A display apparatus includes a display panel including a lower base substrate and a connecting portion disposed on the lower base substrate, a flexible circuit board attached on a side surface of the display panel, and including a base film and a conductive pattern disposed on the base film, a conductive paste part disposed between the side surface of the display panel and the flexible circuit board, a first anisotropic conductive film (ACF) film disposed between the side surface of the display panel and the conductive paste part, and a second ACF film disposed between the conductive paste part and the flexible circuit board. The connecting portion is exposed at the side surface of the display panel, and the first ACF film directly makes contact with the connecting portion.

A camera device includes a lens assembly, a driver, and a photosensitive assembly. The driver drives the lens assembly. The photosensitive assembly is mounted to the lens assembly. The photosensitive assembly includes a filter, a photosensitive chip, a first circuit board, and a second circuit board. The first circuit board defines a first through hole. The photosensitive chip is received in the first through hole. The filter is fixed to a side of the first circuit board and covers the first through hole. The second circuit board is fixed to a side of the first circuit board facing away from the filter and is electrically coupled to the first circuit board. The photosensitive chip is electrically coupled to the second circuit board.

A camera device includes a lens assembly, a driver, and a photosensitive assembly. The driver drives the lens assembly. The photosensitive assembly is mounted to the lens assembly. The photosensitive assembly includes a filter, a photosensitive chip, a first circuit board, and a second circuit board. The first circuit board defines a first through hole. The photosensitive chip is received in the first through hole. The filter is fixed to a side of the first circuit board and covers the first through hole. The second circuit board is fixed to a side of the first circuit board facing away from the filter and is electrically coupled to the first circuit board. The photosensitive chip is electrically coupled to the second circuit board.

A camera device includes a lens assembly, a driver, and a photosensitive assembly. The driver drives the lens assembly. The photosensitive assembly is mounted to the lens assembly. The photosensitive assembly includes a filter, a photosensitive chip, a first circuit board, and a second circuit board. The first circuit board defines a first through hole. The photosensitive chip is received in the first through hole. The filter is fixed to a side of the first circuit board and covers the first through hole. The second circuit board is fixed to a side of the first circuit board facing away from the filter and is electrically coupled to the first circuit board. The photosensitive chip is electrically coupled to the second circuit board.

A camera device includes a lens assembly, a driver, and a photosensitive assembly. The driver drives the lens assembly. The photosensitive assembly is mounted to the lens assembly. The photosensitive assembly includes a filter, a photosensitive chip, a first circuit board, and a second circuit board. The first circuit board defines a first through hole. The photosensitive chip is received in the first through hole. The filter is fixed to a side of the first circuit board and covers the first through hole. The second circuit board is fixed to a side of the first circuit board facing away from the filter and is electrically coupled to the first circuit board. The photosensitive chip is electrically coupled to the second circuit board.

A light-emitting module includes a common carrier; a plurality of semiconductor devices formed on the common carrier, and each of the plurality of semiconductor devices including three semiconductor dies; a carrier including a connecting surface; a third bonding pad and a fourth bonding pad formed on the connecting surface; and a connecting layer. One of the three semiconductor dies includes a stacking structure; a first bonding pad; and a second bonding pad with a shortest distance less than 150 microns between the first bonding pad. The connecting layer includes a first conductive part including a first conductive material having a first shape; and a blocking part covering the first conductive part and including a second conductive material having a second shape with a diameter in a cross-sectional view. The first shape has a height greater than the diameter.

A semiconductor structure is disclosed. The semiconductor structure includes: a polymer base layer; a backside redistribution layer (RDL) over the polymer base layer; a molding layer over the backside RDL; a polymer layer over the molding layer; a front side RDL over the polymer layer; and a metal-insulator-metal (MIM) capacitor vertically passing through the molding layer, the MIM capacitor including a first electrode, an insulation layer and a second electrode, wherein the insulation layer surrounds the first electrode, and the second electrode surrounds the insulation layer, and the molding layer surrounds the second electrode. An associated method for manufacturing a semiconductor structure is also disclosed.

According to one embodiment, a semiconductor device includes a wiring board having a first surface. A first element is disposed on the first surface of the wiring board. A first resin layer covers the first element. A second element is larger than the first element and disposed on the first resin layer. The second element is superposed above the first element. A reinforcement member is disposed at a peripheral portion of the first resin layer and includes an edge disposed inside of the first resin layer. The reinforcement member has an upper surface above the first surface of the wiring board. The reinforcement member has a coefficient of linear expansion lower than the first resin layer. An encapsulating resin material, over the first surface of the wiring board, covers the first element, the second element, the first resin layer, and the reinforcement member.

An electronic device includes a substrate, a first conductive pad and a chip. The first conductive pad is disposed on the substrate. The chip includes a second conductive pad electrically connected to the first conductive pad, and the first conductive pad is disposed between the substrate and the second conductive pad. The first conductive pad has a first groove.

The embodiments described herein provide a device and method for an integrated white colored electromagnetic radiation source using a combination of laser diode excitation sources based on gallium and nitrogen containing materials and light emitting source based on phosphor materials. A violet, blue, or other wavelength laser diode source based on gallium and nitrogen materials may be closely integrated with phosphor materials, such as yellow phosphors, to form a compact, high-brightness, and highly-efficient, white light source. The phosphor material is provided with a plurality of scattering centers scribed on an excitation surface or inside bulk of a plate to scatter electromagnetic radiation of a laser beam from the excitation source incident on the excitation surface to enhance generation and quality of an emitted light from the phosphor material for outputting a white light emission either in reflection mode or transmission mode.