According to one embodiment, there is provided a semiconductor device comprising a first differential amplifier circuit. The first differential amplifier circuit includes a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, and a sixth transistor. The second transistor's gate and drain are connected to the first transistor. The third transistor is diode-connected through the first transistor or diode-connected without passing through the first transistor. The fourth transistor is diode-connected through the second transistor or diode-connected without passing through the second transistor. The fifth transistor forms a first current mirror circuit with the third transistor. The sixth transistor is connected to a drain of the first transistor in parallel with the third transistor and forms a second current mirror circuit with the fifth transistor.

A low noise amplifier (LNA) includes a pair of n-type transistors, each configured to provide a first transconductance; a pair of p-type transistors, each configured to provide a second transconductance; a first pair of coupling capacitors, cross-coupled between the pair of n-type transistors, and configured to provide a first boosting coefficient to the first transconductance; and a second pair of coupling capacitors, cross-coupled between the pair of p-type transistors, and configured to provide a second boosting coefficient to the second transconductance, wherein the LNA is configured to use a boosted effective transconductance based on the first and second boosting coefficients, and the first and second transconductances to amplify an input signal.

Disclosed include methods and devices for enabling a battery free Bluetooth low energy communication. Some embodiments include a transmitter and a reference voltage generator supplying a voltage to an oscillator circuit. Further, some embodiments include an oscillator circuit including two pairs of semiconductor devices, wherein each pair of a semiconductor device includes a device with a gate node coupled to an antenna positive node interface (Vop) via a capacitor and a drain connected to an antenna negative node interface (Von) and a device with a gate node coupled to an antenna positive node interface (Von) via a capacitor and a drain connected to an antenna negative node interface (Vop). Additionally, some embodiments include an oscillator circuit connected to a common mode feedback circuit.

According to one embodiment, there is provided a semiconductor device comprising a first differential amplifier circuit. The first differential amplifier circuit includes a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, and a sixth transistor. The second transistor's gate and drain are connected to the first transistor. The third transistor is diode-connected through the first transistor or diode-connected without passing through the first transistor. The fourth transistor is diode-connected through the second transistor or diode-connected without passing through the second transistor. The fifth transistor forms a first current mirror circuit with the third transistor. The sixth transistor is connected to a drain of the first transistor in parallel with the third transistor and forms a second current mirror circuit with the fifth transistor.

In a particular implementation, an apparatus including first and second bias circuits and an inner amplifier provides sense amplifier offset cancellation. The inner amplifier includes: first and second current generators configured to replicate respective first and second currents from the first and second bias circuits, first and second transistors configured to transform the first and second currents into voltage samples, and first and second capacitors configured to store the voltage samples. In a sampling phase, a sampling of the first and second currents may be performed in the inner amplifier, and further, in an amplification phase, an amplification of the stored voltage samples may also be performed in the inner amplifier.

The apparatus relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long-Term Evolution (LTE). The disclosure relates to an apparatus including an electronic circuit for amplifying a signal. The apparatus includes a transceiver including an amplification circuit, and at least one processor coupled to the transceiver. The amplification circuit includes a first path to generate a first current corresponding to a voltage of an input signal, a second path to generate a second current corresponding to a voltage of the input signal, a separation unit to control each of the first current and the second current, a current mirror to generate a third current corresponding to the first current, and a folding unit to generate an output signal on the basis of the second current and the third current.

The invention provides a Low-voltage Differential Signaling (LVDS) receiver circuit that comprises a folded-cascode operational transconductance amplifier (OTA) that includes a pair of input branches and a pair of output branches. The pair of input branches of the folded-cascode OTA includes a p-channel metal-oxide semiconductor (PMOS) input transistor pair connected to a first supply voltage domain. The pair of output branches includes an output circuit connected to a second supply voltage domain. The LVDS receiver circuit further includes a common-mode feedback circuit connected to the pair of output branches of the folded-cascode OTA that controls the second supply voltage domain. The LVDS receiver circuit further includes a regenerative buffer circuit connected to the pair of output branches of the folded-cascode OTA and an output generated from the pair of output branches of the folded-cascode OTA directly operates the regenerative buffer circuit to produce a distortion-free output signal.

Disclosed include methods and devices for enabling a battery free Bluetooth low energy communication. Some embodiments include a transmitter and a reference voltage generator supplying a voltage to an oscillator circuit. Further, some embodiments include an oscillator circuit including two pairs of semiconductor devices, wherein each pair of a semiconductor device includes a device with a gate node coupled to an antenna positive node interface (Vop) via a capacitor and a drain connected to an antenna negative node interface (Von) and a device with a gate node coupled to an antenna positive node interface (Von) via a capacitor and a drain connected to an antenna negative node interface (Vop). Additionally, some embodiments include an oscillator circuit connected to a common mode feedback circuit.

In one example an amplifier includes a bias circuit, an open-loop gain stage including a first PMOS having a gate coupled to a first node, a source coupled to a second node, a drain coupled to a third node, and a bulk coupled to the bias circuit, a second PMOS having a gate coupled to a ground node, a source coupled to the second node, a drain coupled to a fourth node, and a bulk coupled to the bias circuit, a first NMOS having a drain and a gate coupled to the third node and a source coupled to a fifth node, a second NMOS having a drain coupled to the fourth node, a gate coupled to the third node, and a source coupled to the fifth node, an adjustable resistor coupleable between the third and fourth nodes, and a buffer stage coupled to the open-loop gain stage.

A semiconductor memory device includes a differential waveform shaping circuit including first and waveform shaping circuits connected in parallel. The first waveform shaping circuit has a first inverting amplifier, and two inverters connected in series. The first inverting amplifier inverts and differentially amplifies an input signal having a rectangular waveform. Then, the output of the first inverting amplifier is passed through the two inverters. The second waveform shaping circuit has a first inverter, a second inverting amplifier, and a second inverter connected in series. The second inverting amplifier inverts and differentially amplifies the output signal from the first invertor, and the second inverter inverts the output signal from the second inverting amplifier. The differential waveform shaping circuit generates an output signal by averaging the output signal from the first waveform shaping circuit and the output signal from the second waveform shaping circuit.