on an external surface of a vehicle motor assembly. In one embodiment, a motor assembly includes a motor comprising an external surface and one or more electronic assemblies positioned on the external surface of the motor. Each electronic assembly includes a metal substrate disposed on the external surface of the motor, a dielectric layer disposed on the metal substrate, a flexible metal base layer disposed on the dielectric layer, a bonding layer disposed on the flexible metal base layer, and one or more electronic devices disposed on the bonding layer. The bonding layer bonds the one or more electronic devices to the flexible metal base layer.

Embodiments of the disclosure relate to flexible electronic substrates for placement on an external surface of a vehicle motor assembly. In one embodiment, a motor assembly includes a motor comprising an external surface and one or more electronic assemblies positioned on the external surface of the motor. Each electronic assembly includes a metal substrate disposed on the external surface of the motor, a dielectric layer disposed on the metal substrate, a flexible metal base layer disposed on the dielectric layer, a bonding layer disposed on the flexible metal base layer, and one or more electronic devices disposed on the bonding layer. The bonding layer bonds the one or more electronic devices to the flexible metal base layer.

Examples herein relate to optical modules. In particular, implementations herein relate to optical modules that include top-emitting VCSELs and/or top-entry photodetectors. The optical modules include a substrate having opposing first and second sides. The optical modules further includes a first interposer having opposing first and second sides and a plurality of top-emitting vertical-cavity surface-emitting lasers (VCSELs). The VCSELs are flip-chipped to the second side of the first interposer such that they are disposed between the substrate and the first interposer. The VCSELs are configured to emit optical signals having different wavelengths. The optical signals are configured to be combined and transmitted over a single optical fiber. The optical modules include a plurality of electrical conductors forming electrical paths between electrical contacts of the top-emitting VCSELs and the substrate.

Examples herein relate to optical modules. In particular, implementations herein relate to optical modules that include top-emitting VCSELs and/or top-entry photodetectors. The optical modules include a substrate having opposing first and second sides. The optical modules further includes a first interposer having opposing first and second sides and a plurality of top-emitting vertical-cavity surface-emitting lasers (VCSELs). The VCSELs are flip-chipped to the second side of the first interposer such that they are disposed between the substrate and the first interposer. The VCSELs are configured to emit optical signals having different wavelengths. The optical signals are configured to be combined and transmitted over a single optical fiber. The optical modules include a plurality of electrical conductors forming electrical paths between electrical contacts of the top-emitting VCSELs and the substrate.

Embodiments may relate to a microelectronic package that includes a substrate signal path and a waveguide. The package may further include dies that are communicatively coupled with one another by the substrate signal path and the waveguide. The substrate signal path may carry a signal with a frequency that is different than the frequency of a signal that is to be carried by the waveguide. Other embodiments may be described or claimed.

Package structure with folded die arrangements and methods of fabrication are described. In an embodiment, a package structure includes a first die and vertical interposer side-by-side. A second die is face down on an electrically connected with the vertical interposer, and a local interposer electrically connects the first die with the vertical interposer.

Package structure with folded die arrangements and methods of fabrication are described. In an embodiment, a package structure includes a first die and vertical interposer side-by-side. A second die is face down on an electrically connected with the vertical interposer, and a local interposer electrically connects the first die with the vertical interposer.

A semiconductor light emitting element according to an embodiment of the present disclosure includes: a n-type semiconductor layer; a p-type semiconductor layer formed in a first region on the n-type semiconductor layer; a p-type electrode formed on the p-type semiconductor layer; a n-type electrode formed in a second region different from the first region on the n-type semiconductor layer; and a magnetic layer formed under the n-type semiconductor layer.

An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.