Embodiment relates to a semiconductor light emitting device for a display pixel and a display device including the same. A semiconductor light emitting device for a display pixel according to an embodiment includes a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, the first conductivity type semiconductor layer in the semiconductor light emitting device for a display pixel, a first contact electrode electrically connected to, a metal layer disposed under the first conductivity-type semiconductor layer, a second contact electrode disposed on the second conductivity-type semiconductor layer, and a passivation disposed on the light emitting structure may contain layers. The metal layer may include a magnetic material, and a weight ratio of the magnetic material to the weight of the semiconductor light emitting device may be 0.25% to 36.75%.

Integrated circuits may be assembled by placing a batch of integrated circuit (IC) die on a leadframe. Each of the IC die includes a magnetically responsive structure that may be an inherent part of the IC die or may be explicitly added. The IC die are then agitated to cause the IC die to move around on the leadframe. The IC die are captured in specific locations on the leadframe by an array of magnetic domains that produce a magnetic response from the plurality of IC die. The magnetic domains may be formed on the lead frame, or may be provided by a magnetic chuck positioned adjacent the leadframe.

The device and method according to the invention are used to transfer an electronic ferromagnetic component from a carrier to a substrate using a magnetic assembly. The magnetic assembly is designed and arranged to aid in the correct positioning of the at least partly ferromagnetic electronic component on the substrate. The magnetic field generated by the magnetic assembly produces a magnetic force oriented from the carrier towards the substrate, said magnetic force aiding the transfer of the component from the carrier to the substrate such that a significantly increased positioning accuracy of the component is achieved compared to a transfer without said magnetic force.

Discussed is a substrate chuck for allowing one surface of a substrate to be in contact with a fluid, the substrate chuck including a first frame having a hole at a central portion thereof; a second frame having a hole at a central portion thereof and disposed to overlap the first frame; and a frame transfer part configured to vertically move the second frame with respect to the first frame, wherein the first frame includes: a bottom portion at which the hole is formed; and a sidewall portion formed on a peripheral edge of the bottom portion, and wherein a height of the sidewall portion is greater than a depth at which the substrate is placed into the fluid.

The embodiment relates to a magnet unit of a semiconductor light emitting device for a display pixel and a self-assembly device using the same. A magnet unit according to an embodiment includes a magnet body and a magnet control unit disposed around an outer circumference of the magnet body. The magnet control unit includes a first magnet focusing unit spaced apart from an outer circumference of the magnet body and a first spacer disposed between the magnet body and the first magnet focusing unit.

The present disclosure relates to a display device using semiconductor light emitting devices and a fabrication method thereof, and the display device according to the present disclosure can include a plurality of semiconductor light emitting devices, a first wiring electrode and a second wiring electrode respectively extended from the semiconductor light emitting devices to supply an electric signal to the semiconductor light emitting devices, a plurality of pair electrodes disposed on the substrate, and provided with a first electrode and a second electrode configured to generate an electric field when an electric current is supplied, and a dielectric layer formed to cover the pair electrodes, wherein the first wiring electrode and the second wiring electrode are formed on an opposite side to the plurality of the pair electrodes with respect to the semiconductor light emitting devices.

Methods for orientation and placement of computing devices are presented. Aspects include applying, using a viscous material application device, a layer of a viscous material to a surface of an object, the layer of the viscous material having a plurality of computing devices disposed therein. The layer of the viscous material is allowed to dry during a drying period, wherein each of the plurality of computing devices comprises a first material applied to a first side of each of the plurality of computing devices, the first material having a first characteristic. And each of the plurality of computing devices comprises a second material applied to a second side of each of the plurality of computing devices, the second material having a second characteristic. And each of the plurality of computing devices is configured to perform, during the drying period, a self-orientation operation.

The invention describes a method of manufacturing an LED carrier assembly, which method comprises the steps of providing a carrier comprising a mounting surface with mounting pads arranged to receive a number of LED dies; embedding an alignment magnet in the carrier; providing a number of LED dies, wherein an LED die comprises a number of magnetic die pads; and aligning the magnetic die pads to the mounting pads by arranging the LED dies over the mounting surface of the carrier within magnetic range of the alignment magnet. The invention also describes an LED carrier assembly.

A method of aligning semiconductor dies having metallic bumps in a mold chase for further processing. A plurality of semiconductor dies are placed in the mold chase at approximately desired locations for further processing. A plurality of magnets in a retainer are associated with the mold chase, the plurality of magnets being associated with respective ones of the plurality of semiconductor dies. The magnetic field of the magnets is applied to align and hold the plurality of dies at the desired location. The plurality of magnets may be adjustably mounted in the retainer so that they can be adjusted to more precisely align the semiconductor dies at the desired locations.

Discussed is a device for self-assembling semiconductor light-emitting diodes, the device including an assembly chamber having a space for accommodating a fluid; and a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part.