A light-emitting device 1 according to the present invention includes: a solid-state light-emitting element 10 that radiates laser light; and a wavelength converter 50 including plural types of phosphors which receive the laser light and radiate light. The phosphors included in the wavelength converter 50 are substantially composed of Ce.sup.3+-activated phosphors. The above-described light-emitting device includes at least a warm-color Ce.sup.3+-activated phosphor that receives the laser light and radiates light having a light emission peak within a wavelength range of 580 nm or more to less than 660 nm, and light-emitting components radiated by the phosphors are composed of only light-emitting components derived from Ce.sup.3+.

A monolithically integrated optical device. The device has a gallium and nitrogen containing substrate member having a surface region configured on either a non-polar or semi-polar orientation. The device also has a first waveguide structure configured in a first direction overlying a first portion of the surface region. The device also has a second waveguide structure integrally configured with the first waveguide structure. The first direction is substantially perpendicular to the second direction.

Fiber laser having a monolithic laser resonator having laser affected zones for providing laser beams having wavelengths below 800 nm and from between 400 nm to 800 nm. Methods of using femtosecond lasers to form fiber Bragg gratings, volume Bragg gratings, space gratings, and laser beam delivery patterns for changing the index of refraction within optical fibers.

A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.

A light-emitting device assembly includes an emitter array of light-emitting elements, a transparent substrate, a structured lens, and an angular filter. The emitter array emits from its emission surface output light that is transmitted through the substrate, and enables selective activation of and emission from individual elements or subsets of elements of the array. The structured lens is formed on or in the substrate, and comprises micro- or nano-structured elements resulting in an effective focal length less than an effective distance between the structured lens and the emission surface. The angular filter is positioned on or in the substrate or on the emission surface and exhibits decreasing transmission or a cutoff angle with increasing angle of incidence.

The present disclosure provides an apparatus for generating fiber delivered laser-induced dynamically controlled white light emission. The apparatus includes a laser diode unit for generating a laser electromagnetic radiation with a blue emission in a range from 395 nm to 490 nm that is delivered by an optical fiber. The apparatus further includes a dynamic phosphor unit configured to receive the laser exited from the optical fiber and controllably deflect a beam focused by a first optics sub-unit to a surface spot on a phosphor plate to produce a white light emission. Additionally, and the dynamic phosphor unit includes a second optics sub-unit configured to collect the white light emission and to project to a far field. Furthermore, the apparatus includes an electronics control unit comprising a laser diode driver and a MEMS driver for respectively control the laser diode unit and the dynamic phosphor unit in mutually synchronized manner.

A light-emitting semiconductor chip (100) is provided, having a first semiconductor layer (1), which is at least part of an active layer provided for generating light and which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).

A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).

In a manufacturing method of a semiconductor element of the present disclosure, a first semiconductor part (SL1) includes a protruding portion (TS) protruding toward an underlying substrate (UK), the protruding portion contains a nitride semiconductor, the protruding portion and the underlying substrate are bonded to each other, a semiconductor substrate (HK) includes a hollow portion (TK) located between the underlying substrate and the first semiconductor part, the hollow portion is in contact with a side surface of the protruding portion and communicates with the outside of the semiconductor substrate, and the protruding portion (TS) is irradiated with the laser beam (LZ) before the first semiconductor part is separated from the semiconductor substrate.

A metallic structure for an optical semiconductor device, including a base body having disposed thereon at least in part metallic layers in the following order; a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and a silver or silver alloy plated layer, wherein the silver or silver alloy plated layer has a thickness in a range of 0.001 μm or more and 0.01 μm or less.