A display module includes: a substrate including a mounting surface on which a plurality of inorganic light-emitting devices are mounted, a side surface, and a rear surface being opposite to the mounting surface; a front cover bonded with the mounting surface and covering the mounting surface; a metal plate bonded with the rear surface; a side cover surrounding the side surface; and a side end member covering at least one portion of a side end of the side cover, and including a first portion being in contact with and grounded to the metal plate and a second portion connected to the first portion and positioned on the side end of the side cover.

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.

Disclosed is a semiconductor package comprising a semiconductor chip, a first chip pad on a bottom surface of the semiconductor chip and adjacent to a first lateral surface in a first direction of the semiconductor chip, the first lateral surface separated from the first chip pad from a plan view in a first direction, and a first lead frame coupled to the first chip pad. The first lead frame includes a first segment on a bottom surface of the first chip pad and extending from the first chip pad in a second direction opposite to the first direction and away from the first lateral surface of the semiconductor chip, and a second segment which connects to a first end of the first segment and then extends along the first direction to extend beyond the first lateral surface of the semiconductor chip after passing one side of the first chip pad, when viewed in the plan view.

An anisotropic conductive film includes conductive particles disposed in an insulating resin layer. Zigzag arrangements are arranged at a predetermined pitch in an x direction on an xy plane in a plan view of the anisotropic conductive film with positions thereof in a y direction being periodically altered. The zigzag arrangements each include an arrangement Rb and an arrangement Rc repeatedly provided at predetermined intervals in the y direction. The arrangement Rb includes the conductive particles arranged at a positive inclination, and the arrangement Rc includes the conductive particles arranged at a negative inclination. This configuration can form a pseudo random regular disposition.

A light-emitting diode (LED) module includes: a glass substrate; a signal wiring layer provided on the glass substrate and including a plurality of electrodes connected by a passive matrix circuit; and a plurality of LEDs connected to the plurality of electrodes and configured to emit light toward the glass substrate, wherein the signal wiring layer further includes a boundary region that divides the LED module into a plurality of unit regions.

A connection structure including: a first circuit member having a plurality of first electrodes; a second circuit member having a plurality of second electrodes; and an intermediate layer having a plurality of bonding portions electrically connecting the first electrodes and the second electrodes, in which at least one of the first electrode and the second electrode that are connected by the bonding portion is a gold electrode, and 90% or more of the plurality of bonding portions include a first region containing a tin-gold alloy and connecting the first electrode and the second electrode and a second region containing bismuth and being in contact with the first region.

In various embodiments, a method for forming a bonded structure is disclosed. The method can comprise mounting a first integrated device die to a carrier. After mounting, the first integrated device die can be thinned. The method can include providing a first layer on an exposed surface of the first integrated device die. At least a portion of the first layer can be removed. A second integrated device die can be directly bonded to the first integrated device die without an intervening adhesive.

Various embodiments of the teachings herein include a semifinished product for use in the populating of a power electronics component by a connecting method. The product includes an electrically insulating prepreg frame electrically insulated. The prepreg frame is configured for surrounding an applied connecting material at a metallized installation site during the population. A material of the prepreg frame enables simultaneous processability of electrical connection and electrical insulation by compression of the insulation material in the form of the semifinished product since the processing parameters of the electrical connecting material and the semifinished product are compatible.

The present invention provides a bump structure of chip disposed on a surface of a chip and comprises a plurality of connecting-bump sets. Each connecting-bump set includes a first connecting hum and a second connecting hump. The first connecting bump and the second connecting bump include corresponding blocking structures. While disposing the chip on a board member, the blocking structure of the first connecting bump and the blocking structure of the second connecting bump block the conductive medium and retard the flow of the conductive medium. The conductive medium is forced to flow between the first connecting bump and the second connecting bump and thus preventing the conductive particles in the conductive medium from leaving the surfaces of the connecting bumps. In addition, there is a flow channel between the first and second connecting bumps. One or more width of the flow channel is between 0.1 μm and 8 μm.

An applying method includes the following steps. Firstly, a conductive adhesive including a plurality of conductive particles and an insulating binder is provided. Then, a carrier plate is provided. Then, a patterned adhesive is formed on the carrier plate by the conductive adhesive, wherein the patterned adhesive includes a first transferring portion. Then, a manufacturing device including a needle is provided. Then, the needle of the manufacturing device is moved to contact the first transferring portion. Then, the transferring portion is transferred to a board by the manufacturing device.