An adhesive for a semiconductor, comprising an epoxy resin, a curing agent, and a compound having a group represented by the following formula (1): ##STR00001##
wherein R.sup.1 represents an electron-donating group.

The present application provides a method for preparing a semiconductor package The method includes bonding a bottom device die onto a package substrate; attaching a top device die onto the bottom device die; attaching an additional package substrate onto the top device die; establishing electrical connection between the additional package substrate and the top device die, between the additional package substrate and the package substrate, and between the top device die and the package substrate; and encapsulating the bottom device die, the top device die and the additional package substrate by an encapsulant.

Provided is a thermosetting resin composition, which can be used as underfill for obtaining favorable solder connectivity while suppressing the formation of voids in the case of treating under heating conditions required by the underfill in a semiconductor chip thermocompression bonding step using the thermal compression bonding technique. The thermosetting resin composition contains a thermosetting resin, a curing agent and a fluxing agent, and the temperature at which the rate of temperature change of viscosity when temperature is increased according to a prescribed heating profile reaches 30 Pa.Math.s/° C. is 200° C. to 250° C.

Embodiments of the present disclosure describe scalable package architecture of an integrated circuit (IC) assembly and associated techniques and configurations. In one embodiment, an integrated circuit (IC) assembly includes a package substrate having a first side and a second side disposed opposite to the first side, a first die having an active side coupled with the first side of the package substrate and an inactive side disposed opposite to the active side, the first die having one or more through-silicon vias (TSVs) configured to route electrical signals between the first die and a second die, and a mold compound disposed on the first side of the package substrate, wherein the mold compound is in direct contact with a sidewall of the first die between the active side and the inactive side and wherein a distance between the first side and a terminating edge of the mold compound that is farthest from the first side is equal to or less than a distance between the inactive side of the first die and the first side. Other embodiments may be described and/or claimed.

Embodiments of the present disclosure describe scalable package architecture of an integrated circuit (IC) assembly and associated techniques and configurations. In one embodiment, an integrated circuit (IC) assembly includes a package substrate having a first side and a second side disposed opposite to the first side, a first die having an active side coupled with the first side of the package substrate and an inactive side disposed opposite to the active side, the first die having one or more through-silicon vias (TSVs) configured to route electrical signals between the first die and a second die, and a mold compound disposed on the first side of the package substrate, wherein the mold compound is in direct contact with a sidewall of the first die between the active side and the inactive side and wherein a distance between the first side and a terminating edge of the mold compound that is farthest from the first side is equal to or less than a distance between the inactive side of the first die and the first side. Other embodiments may be described and/or claimed.

A method of making a secure integrated-circuit system comprises providing a first integrated circuit in a first die having a first die size and providing a second integrated circuit in a second die. The second die size is smaller than the first die size. The second die is transfer printed onto the first die and connected to the first integrated circuit, forming a compound die. The compound die is packaged. The second integrated circuit is operable to monitor the operation of the first integrated circuit and provides a monitor signal responsive to the operation of the first integrated circuit. The first integrated circuit can be constructed in an insecure facility and the second integrated circuit can be constructed in a secure facility.

A method of making a secure integrated-circuit system comprises providing a first integrated circuit in a first die having a first die size and providing a second integrated circuit in a second die. The second die size is smaller than the first die size. The second die is transfer printed onto the first die and connected to the first integrated circuit, forming a compound die. The compound die is packaged. The second integrated circuit is operable to monitor the operation of the first integrated circuit and provides a monitor signal responsive to the operation of the first integrated circuit. The first integrated circuit can be constructed in an insecure facility and the second integrated circuit can be constructed in a secure facility.

A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The protective cover is supported by a standoff structure disposed on the die and below the protective cover. An encapsulant is disposed to cover the package substrate while leaving the top package surface exposed.

Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.

An imager module for a vehicle camera, the imager module having at least: a lens holder, a lens accommodated in the lens holder, a flexible conductor device having leads, and an image sensor contacted by the leads of the flexible conductor device that has a front side having a sensitive surface; the image sensor being contacted by the leads using flip-chip technology via stud bumps provided at the front side thereof. The lens holder has a plastic part, in particular an injection-molded part, having a tubular region for accommodating the lens and a fastening region having a bottom side; and the flexible conductor device being integrally attached to the bottom side of the fastening region, and a non-conductive adhesive region being formed between the front side of the image sensor and the flexible conductor device around the stud bumps, preferably to produce a tensile stress. An insertion part is preferably received in the plastic body.