Provided are a light emitting device capable of suitably shaping light from a plurality of light emitting elements, a manufacturing method for a light emitting device, and a distance measuring device.

A light emitting device of the present disclosure includes: a substrate; a plurality of light emitting elements provided on a first surface of the substrate; and a plurality of structure bodies provided on a second surface of the substrate and through which light emitted from the plurality of light emitting elements is transmitted. At least any of the structure bodies includes a first structure body through which a first portion of the light is transmitted and a second structure body having a function different from a function of the first structure body and through which a second portion of the light is transmitted.

An optical module includes a semiconductor optical device in which an active layer located at one side, an electrode located at the same side, and a mirror that reflects light toward the side opposite the electrode are monolithically integrated, a sub-mount having one surface on which a first wiring pattern is formed, a substrate in which an optical waveguide and a grating coupler are formed in a surface layer of the substrate, a spacer having an upper surface on which a second wiring pattern is formed, and a wire. The sub-mount is mounted on the spacer. The first wiring pattern on the sub-mount faces part of the second wiring pattern on the spacer and is electrically connected thereto. The second wiring pattern on the spacer includes a pad being disposed in a region exposed from the sub-mount and being bonded to the wire.

Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a light-emitting device are described. In one aspect, an apparatus comprises a non-metal base plate and a silicon-based cover element disposed on the base plate. The base plate is coated with a first electrically-conductive pattern that forms a first electrode. The base plate is further coated with a second electrically-conductive pattern that is electrically isolated from the first electrically-conductive pattern. The cover element holds the one or more light-emitting devices between the base plate and the cover element with at least a portion of a light-emitting surface of each of the one or more light-emitting devices exposed. The cover element is coated with a third electrically-conductive pattern that is in contact with the second electrically-conductive pattern to form a second electrode when the cover element is disposed on the base plate.

Disclosed herein are various embodiments for stronger and more powerful high speed laser arrays. For example, an apparatus is disclosed that comprises (1) a single laser emitting epitaxial structure that comprises a plurality of laser regions, each laser region of the single laser emitting epitaxial structure being electrically isolated within the single laser emitting epitaxial structure itself relative to the other laser regions of the single laser emitting epitaxial structure, and (2) an electrical waveguide configured to provide current to the laser regions.

[Problem] Provided are a light-emitting device that can reduce the influence of the amorphous layer of an optical member on the optical characteristics, a method for manufacturing the light-emitting device, and a distance measurement device.

[Solution] The light-emitting device of the present disclosure includes a light-emitting element and an optical member that transmits light emitted from the light-emitting element, the optical member having an oxide film deposited with a uniform thickness of less than 2 m on a surface on the exit side of the light.

A miniature structured light illuminator is provided. The miniature structured light illuminator uses a semiconductor surface emitting array including VCSEL or RC-LED array and an array of microlens elements to generate a wide range of structured light illumination patterns. The emission beam from a surface emitter array may be selectively directed, steered, focused or expanded, by applying a lateral displacement of the microlens array, such that centers of the emission beam and microlens array are misaligned. Emitted beams may be directed through small optical components to project the structured light pattern to a distant plane. The surface emitting arrays may be configured in addressable form to be activated separately for continuous or pulsed operation with very fast pulses having <100 ps risetime. A compact structured light illuminator module with projection optics is provided in very small physical size (663 mm.sup.3) suitable to configure in a handheld device.

A diffuser lens includes a first annular lens segment and a second annular lens segment. The first and the second lens segments are concentric. A refractive index of the first and second lens segments in a cross-section along a plane including an optical axis of the diffusor lens is described by a refractive index profile which varies in a direction perpendicular to the optical axis. The refractive index profile includes a first sub-profile, which describes the refractive index profile of the first lens segment, and a second sub-profile, which describes the refractive index profile of the second lens segment. The first sub-profile transitions to the second sub-profile at an interface. These first and second sub-profiles have slopes with opposite signs.

A laser device is disclosed. The laser device includes a surface-emitting laser including a plurality of emission points, a lens array including a plurality of lenses arranged so as to correspond to a position of the surface-emitting laser; and a light condensing optical system that condenses a plurality of light fluxes emitted through the lens array and enters the condensed lights to an input end of an optical fiber. The light condensing optical system includes an aspheric lens having positive refractive power. Both of an incidence surface and an emission surface of the aspheric lens have aspheric shapes.

An optoelectronic device includes a base layer, a functional area, a semiconductor element, and a encapsulation layer. The base layer has a first side and a second side opposite to the first side. The functional area is on the first side of the base layer. The semiconductor element is on the second side of the base layer. The semiconductor element includes a first electrode and a second electrode, and the semiconductor element corresponds to the functional area. The encapsulation layer is on the second side of the base layer to surround the semiconductor element. A portion of the first electrode and a portion of the second electrode are exposed out of the encapsulation layer.

An optoelectronic device includes a semiconductor substrate and an array of emitters disposed on the substrate. The array includes a first sub-array, having a first pitch, disposed in a peripheral area of the substrate, a second sub-array, also having the first pitch, disposed in a central area of the substrate, which is contained within the peripheral area, and a third sub-array, having a second pitch finer than the first pitch, interleaved with the second sub-array in the central area of the substrate. Conductors disposed on the substrate are configured to activate the first, second, and third sub-arrays selectively.