An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead frame. The solder dam includes one of a physical barrier to flow or an area of reduced wettability to the solder. The solder dam is between the solder joint and the circuit board. The solder dam is on one or both of a lead portion and main portion of the lead frame. In one embodiment, the first solder dam extends substantially the full width of the first lead portion. The solder dam may be a barrier and/or include a metal oxide. A method of manufacturing the device includes soldering a lead frame to a capacitor with a solder and modifying a surface on the lead frame to include a physical barrier and/or an area of reduced wettability.

A board unit of an embodiment includes a board, an electronic component, and a connection portion. The electronic component is on the board. The connection portion connects the board and the electronic component. The board includes a first surface, a hole, and a first electroconductive portion. The first surface faces the electronic component. The hole is on the first surface. The first electroconductive portion is on at least one of the first surface and an inner surface of the hole. The electronic component has a first terminal. The first terminal has an extension portion. The extension portion extends in a second direction intersecting a first direction. The second direction is a thickness direction of the board. The extension portion has at least a part inserted into the hole. The connection portion has electroconductivity. The connection portion is between the first electroconductive portion and the extension portion.

An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead frame. The solder dam includes one of a physical barrier to flow or an area of reduced wettability to the solder. The solder dam is between the solder joint and the circuit board. The solder dam is on one or both of a lead portion and main portion of the lead frame. In one embodiment, the first solder dam extends substantially the full width of the first lead portion. The solder dam may be a barrier and/or include a metal oxide. A method of manufacturing the device includes soldering a lead frame to a capacitor with a solder and modifying a surface on the lead frame to include a physical barrier and/or an area of reduced wettability.

Provided is a substrate terminal-equipped printed circuit board having configured to enable a substrate terminal to be fixed to a printed circuit board without using a pedestal, and to reduce the pressure and the insertion force applied to an inner surface of a through hole when the substrate terminal is press-fitted therein. A conducting portion of a substrate terminal includes: a press-fitted portion disposed at a proximal end portion thereof and is press-fitted into a through hole; and a loosely inserted portion that extends from the press-fitted portion to a distal end portion thereof, has a narrower width than the press-fitted portion, and is inserted into the through hole with a gap therebetween, and the press-fitted portion of the conducting portion is in pressure contact only with printed wiring provided on a surface layer of the printed circuit board and with an insulating layer located immediately below the printed wiring.

A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21a for a variety of components; a connection terminal 31 which is extended from the high heat radiation substrate 21 and bent in a direction perpendicular to a surface of the high heat radiation substrate 21; and a heat radiation piece section 35 which is integrally installed to the connection terminal 31.

A circuit board assembly may include a circuit board, a first electrical terminal, and a layer of solder paste. The circuit board may include a minimum thickness, a first side, and a second side opposite the first side. The first electrical terminal may include a solder tab. The layer of solder paste may be disposed on the first side of the circuit board. The solder tab of the first electrical terminal may extend into the first side of the circuit board but not beyond the second side of the circuit board.

The present invention provides a printed substrate having a novel structure in which substrate terminals can be fixed to the printed substrate without needing a base, and the substrate terminals can be press-fitted into through-holes without applying pressing force to printed wiring and a plating layer in the through-holes, and also provides a printed substrate with terminals that uses this printed substrate. A printed substrate includes through-holes into which the first end portions of substrate terminals are to be inserted. The through-holes each include press-fitting regions into which the first end portion of a substrate terminal is to be press-fitted, and conduction regions arranged so as to oppose the outer circumferential surfaces of the first end portion of the substrate terminal via gaps in directions perpendicular to the axis. Printed wiring is connected to the conduction regions, and a plating layer is adhered to the conduction regions.

An electrical conductor of a through-hole inductor includes a first section extending along a first side face of the magnetic core, a second section extending along a second side face of the magnetic core, and a third section connecting the first and second sections and extending through the magnetic core. A first straight lead extends downwards from the first section beyond the bottom main face of the magnetic core, and has an unbent distal end configured for through-hole mounting to a circuit board. A second straight lead extends downwards from the second section beyond the bottom main face, and also has an unbent distal end configured for through-hole mounting to the circuit board. The straight leads each have a height which allows for mounting of a power stage to the circuit board at least partly under the magnetic core.

A circuit board assembly may include a circuit board, a first electrical terminal, and a layer of solder paste. The circuit board may include a minimum thickness, a first side, and a second side opposite the first side. The first electrical terminal may include a solder tab. The layer of solder paste may be disposed on the first side of the circuit board. The solder tab of the first electrical terminal may extend into the first side of the circuit board but not beyond the second side of the circuit board.

The present invention provides a printed substrate having a novel structure in which substrate terminals can be fixed to the printed substrate without needing a base, and the substrate terminals can be press-fitted into through-holes without applying pressing force to printed wiring and a plating layer in the through-holes, and also provides a printed substrate with terminals that uses this printed substrate. A printed substrate includes through-holes into which the first end portions of substrate terminals are to be inserted. The through-holes each include press-fitting regions into which the first end portion of a substrate terminal is to be press-fitted, and conduction regions arranged so as to oppose the outer circumferential surfaces of the first end portion of the substrate terminal via gaps in directions perpendicular to the axis. Printed wiring is connected to the conduction regions, and a plating layer is adhered to the conduction regions.