Patent classifications
H
ELECTRICITY
Load children
H01
ELECTRIC ELEMENTS
Load children
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
Load children
2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/74
Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/75
Apparatus for connecting with bump connectors or layer connectors
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/75723
Electrostatic holding means
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/75724
in the lower part of the bonding apparatus, e.g. in the apparatus chuck
Filter patents View analytics View as hierarchy Open in page

H01L2224/75724

Apparatus and method for bonding substrates
12412865 · 2025-09-09 · ·

A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.

APPARATUS AND METHOD FOR BONDING SUBSTRATES
20250372571 · 2025-12-04 · ·

A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.