Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.

An alignment carrier, assembly and methods that enable the precise alignment and assembly of two or more semiconductor die using an interconnect bridge. The alignment carrier includes a substrate composed of a material that has a coefficient of thermal expansion that substantially matches that of an interconnect bridge. The alignment carrier further includes a plurality of solder balls located on the substrate and configured for alignment of two or more semiconductor die.

A programmable circuit includes an array of printed groups of microscopic transistors or diodes. The devices are pre-formed and printed as an ink and cured. The devices in each group are connected in parallel so that each group acts as a single device. In one embodiment, about 10 devices are contained in each group so the redundancy makes each group very reliable. Each group has at least one electrical lead that terminates in a patch area on the substrate. An interconnection conductor pattern interconnects at least some of the leads of the groups in the patch area to create logic circuits for a customized application of the generic circuit. The groups may also be interconnected to be logic gates, and the gate leads terminate in the patch area. The interconnection conductor pattern then interconnects the gates for form complex logic circuits.

Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.

Discussed are a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; and a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part, wherein the vertical moving part provided at the substrate chuck lowers the substrate on to the fluid so that a force of buoyancy by the fluid is applied to the substrate.

Discussed is a substrate chuck including: a substrate support part for supporting a substrate having an assembly electrode; a vertical moving part which moves the substrate so that one surface of the substrate comes in contact with a fluid in a state in which the substrate is supported by the substrate support; an electrode connection part for applying power to the assembly electrode to generate an electric field so that semiconductor light-emitting diodes are placed at the predetermined positions of the substrate in a process of moving the semiconductor light-emitting diodes by a position change of at least one magnet; and a rotating part for rotating the substrate support part around a rotating shaft so that the substrate is placed in an upward or downward direction, wherein the rotating shaft is spaced apart from a center of the substrate support part at a predetermined distance.

A method for transferring a micro device includes: preparing a carrier substrate with the micro device thereon in which an adhesive layer is present between and in contact with the carrier substrate and the micro device; picking up the micro-device from the carrier substrate by a transfer head comprising a force-adjustable glue layer thereon; forming a liquid layer on a receiving substrate; reducing the grip force of the force-adjustable glue layer of the transfer head to be smaller than a force attaching the micro device to the receiving substrate; placing the micro device over the receiving substrate such that the micro device is in contact with the liquid layer and is gripped by a capillary force; and moving the transfer head away from the receiving substrate such that the micro device is detached from the transfer head and is stuck to the receiving substrate.

A method for transferring a micro device is provided. The method includes: preparing a carrier substrate with the micro device thereon, wherein an adhesive layer is between and in contact with the carrier substrate and the micro device; picking up the micro-device from the carrier substrate by a transfer head; forming a liquid layer on a receiving substrate; and placing the micro device over the receiving substrate by the transfer head such that the micro device is in contact with the liquid layer and is gripped by a capillary force; and moving the transfer head away from the receiving substrate such that the micro device is detached from the transfer head and is stuck to the receiving substrate.

A semiconductor package includes: a lower semiconductor chip including a first semiconductor substrate, which includes a first semiconductor device on an active surface thereof and a protrusion defined by a recess region on an inactive surface thereof opposite to the active surface, a plurality of external connecting pads on a bottom surface of the first semiconductor substrate, and a plurality of through-electrodes electrically connected to the plurality of external connecting pads; and at least one upper semiconductor chip stacked on the protrusion of the lower semiconductor chip and electrically connected to the plurality of through-electrodes, the at least one upper semiconductor chip including a second semiconductor substrate which includes a second semiconductor device on an active surface thereof.

A method for replacing an element of a display device includes: forming a structure with a first liquid layer between a first micro device and a conductive pad of a substrate in which the first micro device is gripped by a capillary force produced by the first liquid layer; evaporating the first liquid layer such that the first micro device is bound to the substrate; determining if the first micro device is malfunctioned or misplaced; removing the first micro device when the first micro device is malfunctioned or misplaced; forming an another structure with a second liquid layer between a second micro device and the conductive pad of the substrate in which the second micro device is gripped by a capillary force produced by the second liquid layer; and evaporating the second liquid layer such that the second micro device is bound to the substrate.