Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/74
Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
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H01L2224/78
Apparatus for connecting with wire connectors
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H01L2224/78986
Auxiliary members on the pressing surface
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H01L2224/78988
Material of the auxiliary member
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H01L2224/78988

WIREBONDING SYSTEMS AND RELATED METHODS
20250336880 · 2025-10-30 · ·

An anvil for a wirebonding system may include a stationary substrate having a top working surface; and a first layer fixedly coupled to the top working surface of the stationary substrate for receiving a workpiece, the first layer configured to accommodate a warped surface of the workpiece during a bonding operation.