Methods related to plating a through-wafer via of a gallium arsenide integrated circuit are disclosed. For example, to improve copper plating, a seed layer formed in the through-wafer vias can be modified to increase water affinity, rinsed to remove contaminants, and activated to facilitate copper deposition. Other methods related to metallizing a through wafer via in gallium arsenide integrated circuits are disclosed. Such methods can include copper plating a through wafer via of a gallium arsenide integrated circuit.

Methods related to plating a through-wafer via of a gallium arsenide integrated circuit are disclosed. For example, to improve copper plating, a seed layer formed in the through-wafer vias can be modified to increase water affinity, rinsed to remove contaminants, and activated to facilitate copper deposition. Other methods related to metallizing a through wafer via in gallium arsenide integrated circuits are disclosed. Such methods can include copper plating a through wafer via of a gallium arsenide integrated circuit.

An apparatus for transferring a semiconductor die from a wafer tape to a product substrate. The apparatus includes a wafer frame configured to secure the wafer tape and a support frame configured to secure a support substrate. The support substrate includes a plurality of holes and secures the product substrate. The apparatus further includes an actuator to transfer the semiconductor die to a transfer location on the product substrate.

A method of attaching a semiconductor die or chip onto a support member such as a leadframe comprises: applying onto the support member at least one stretch of ribbon electrical bonding material and coupling the ribbon material to the support member, arranging at least one semiconductor die onto the ribbon material with the ribbon material between the support member and the semiconductor die, coupling the semiconductor die to the ribbon material.

A laminating structure of an electronic device using a transferring element according to the present disclosure includes a target substrate, a bottom electrode formed on the target substrate, an electronic device which is bonded to the bottom electrode, a top contact formed on the electronic device, a transferring element which is placed between the bottom electrode and the electronic device on the target substrate, and a top electrode connected to the electronic device, wherein the transferring element attached to the carrier substrate comes into contact with the electronic device, and is then transferred onto the target substrate.

LED packages and related methods are provided. The LED packages can include a submount having a top and bottom surface and a plurality of top electrically conductive elements on the top surface of the submount. An LED can be disposed on one of the top electrically conductive elements. The LED can emit a dominant wavelength generally between approximately 600 nm and approximately 650 nm, and more particularly between approximately 610 nm and approximately 630 nm when an electrical signal is applied to the top electrically conductive elements. A bottom thermally conductive element can be provided on the bottom surface and is not in electrical contact with the top electrically conductive elements. A lens can be disposed over the LED. The LED packages can have improved lumen performances, lower thermal resistances, improved efficiencies, and longer operational lifetimes.

LED packages and related methods are provided. The LED packages can include a submount having a top and bottom surface and a plurality of top electrically conductive elements on the top surface of the submount. An LED can be disposed on one of the top electrically conductive elements. The LED can emit a dominant wavelength generally between approximately 600 nm and approximately 650 nm, and more particularly between approximately 610 nm and approximately 630 nm when an electrical signal is applied to the top electrically conductive elements. A bottom thermally conductive element can be provided on the bottom surface and is not in electrical contact with the top electrically conductive elements. A lens can be disposed over the LED. The LED packages can have improved lumen performances, lower thermal resistances, improved efficiencies, and longer operational lifetimes.

A laminating structure of an electronic device using a transferring element according to the present disclosure includes a target substrate, a bottom electrode formed on the target substrate, an electronic device which is bonded to the bottom electrode, a top contact formed on the electronic device, a transferring element which is placed between the bottom electrode and the electronic device on the target substrate, and a top electrode connected to the electronic device, wherein the transferring element attached to the carrier substrate comes into contact with the electronic device, and is then transferred onto the target substrate.

Embodiments of the invention pertain to methods useful in transfer printing of small objects, like micro-LEDs from one substrate to another using acoustic or ultrasonic energy. The pickup of objects from a substrate is performed by transfer head equipped with sticky polymer and an array of ultrasonic transducers, and the high efficiency and selectivity of pickup of selected objects is done using ultrasonic energy directed towards the object. The disposing of objects to another substrate from a transfer head is done by directing an ultrasonic energy toward an object, which enable effective and selective detachment of an object from a sticky polymer. Yet another embodiment also uses a UV light source, which directs the light to the UV curable liquid disposed around the object on receiving substrate, thus curing this liquid would attach an object to receiving substrate.

Embodiments of the invention pertain to methods useful in transfer printing of small objects, like micro-LEDs from one substrate to another using acoustic or ultrasonic energy. The pickup of objects from a substrate is performed by transfer head equipped with sticky polymer and an array of ultrasonic transducers, and the high efficiency and selectivity of pickup of selected objects is done using ultrasonic energy directed towards the object. The disposing of objects to another substrate from a transfer head is done by directing an ultrasonic energy toward an object, which enable effective and selective detachment of an object from a sticky polymer. Yet another embodiment also uses a UV light source, which directs the light to the UV curable liquid disposed around the object on receiving substrate, thus curing this liquid would attach an object to receiving substrate.