A computer-implemented system and method for search and navigation on a network to find and display specific search identified information in documents. Queries are sent to search engine services and responses comprising snippets are returned. Then, in response to only one or a few user inputs, documents are opened and locations of content matching or best matching the snippets are found reliably and distinguished in a display.

The invention relates to a covering (1) for an electronic component (e.g. of the MEMS, BAW, or SAW type). The covering comprises at least one layer (5, 6, 7) having a structure (19, 20, 21) with a number of prominences (8, 9, 15) and/or depressions (10, 11, 16). The invention furthermore relates to a method for producing a covering (1) of this type.

Embodiments of the invention include an acoustic wave resonator (AWR) module. In an embodiment, the AWR module may include a first AWR substrate and a second AWR substrate affixed to the first AWR substrate. In an embodiment, the first AWR substrate and the second AWR substrate define a hermetically sealed cavity. A first AWR device may be positioned in the cavity and formed on the first AWR substrate, and a second AWR device may be positioned in the cavity and formed on the second AWR substrate. In an embodiment, a center frequency of the first AWR device is different than a center frequency of the second AWR device. In additional embodiment of the invention, the AWR module may be integrated into a hybrid filter. The hybrid filter may include an AWR module and other RF passive devices embedded in a packaging substrate.

Provided are a chip packaging method and a chip packaging structure. A passivation layer is provided on a pad of a wafer, a first metal bonding layer is then formed on the passivation layer, a second metal bonding layer is formed on a substrate, the substrate and the wafer are bonded and packaged together through bonding of the first metal bonding layer and the second metal bonding layer, a first shielding layer is provided on the substrate, and the first shielding layer is connected to the second metal bonding layer; and after the wafer and the substrate are bonded, semi-cutting is performed on the wafer until the first metal bonding layer is exposed, and a second shielding layer is then formed, and the second shielding layer is electrically connected to the first metal bonding layer, such that an electromagnetic shielding structure jointly composed of the first shielding layer, the second metal bonding layer, the second shielding layer and the first metal bonding layer is obtained. The shielding structure is thus approximately closed, thereby improving the electromagnetic shielding effect.

At least three acoustic filters circuits FC are arranged on a single chip CH. At least two of them are electrically connected already on the chip for multiplexing. This reduces space consumption and leads to smaller device size.

A surface acoustic wave (SAW) device including a substrate is provided. Multiple surface acoustic wave elements are disposed on the substrate. A conductive surrounding structure includes: a wall part, disposed on the substrate and surrounding the surface acoustic wave elements; and a lateral layer part, disposed on the wall part. The lateral layer part has an opening above the surface acoustic wave elements. A cap layer covers the lateral layer part and closes the opening.

An acoustic wave device includes a piezoelectric substrate, a first band pass filter that is on the piezoelectric substrate and has a first pass band, and a second band pass filter that is on the piezoelectric substrate and has a second pass band at a higher frequency than the first pass band. The first and second band pass filters include resonators that include respective IDT electrodes. When a first total average metallization ratio is defined as an average of metallization ratios of all of the IDT electrodes included in the first filter and a second total average metallization ratio is defined as an average of metallization ratios of all of the IDT electrodes included in the second filter, the first total average metallization ratio is greater than the second total average metallization ratio.

A stacked AW filter package includes a first substrate stacked on a second substrate. The first substrate has a first AW filter circuit on first surface and a metal layer on a second surface. The second substrate has a second AW filter circuit disposed in a cavity between the metal layer of the first substrate and a third surface of the second substrate. The metal layer is coupled to the second AW filter circuit by a metal interconnect formed in a metallization layer on a side surface of the first substrate. The metal layer provides isolation to reduce cross-talk (e.g., electromagnetic interference) within the stacked AW filter package between the first AW filter circuit and the second AW filter circuit. Including the metal layer in the stacked AW filter package improves signal quality of transmitted and received signals filtered in the first and second AW filter circuits.

Content-specific URLs (CSURLs) are efficiently created to identify documents and intended visible content (Intended Content) within the documents that may be the whole of or only parts of the documents. The Intended Content of CSURLs can be affected, e.g. in the live web, by linkrot or content modification. Activation of CSURLs in conventional user agents (e.g. web browsers) results in automatic opening of underlying documents and/or offers to upgrade to a more capable user agent. Activation of CSURLs in a capable user agent result in automatic finding and distinguishing, e.g. by highlighting and scrolling, of matching content, which is robust in many circumstances wherein Intended Content has been non-trivially altered.

An acoustic wave device includes a piezoelectric layer, electrodes, a support substrate, a resin sheet, a metallic frame, and an inorganic sheet. The electrodes oppose each other in an intersecting direction that intersects a thickness direction of the piezoelectric layer. The support substrate includes a first cavity extending through the support substrate so as to overlap at least a portion of the electrodes as viewed in the thickness direction. The resin sheet is arranged on a surface of the support substrate opposite to the piezoelectric layer to close the first cavity. The metallic frame includes a second cavity therein and surrounds the piezoelectric layer and the electrodes. The inorganic sheet is arranged on a surface of the metallic frame opposite to the piezoelectric layer to close the second cavity.