After a contact component is disposed in a concave joint space, when a solder solidifies, the solder thickness of the solder in the joint space is kept. Thus, a contact area between the contact component and the solder is kept, and the solder thickness of the solder that joins the contact component and a conductive pattern is kept. In addition, since an appropriate amount of the solder is kept in the joint space, an extra amount of solder does not need to be applied in advance. As a result, there is prevented creeping up of the solder into a hollow hole of the contact component, caused by the heat applied when the contact component is joined to the conductive pattern.

A method for forming a power module package includes providing a power module including an electrical element and an electrical connection portion; providing an electrical connection terminal including a connection end, an extension portion and an end cap, wherein the extension portion is extended between the connection end and the end cap and has a hollow cavity therein; disposing the electrical connection terminal on the electrical connection portion for electrically connecting the connection end to a corresponding electrical connection portion; packaging the power module and the electrical connection terminal through an encapsulant to form a packaged body; removing a portion of a surface of the packaged body for exposing the end cap of the electrical connection terminal; and removing the end cap to expose the hollow cavity of the electrical connection terminal, so as to form the power module package.

A semiconductor package module is provided. The semiconductor package module may prevent dropout of a large-scale device from a module substrate by improving bonding strength between the module substrate and a part, and perform assembling parts on a top surface and a bottom surface of the module substrate, simultaneously. The semiconductor package module includes: a module substrate; at least one first electric/electronic device mounted on the module substrate by using surface mount technology (SMT); a plurality of passive devices mounted on the module substrate; and at least one second electric/electronic device mounted on the module substrate by using SMT and a resin film adhesive, the at least one second electric/electronic device having a size or a weight greater than a size or a weight of the at least one first electric/electronic device.

A wireless charging device includes a transmitter configured to transmit a power signal for wireless charging, a circuit board including at least one component configured to control an operation of the transmitter, a shielding plate configured to block an electrical interference between the transmitter and the circuit board, and a connector configured to penetrate through the circuit board and the shielding plate so as to electrically connect the transmitter with the at least one component.

A surface-mount connector includes, a connector body, connection terminals provided to the connector body that are placed on terminal solder portions on a surface of a circuit board, and a positioning portion provided to the connector body that includes a solder portion being press-fitted into a through-hole of the circuit board with the connection terminals placed on the terminal solder portions.

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

A switched capacitor converter package includes a semiconductor package on a first side of an electrical routing apparatus, a first capacitor and a second capacitor on a second side of the electrical routing apparatus, wherein the first capacitor and the second capacitor are adjacent to each other and connected in parallel, and a third capacitor and a fourth capacitor connected on the second side of the electrical routing apparatus, wherein the third capacitor and the fourth capacitor are adjacent to each other and connected in parallel.

A DC/DC converter includes N inductors and N power modules which correspond to N phases. At least one of the N power modules is mounted on a sub-mounting surface that is opposite to a main mounting surface of a printed circuit board.

A printed circuit board and an apparatus including the printed circuit board are described. The printed circuit board includes a plurality of layers; a footprint fabricated on an outer layer of the plurality of layers; a plurality of signal pins and a ground pin, wherein the plurality of signal pins and the ground pin are included in the footprint. The printed circuit board includes a ground guard including: ground pads, ground layers, and a set of vias. The vias are located on the ground pads and connect the ground layers. The vias are located between the ground pin and at least one signal pin of the plurality of signal pins in a direction parallel to a plane of the plurality of layers. A quantity of the vias is based on satisfying a signal integrity threshold associated with the at least one signal pin of the plurality of signal pins.

An electronic assembly contains a circuit board having a current-conducting current path with two mutually spaced-apart current path ends that form an interruption point and a contact clip bridging the interruption point. The contact clip is manufactured without a preload, as a thermal fuse. The contact clip has a multiply bent, open clip loop and a contact limb making contact with both mutually spaced-apart current path ends using solder. The contact clip further has a fixing limb with a limb end seated in a circuit board opening. The limb end of the fixing limb has an oversize relative to a circuit board opening, and a deformation being imparted to the contact clip, with an internal preload being generated.