An inverter includes a DC input, a link capacitor including a plurality of input contacts fitted to a capacitor housing, a plurality of half-bridges, each including semiconductor switching elements for converting the DC current into an AC current having a plurality of phase currents, wherein the half-bridges are arranged in a row along a transverse direction to the inverter, a positive DC conductor rail and a negative DC conductor rail for the infeed of DC current to the half-bridges, wherein the positive and/or negative DC conductor rail extends in a transverse direction to the inverter over the row of half-bridges, such that the width of the positive and/or negative DC conductor rail extends to the width of the row of half-bridges, an AC conductor rail assembly for the output of AC current to the electric drive, and a cooler for cooling the half-bridges.

A power module structure includes a first metal layer, a second metal layer, a third metal layer and a fourth metal layer, wherein the fourth metal layer is connected to the second metal layer via a connecting bridge; at least one first switch including a first end connected to the third metal layer and a second end connected to the second metal layer; and at least one second switch including a third end connected to the fourth metal layer and a fourth end connected to the first metal layer; wherein the projection of the first metal layer and the projection of the third metal layer are overlapped to form a first overlapping area; wherein the direction of the current flowing through the first metal layer is opposite to the direction of the current flowing through the third metal layer.

The invention relates to a device having: —a circuit carrier board (3) and—a conductor element (2), which is designed to transfer an electric current from and/or to the circuit carrier board (3), characterized by: —an electrically conductive, elastically deformable, contoured, plate-like connection element (1), which connects the circuit carrier plate (3) to the conductor element (2) and is designed to create a local, dynamic resilience, as a result of which a force transmission (F) from the conductor element (2) to the circuit carrier plate (3) can be reduced, and—a plate thickness of the connection element (1) of at least 2 cm. The invention also relates to a power converter (4) and an aircraft (6) having such a device.

A power module having electrical connection parts, preferably made of metal, each having a main plate, the main plates extending in one and the same main plane so as to be substantially coplanar. At least one of the electrical connection parts includes at least one electrical connector projecting from its main plate. At least one transistor is electrically connected between two upper faces of respectively two of the main plates, and an electrically insulating overmolding, for example made of resin, covers each transistor and at least one portion of the upper faces of the main plates.

An inverter casing and a connection structure of an inverter and a junction box are provided. The inverter casing includes an upper casing with an inner side that is provided with a cavity for accommodating a circuit board, and an upper surface that is provided with a junction recess for accommodating a junction box that is fixedly installed in the junction recess. Moreover, a bottom part of the junction recess is provided with an elastic protrusion for connecting a high-voltage protection device, and two incoming terminals. The elastic protrusion cooperates with a knockout pin on the junction box for high-voltage power-off protection, and the two incoming terminals are connected with external cables via the junction box.

A power converter, includes a housing and a busbar arrangement, which is arranged inside the housing, wherein the power converter is designed to guide an alternating current along the busbar arrangement, the power converter also includes at least one planar flux-conducting element made of a magnetically highly permeable material, which is arranged between a wall of the housing and the busbar arrangement.

A power electronics device comprises a power semiconductor, a first circuit board controllingly connected to the power semiconductor, a lead frame connecting the power semiconductor and the first circuit board. The power semiconductor is connected to at least one contacting region of the lead frame in such a way that heat can be transferred from the power semiconductor to the lead frame and can be conducted away from the lead frame by the power semiconductor The power electronics device further comprises a housing , which borders at least regions of a fluid reservoir accommodating a coolant fluid. The power semiconductor and the lead frame are arranged in the fluid reservoir and are configured to transfer heat to the coolant fluid.

A power electronics module for an electrical drive machine of a motor vehicle includes multiple bus bars and a potting element supporting the bus bars such that they are spaced apart and electrically insulated from one another. Each bus bar is exposed in a first connection region and a second connection region, opposite the first connection region, for further contact with the environment of the potting element. The bus bars are provided with a sealing sheathing, applied separately to the potting element, on a longitudinal section between the two connection regions arranged in a common recess in the potting element made from a plastic material. The sealing sheathing adhered to the bus bar via a layer of adhesion agent. An electrical drive machine comprising said power electronics module, as well as a method of a power electronics module is provided.

A power module includes at least one power substrate; a plurality of power devices arranged on the at least one power substrate; and a power connector configured to be electrically connected to the plurality of power devices. The power connector includes a mechanically compliant fitting.

Electrical circuit device comprising a power electronics circuit with at least one power electronics module, a filter device, a heat sink, a connector and at least one busbar, wherein the filter device is at least partially coupled to the busbar and the busbar electrically connects the connector to the power electronics circuit, wherein the power electronics module and at least a portion of the busbar are thermally connected to the heat sink.