Provided is a step-down converter including: a step-down transformer including a primary-side coil and a secondary-side coil; a resin molded body integrally molded through use of a non-conductive resin together with the primary-side coil and the secondary-side coil; and a rectifier element, wherein the resin molded body has a mounting surface on which the rectifier element is to be mounted, wherein the secondary-side coil includes a first plate-shaped terminal, wherein the first plate-shaped terminal is exposed from the resin molded body in the mounting surface, wherein, on the mounting surface, a second plate-shaped terminal is provided in parallel to the first plate-shaped terminal across a gap, wherein the rectifier element is bonded to both of the first plate-shaped terminal and the second plate-shaped terminal by soldering, and wherein the non-conductive resin has a melting point higher than a melting point of the solder.

An object of the invention is to provide a power conversion device which secures insulation and is miniaturized still more without being affected by electromagnetic noises. A power conversion device according to the invention includes a power semiconductor module which converts a DC current into an AC current and includes a DC positive terminal and a DC negative terminal, and a resin cover portion which includes an insulating portion disposed between the DC positive terminal and the DC negative terminal. The cover portion holds a metal member which covers the DC positive terminal and the DC negative terminal.

In order to efficiently cool a heat-generating semiconductor element, it is desirable to cool a power semiconductor element from both surfaces. Therefore, in order to cool multiple power semiconductor elements, it is an effective way to alternately arrange a semiconductor component having the incorporated semiconductor element and a cooling device. A power conversion device for handling a high-power voltage needs to ensure pressure resistance between semiconductor elements or circuits inside the device. It is an effective way to seal the semiconductor component with a sealing material such as a silicone gel. Therefore, it is necessary to install the semiconductor component or the circuit having the incorporated semiconductor element, in a case from which a liquid silicone gel prior to curing does not leak even if the gel is injected. For these reasons, an object to be achieved by the invention is that the semiconductor element can be cooled from both surfaces by alternately arranging the semiconductor component having the incorporated semiconductor element and the cooling device. The above-described object can be achieved as follows. A substantially rectangular thin plate is subjected to mountain bending and valley bending so as to form a shape having as many recesses as the number of the mounted semiconductor components having the incorporated semiconductor element. Concurrently, a lateral side in a direction orthogonal to the above-described bending direction is bent so as to dispose the case in which all edges configuring an outer shape of the thin plate are arranged on substantially the same plane. The semiconductor component having the incorporated semiconductor element is arranged at a position serving as the recess of the case. The cooling devices are arranged so as to interpose the semiconductor component having the incorporated semiconductor element via the case. The semiconductor component having the incorporated semiconductor element is sealed with a silicone gel. In addition, preferably, the case is configured to include metal which has high heat conductivity. More preferably, the case is configured to include aluminum, copper, or an alloy whose principal components are both of these.

A power conversion apparatus includes: a power module that converts an input of alternating current power into direct current (DC) power and outputs the DC power; and a gate driver unit that includes a first substrate having mounted thereon a gate driver circuit component that isolates a control signal input from a control apparatus, that converts the isolated control signal into a gate signal for driving the power module, and that outputs the gate signal, a second substrate that includes a wiring conductor fixed to a gate control terminal of the power module, and a connection member that includes a connector that connects the first substrate and the second substrate to each other.

A connecting member for an inverter includes a support made of electrically insulating material, a first and a second conductive tracks anchored to said support. The support further includes one or more housings designed to contain a plurality of capacitors, provided with an opening for connection with said first and second conductive track.

An electronic module includes a first supporting element, a second supporting element, and a plurality of components arranged on the first supporting element and the second supporting element. The first supporting element and the second supporting element are electrically conductively connected, and the second supporting element forms an intermediate chamber in which the first supporting element is arranged.

An electronic module is provided with a housing with an inlet to conduct alternating current (AC) power and an outlet to conduct direct current (DC) power to charge a vehicle battery, the housing defining a cavity. A circuit board assembly is supported within the cavity to convert the AC power to DC power. At least two power distribution wires are connected between the circuit board assembly and the outlet. A base is supported by the housing and extends between the at least two power distribution wires and the circuit board assembly to shield the DC power from electromagnetic interference generated by the circuit board assembly. A plurality of walls extend transversely from the base and are spaced apart from each other to define at least two channels, each channel is sized to receive one of the at least two power distribution wires.

The present invention concerns an electronic device (1) comprising a housing (2) and at least one electronic component (Cx, Cy, L) which is arranged inside the housing (2), wherein the housing (2) is suitable for feedthrough of at least one bus bar (6a, 6b), wherein the housing (2) is compatible with bus bars (6a, 6b) of different shapes.

A device is provided for supplying electric power to electric and/electronic components of a power converter. The device includes at least one power module, at least one capacitor, at least one heat sink between the power module and the capacitor, a first DC conductor element having a first potential, and at least one additional, second DC conductor element having a second potential. The first and second DC conductor elements are configured to supply electric power to the power module and the capacitor. The first and second DC conductor elements extend coaxially to each other by the heat sink. The disclosure also relates to a power converter and an aircraft.

A power conversion unit is provided with a power conversion module performing conversion between direct current power and alternating current power, a first bus bar connected to the power conversion module and inputting and outputting the power, a chassis housing the power conversion module, and a terminal connecting the first bus bar and a second bus bar connected to an external device. The terminal and at least a part of the chassis are integrally formed of a resin.