A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The ceiling portion includes a resin material and a reinforcing material, and the cap member is formed such that the side wall portion and the ceiling portion are forming an accommodation space to accommodate an electronic component.

A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The side wall and ceiling portions are forming accommodation space to accommodate electronic component, the ceiling portion has a first surface facing the space and a second surface on the opposite side, the side wall portion has a third surface facing the ceiling portion, a fourth surface on the opposite side, a fifth surface facing the space, and a sixth surface on the opposite side, and the side wall portion is formed such that the sixth surface has a first inclined portion increasing distance to the space from the third toward fourth surfaces and a second inclined portion increasing distance to the space from the fourth toward third surfaces.

A shield cap for protecting an electronic component includes a cap member having a ceiling portion, a side wall portion and a partition wall portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The cap member is formed such that the ceiling portion has an inner region and an outer region surrounding the inner region, the side wall portion is supporting the outer region, and the partition wall portion is supporting the inner region, the ceiling portion has a first surface facing the side wall portion and the partition portion and a second surface on the opposite side and includes a reinforcing material positioned between the first and second surfaces, and the cap member is formed such that the side wall, ceiling and partition wall portions are forming multiple accommodation spaces to accommodate multiple electronic components.

Embodiments of the present disclosure describe a method of fabricating a multi-channel modulator driver with an enclosure. After a substrate is provided, components of a multi-channel modulator driver are attached to the substrate. Herein, the components include first components associated with a first channel and second components associated with a second channel. Next, an enclosure is attached to the substrate to cover the multi-channel modulator driver. The enclosure has a wall disposed between the first components and the second components, and a top region coupled with the wall. The enclosure and the wall are composed of an electrically conductive polymer. The wall includes a first portion that has the electrically conductive polymer covered by a metal film and a second portion that has the electrically conductive polymer not covered by the metal film.

A high-frequency module includes: a multilayer wiring board; a plurality of components mounted on an upper surface of the multilayer wiring board; a sealing resin layer laminated on the upper surface of the multilayer wiring board and sealing the plurality of components; a shield wall disposed within the sealing resin layer and between the predetermined components; and a surface layer conductor disposed between the upper surface of the multilayer wiring board and the shield wall so as to overlap the shield wall in a plan view of the multilayer wiring board. The shield wall is formed in a polyline shape having bent portions in the plan view, and has, at the bent portions, projection portions penetrating the surface layer conductor.

A shield can of a mobile terminal is provided. The shield can of the mobile terminal includes: at least one shield can installed in a main circuit board of the mobile terminal, and at least one separation wall formed between electronic elements in which electromagnetic interference occurs within the shield can. Hence, shield ability can be improved and simplified manufacturing process of the separation wall can reduce cost.

Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a magnetic mold resin formed of a composite magnetic material including a thermosetting resin material and a magnetic filler, the magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component; and a metal film connected to the power supply pattern and covering at least a top surface of the magnetic mold resin. A volume resistance value of the magnetic mold resin is equal to or larger than 10.sup.10, and a resistance value at an interface between the top surface of the magnetic mold resin and the metal film is equal to or larger than 10.sup.6.

An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. A protective layer, an antirust layer, and a shielding layer are sequentially mounted on the conductive paste. The EMI shielding device is mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.

An electronic device can include a circuit board, an electronic component mounted on the circuit board, a conductive contact disposed (e.g., deposited) on the circuit board, and a shielding polymer layer deposited over the electronic component. The shielding polymer layer includes a network of conductive pathways formed from sintered particles. The network of conductive pathways is electrically coupled to the conductive contact, which can be configured for connection to a power source ground. As such, the network of conductive pathways enables electromagnetic shielding of the electronic component.

A shielding film comprises multiple layers including one or more of a structured adhesive layer, an electrically conductive layer, an electrically insulative thermally conductive layer, and an electrically conductive adhesive layer. The electrically conductive shielding layer extends laterally beyond the structured adhesive layer. The electrically insulative thermally conductive layer is disposed between the electrically conductive shielding layer and the structured adhesive layer and is coextensive with the structured adhesive layer. The electrically conductive adhesive layer is disposed between the electrically conductive shielding layer and the thermally conductive layer and is coextensive with the electrically conductive shielding layer. When the multilayer shielding film is placed on an electronic device mounted on a circuit board and under application of one or more of heat, vacuum, and pressure, the multilayer shielding film conforms to the electronic device and the electrically conductive adhesive layer adheres to the circuit board providing a seal between the multilayer shielding film and the circuit board.