A method of liquid assisted micro cold binding is provided. The method includes: forming a conductive pad on the substrate in which the conductive pad consists essentially of indium; forming a liquid layer on the conductive pad; placing a micro device having an electrode facing the conductive pad over the conductive pad such that the micro device is in contact with the liquid layer and is gripped by a capillary force produced by the liquid layer between the micro device and the conductive pad in which the electrode consists essentially of indium; and evaporating the liquid layer such that the electrode is bound to the conductive pad and is in electrical contact with the conductive pad.