A semiconductor device includes a first lead, a semiconductor element, a second lead, a conductive member, and a sealing resin. The first lead includes a die pad having a die-pad obverse surface facing a first side in a thickness direction. The semiconductor element has an element obverse surface facing the first side in the thickness direction and includes a first electrode disposed on the element obverse surface. The semiconductor element is mounted on the die-pad obverse surface. The second lead has a second obverse surface facing the first side in the thickness direction and is spaced apart from the first lead in a first direction perpendicular to the thickness direction. The conductive member is electrically bonded to the first electrode and the second obverse surface. The sealing resin covers the semiconductor element. The conductive member is in direct contact with the second lead.

A semiconductor device includes a conductive plate, and a terminal including a bonding portion having a rectangular plate shape in a plan view and having a bottom surface bonded to the conductive plate and a top surface having an indentation area with indentations, and a ramp portion integrally connected to the bonding portion at a rear end thereof and extending from the bonding portion upward in a direction away from the top surface. The indentation area includes a plurality of sub-indentation areas each having a thickness from the bottom surface in a thickness direction orthogonal to the bottom surface is less than a thickness of the bonding portion from the bottom surface to the top surface at an area other than the indentation area.

Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.