Devices and methods are disclosed for an optical component mounting system for supporting an optical component such as a laser. The mounting system comprises a first component comprising a first surface, a second component comprising a second surface facing the first surface, and adhesive between the first surface of the first component and the second surface of the second component, wherein the first component comprises at least three mounting pads extending from the first surface for contacting the second surface of the second component and providing direct support between the first component and the second component. The component comprising the mounting pads may be a lower mount, an upper mount such as an upper clamping mount, or a bonding pad or other component in the stack of components. A method of assembling the stack of components may comprise curing the adhesive at a temperature at or above an upper end of an expected temperature operating range for the optical component mounting system.

Devices and methods are disclosed for an optical component mounting system for supporting an optical component such as a laser. The mounting system comprises a first component comprising a first surface, a second component comprising a second surface facing the first surface, and adhesive between the first surface of the first component and the second surface of the second component, wherein the first component comprises at least three mounting pads extending from the first surface for contacting the second surface of the second component and providing direct support between the first component and the second component. The component comprising the mounting pads may be a lower mount, an upper mount such as an upper clamping mount, or a bonding pad or other component in the stack of components. A method of assembling the stack of components may comprise curing the adhesive at a temperature at or above an upper end of an expected temperature operating range for the optical component mounting system.

First block (10) includes internal flow path (15). A cooling medium flows inside internal flow path (15). Curved part (56) is provided at a corner between bottom surface (54) and side wall surface (55) of internal flow path (15). Curved part (56) is continuously connected to bottom surface (54) and side wall surface (55) of internal flow path (15) and has a curved shape.

Provided is a semiconductor laser device enabling efficient emission of a laser beam without damaging a light emitting surface of a light emitting element. Semiconductor laser device includes light emitting element, optical element, first heat radiation part, and second heat radiation part. Laser beam emitted from light emitting element enters optical element. First heat radiation part is connected to light emitting element. Second heat radiation part is connected to light emitting element. First heat radiation part includes first recess. Second heat radiation part includes second recess. One end of optical element is fitted into first recess, and the other end of optical element is fitted into second recess.

An optoelectronic component is provided that includes a radiation-emitting semiconductor chip, which emits electromagnetic radiation from a radiation exit surface during operation, a carrier comprising at least two first contact points, and a cover including at least two second contact points, wherein the at least two first contact points and the at least two second contact points are electrically conductively and/or thermally conductively connected to one another by a first plurality of nanowires and a second plurality of nanowires, and the nanowires provide a mechanically stable connection between the carrier and the cover. In addition, a method for producing an optoelectronic component is provided.

In various embodiments, laser devices feature means, such as fasteners, for attaching a laser package to a cooling plate, which allow motion of the laser package in response to thermal cycles resulting from operation of a beam emitter therewithin. Embodiments of the invention additionally or instead include laser devices featuring segmented barrier layers for electrically isolating the laser package from the cooling plate.

An apparatus for stacking and coating of very short cavity laser diode arrays. The apparatus includes an array holder fixture to securely hold the very short cavity laser diode arrays and spacer arrays, and a stacking plate. The array holder fixture including a top-side presser to secure a stack of very short cavity laser arrays and spacer arrays from a first end of the stack, a bottom-side presser to secure the stack of very short cavity laser arrays and spacer arrays from a second end of the stack, and a pair of side clamps. The array holder fixture is operatively coupled to the stacking plate during the stacking of the very short cavity laser diode arrays and spacer arrays.

An optical apparatus includes: an optical component opposed to and spaced apart from a light-emitting surface through which laser light is emitted; a case that houses a semiconductor laser element and the optical component and includes an introduction port for introducing gas and an exhaust port for exhausting the gas; and a flow passage section (i.e., a tubular body) including a spray port for spraying the semiconductor laser element with the gas introduced from the introduction port.

The present invention relates to an assembly of a temperature regulating device for a semiconductor laser.

The essence of the present invention is that a flat thermally conductive surface of said device is used as a thermally conductive base surface, the assembly further contains two fixing plates which are rigidly fastened to said thermally conductive base surface and adjoin the opposite lateral sides of a lower thermally insulated surface of a thermoelectric element, said surface being in contact with the thermally conductive base surface to prevent the longitudinal and transverse displacements of the thermoelectric element along the thermally conductive base surface, and a thermally conductive plate is rigidly fastened to the thermally conductive base surface and is thermally insulated therefrom.

A semiconductor laser device includes: a semiconductor laser element; a lower base provided with the semiconductor laser element; an upper base that is electrically insulated from the lower base, and sandwiches the semiconductor laser element together with the lower base; a lens that allows laser light that has exited from semiconductor laser element to enter, concentrates the laser light that has entered, and allows the laser light that has been concentrated to exit; and a holder that holds the lens. The holder is connected to the upper base.