Embodiments of wet clean chambers are provided herein. In some embodiments, a wet clean chamber includes: a deck plate; a substrate support that is rotatable and configured to support a substrate; a rotor disposed about and configured to rotate with the substrate support, wherein the rotor includes an upper fluid collection region disposed radially outward of the substrate support in position to collect fluid leaving the substrate support during processing, and wherein the upper fluid collection region includes a plurality of drain openings along a radially outward perimeter of a bottom of the upper fluid collection region; a stationary housing surrounding the rotor and having a lower fluid collection region disposed beneath the drain openings of the rotor; and one or more fluid delivery arms coupled to the deck plate and configured to deliver fluid to the substrate.

Provided is an apparatus for treating a substrate. The apparatus for treating a substrate may include: a liquid treating chamber configured to liquid-treat a substrate; and a controller configured to control the liquid treating chamber, and the liquid treating chamber may include a treating container having a treating space therein; a support unit configured to support and rotate the substrate in the treating space; a liquid supply unit configured to supply a liquid onto the substrate; and an elevation unit configured to adjust a relative height between the treating container and the support unit, and the controller may control the elevation unit so as to adjust the relative height between the treating container and the support unit according to a warpage state of the substrate supported on the support unit when conducting substrate treating by supplying the liquid onto the substrate while rotating the substrate.

Provided is an apparatus for treating a substrate. The apparatus for treating the substrate includes: a first process chamber having a first treating space therein; a second process chamber having a second treating space therein; and an exhaust unit configured to exhaust atmospheres of the first treating space and the second treating space, in which the exhaust unit includes an integrated exhaust line in which a pressure reduction unit is installed, a first exhaust line configured to connect the first process chamber and a first point of the integrated exhaust line, a second exhaust line configured to connect the first process chamber and a second point of the integrated exhaust line, and an interference alleviation unit configured to alleviate exhaust interference between the first process chamber and the second process chamber.

A substrate liquid processing apparatus A1 includes a processing tub 41 accommodating a processing liquid 43 and a substrate 8; a gas nozzle 70 discharging a gas into a lower portion within the processing tub 41; a gas supply unit 90 supplying the gas; a gas supply line 93 connecting the gas nozzle 70 with the gas supply unit 90; a decompression unit 95 introducing the processing liquid 43 within the processing tub 41 into the gas supply line 93 by decompressing the gas supply line 93; and a control unit 7 performing a first control of controlling the gas supply unit 90 to stop supply of the gas and controlling the decompression unit 95 to introduce the processing liquid 43 into the gas supply line 93 in a part of an idle period during which the substrate 8 is not accommodated in the processing tub 41.

A photovoltaic cell is proposed. The photovoltaic cell includes a substrate of semiconductor material, and a plurality of contact terminals each one arranged on a corresponding contact area of the substrate for collecting electric charges being generated in the substrate by the light. For at least one of the contact areas, the substrate includes at least one porous semiconductor region extending from the contact area into the substrate for anchoring the whole corresponding contact terminal on the substrate. In the solution according to an embodiment of the invention, each porous semiconductor region has a porosity decreasing moving away from the contact area inwards the substrate. An etching module and an electrolytic module for processing photovoltaic cells, a production line for producing photovoltaic cells, and a process for producing photovoltaic cells are also proposed.

Device (1) for displacing at least one assembly (2, 2′) between a provisioning zone (3) and a working zone (4) of at least one process chamber (5) of a process chamber apparatus (6) for soldering, in particular for reflow soldering, comprising at least one displacement device (7), wherein the at least one assembly (2, 2′) carries out, at least in sections, a displacement movement (9), or such a displacement movement (9) can be carried out, such that the at least one assembly (2, 2′) is displaced by means of a force (8), in particular pushing force, which is transmitted or generated by the displacement device (7), in particular directly, and acts on the assembly (2, 2′).

A photolithography apparatus includes a cleaning unit which cleans a target substrate, a drying unit which dries the target substrate provided from the cleaning unit, and a coating unit which forms a photoresist layer by coating a photoresist on the target substrate provided from the drying unit. The drying unit includes a first vacuum unit which performs a vacuum treatment on the target substrate.

A linearly moving mechanism includes an internal moving body provided within a case body and configured to be moved in a linear direction, the internal moving body being configured to move an external moving body connected to a connection member protruded from the case body through an opening formed at the case body; a seal belt extending in the linear direction and provided within the case body to close the opening, a first surface side of both end portions of the seal belt in a widthwise direction thereof facing an edge portion of the opening while being spaced apart therefrom; and a deformation suppressing member provided to face a second surface side of the both end portions to suppress deformation of the seal belt, the seal belt being connected to the internal moving body to be moved along with a movement of the internal moving body.

Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.

An apparatus for treating a substrate includes a chamber having a treating space formed therein, a substrate support unit that supports the substrate in the treating space, a plate that is located to face the substrate support unit in the treating space and that has a plurality of holes formed therein, a gas supply unit that supplies gas into the treating space through the holes, and a gas exhaust unit that exhausts the gas in the treating space through the holes.