A method for fabricating a thin-film integrated circuit, IC, including a plurality of electronic components, the method comprising: forming, using a first fabrication technique, the plurality of electronic components, and forming, using a second fabrication technique, a conductive layer on the plurality of electronic components to form a redistribution layer, RDL, wherein the first fabrication technique includes photolithographic patterning, and the first fabrication technique is different to the second fabrication technique.

A display device includes a substrate including a conductive pad, a driving chip facing the substrate and including a conductive bump electrically connected to the conductive pad and an inspection bump which is insulated from the conductive pad, and an adhesive member which is between the conductive pad and the driving chip and connects the conductive pad to the driving chip. The adhesive member includes a first adhesive layer including a conductive ball; and a second adhesive layer facing the first adhesive layer, the second adhesive layer including a first area including a color-changing material, and a second area adjacent to the first area and excluding the color-changing material.

The foldable display panel includes a substrate and a pixel array. The substrate has a surface and display and periphery areas thereon. The periphery area is on at least one side of the display area, and has first and second bonding areas. The first and second bonding areas are at opposite first and second sides of the periphery area, respectively. The first and second bonding areas are spaced apart by a first distance along a first direction. The substrate has a foldable line passing through a center of the display area between the first and the second bonding areas. The first and second sides are on two sides of the foldable line. The pixel array is on the display area and overlaps the foldable line. The pixel array is between the first and second sides and includes sub pixel units arranged in an array.

The foldable display panel includes a substrate and a pixel array. The substrate has a surface and display and periphery areas thereon. The periphery area is on at least one side of the display area, and has first and second bonding areas. The first and second bonding areas are at opposite first and second sides of the periphery area, respectively. The first and second bonding areas are spaced apart by a first distance along a first direction. The substrate has a foldable line passing through a center of the display area between the first and the second bonding areas. The first and second sides are on two sides of the foldable line. The pixel array is on the display area and overlaps the foldable line. The pixel array is between the first and second sides and includes sub pixel units arranged in an array.

A method for making an adsorption device includes: providing and etching a substrate to form a plurality of receiving grooves spaced apart from each other; forming a magnetic film in each of the plurality of receiving grooves; and forming a magnet in each of the plurality of receiving grooves. Each receiving groove includes a bottom wall and a side wall coupling the bottom wall. The magnetic film covers the bottom wall and the side wall of each of receiving groove.

The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern.

The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern.

A display device with high design flexibility is provided. The display device includes a display element, a touch sensor, and a transistor between two flexible substrates. An external electrode that supplies a signal to the display element and an external electrode that supplies a signal to the touch sensor are connected from the same surface of one of the substrates.

A bonding apparatus and method includes: a stage configured to fix a first electric component; a pressing unit configured to press a conductive adhesive film and a second electric component onto the first electric component; a driver configured to control movement of the pressing unit along a direction; and a plurality of sensors at different positions on the stage and configured to sense a change in capacitance with the pressing unit, wherein the pressing unit includes a flat metal material in first regions facing the plurality of sensors.

A display device includes a display panel, a circuit board, and a conductive adhesive member. The display panel includes a display area and a non-display area adjacent the display area. The circuit board overlaps the non-display area and is connected to the display panel. The conductive adhesive member is between and electrically connects the circuit board and the display panel. The circuit board includes: a base layer including a pad area; circuit pads overlapping the pad area and on the base layer, the circuit pads being spaced apart in a plan view and arranged in a direction; and a first resin layer overlapping the pad area and on the base layer. In a plan view, the first resin layer overlaps an area between two adjacent circuit pads and covers side surfaces of the two adjacent circuit pads facing in the direction.