A SD card is disclosed including an arrangement of interface pins enabling the SD card to be used in a combination connector having a slot configured to receive both SD cards and SIM cards. In examples, the SD card may include multiple rows and/or columns of interface pins configured at positions such that, when the SD card is inserted into a multi-card connector, the positions of the SD card interface pins do not overlap with the positions of SIM card contacts in the connector.

A cable socket connector assembly for an electronic system includes a socket assembly having a socket substrate including socket substrate conductors. The socket assembly has socket contacts extending between terminating ends and mating ends with the terminating ends terminated to corresponding socket substrate conductors and the mating ends configured to be terminated to corresponding package contacts of an electronic package of the electronic system. The cable socket connector assembly includes a cable assembly terminated to the socket assembly having an array of cables each having a cable conductor terminated to a corresponding socket substrate conductor. The socket contacts and the corresponding socket substrate conductors define electrical paths between the cable conductors of the cables and the package conductors of the electronic package.

A socket connector includes a socket assembly having a socket substrate and socket contacts. The socket substrate has first and second upper mating areas and a first lower mating area. The socket substrate has first and second socket substrate conductors at the first and second upper mating areas, respectively, and third socket substrate conductors at the first lower mating area electrically connected to corresponding first socket substrate conductors. The first socket substrate conductors are electrically connected to an electronic package, the second socket substrate conductors are electrically connected to an electrical component and the third socket substrate conductors are electrically connected to a host circuit board. The socket assembly is configured to electrically connect the electronic package with both the host circuit board and the electrical component. The socket contacts have a terminating end terminated to corresponding first socket substrate conductors and a mating end mated to package contacts.

A socket connector includes a socket substrate having first socket substrate conductors and second socket substrate conductors, receptacle contacts electrically coupled to corresponding first socket substrate conductors and socket contacts electrically coupled to corresponding second socket substrate conductors. The receptacle contacts have receptacles receiving pin contacts of an electronic package and the socket contacts have terminating ends and mating ends with deflectable spring beams terminated to package contacts of the electronic package. At least one of the first socket substrate conductors and the second socket substrate conductors are configured to electrically connect the electronic package with the host circuit board.

A socket connector includes a socket assembly having a socket frame, a socket substrate coupled to the socket frame and socket contacts terminated to the socket substrate. The socket substrate has first and second upper mating areas including first and second socket substrate conductors for mating with an electronic package and an electrical component, respectively. The socket contacts define an interface with the electronic package. The socket assembly is configured to electrically connect the electronic package with both a host circuit board and the electrical component.

A driver circuit carrier, a display panel, and a manufacturing method are provided. The driver circuit carrier includes a substrate, and a number of first pins arranged on at least one surface of the substrate. The first pins are arranged along a first reference line. An imaginary extending line of at least one of the first pins intersects with a second reference line perpendicular to the first reference line.

An electrical connector, used for being electrically connected with a chip module, includes a body, at least one protruding portion, a metal layer, and a plurality of terminals. The body is provided with a plurality of accommodating holes, and has an upper surface. The protruding portion protrudes upward from the upper surface, and an insulating portion is located on the protruding portion to support the chip module. The metal layer covers the upper surface and a periphery of the at least one protruding portion, and a portion of the metal layer located on the periphery of the at least one protruding portion is higher than a portion of the metal layer located on the upper surface. The terminals are accommodated in the accommodating holes and used to be conductively connected with the chip module.

Disclosed is a socket apparatus for ball grid array (BGA) balls, including a base member of electrically insulative material, a plurality of electrical contact members disposed in row and column configuration attached to the electrically insulative material, a plate member extending in a row direction, and a plurality of extension members connected to the plate member and configured to press BGA balls of a mounted BGA into the plurality of electrical contact members when the plate member is pulled in a first direction.

The present disclosure discloses an electronic element support frame, an electronic element assembly, and an electrical assembly. The electronic element support frame has a body, an isolative wall, and a pair of retaining parts. The body has an axial direction. The isolative wall is arranged to continuously extend along the axial direction of the body. The pair of retaining parts are arranged on the body and disposed at two sides of the isolative wall, respectively. The retaining parts together with the isolative wall enclose a pair of accommodating parts, respectively. The accommodating parts extend continuously along the axial direction of the isolative wall to accommodate pins of the electronic element, respectively. The electronic element support frame of the present disclosure can avoid erroneous contact between the pins of the electronic element, thereby enhancing safety performance.

An electrical connector, used for being electrically connected with a chip module, includes a body, at least one protruding portion, a metal layer, and a plurality of terminals. The body is provided with a plurality of accommodating holes, and has an upper surface. The protruding portion protrudes upward from the upper surface, and an insulating portion is located on the protruding portion to support the chip module. The metal layer covers the upper surface and a periphery of the at least one protruding portion, and a portion of the metal layer located on the periphery of the at least one protruding portion is higher than a portion of the metal layer located on the upper surface. The terminals are accommodated in the accommodating holes and used to be conductively connected with the chip module.